• Title/Summary/Keyword: Annealing Test

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Characterization of Ultra Low-k SiOC(H) Film Deposited by Plasma-Enhanced Chemical Vapor Deposition (PECVD)

  • Kim, Sang-Yong
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.2
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    • pp.69-72
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    • 2012
  • In this study, deposition of low-dielectric constant SiOC(H) films by conventional plasma-enhanced chemical vapor deposition (PECVD) were investigated through various characterization techniques. The results show that, with an increase in the plasma power density, the relative dielectric constant (k) of the deposited films decreases whereas the refractive index increases. This is mainly due to the incorporation of organic molecules with $CH_3$ group into the Si-O-Si cage structure. It is as confirmed by FT-IR measurements in which the absorption peak at 1,129 $cm^{-1}$ corresponding to Si-O-Si cage structure increases with power plasma density. Electrical characterization reveals that even after fast thermal annealing process, the leakage current density of the deposited films is in the order of $10^{-11}$ A/cm at 1.5 MV/cm. The reliability of the SiOC(H) film is also further characterized by using BTS test.

RRR Behavior due to Fatigue Damage in NbTi Superconductor Cable (피로손상을 받은 NbTi초전도 선재의 RRR거동패동)

  • 신형섭;배영준;하동우;오상수
    • Progress in Superconductivity and Cryogenics
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    • v.3 no.1
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    • pp.1-5
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    • 2001
  • In order to investigate the effect of fatigue damage on the properties of RRR in this study. fatigue tests at room temperature and residual resistivity measurement tests at 12K were carried out using annealed 9 strand Cu-Ni/NbTi/Cu composite cables Through fatigue tests of NbTi composite cables. a conventional S-N curve could be obtained even though there existed a possibility of fretting among strands, From the resistivity measurement of a NbTi strand after fatigue test, it was found that the RRR of xii·gin strand for annealed cables was 3 times more than that for as-received one. With increasing of fatigue cycles at a sress amplitude level. the RRR decreased. which was resulted from the accumulation of damage such as lattice defects and dislocation within the Cu stabilizer.

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A Fracture Behavior of Connections of Structural Steel Members under Low Temperature (극한조건하 강구조 부재 이음부의 파괴거동해석)

  • 김두환;한석규;안세희
    • Journal of the Korean Society of Safety
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    • v.13 no.4
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    • pp.213-220
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    • 1998
  • Welding structures will be occurred sudden crack or failure by reduced fracture toughness in case of low temperature. To protect these unstable fracture is very important. Because fracture of welding part come from welding faults or residual stress, critical stress intensity factors are acquired at temperatures between $22^{\circ}C$ and $-70^{\circ}C$ from base metal, welding metal and H.A.Z. It was studied effectiveness of annealing and affection of residual stress under low temperatures. In case of fracture toughness test, it showed that fracture toughness value decreased, according to the decrease of temperature. Expecially In case that compressive residual stress was existed, $K_C$ increased.

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An online Calibration Algorithm using binary spreading code for the CDMA-based Adaptive Antenna Array

  • Lee, Chong-Hyun
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.20 no.9
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    • pp.32-39
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    • 2006
  • In this paper, an iterative subspace-based calibration algorithm for a CDMA-based antenna array in the presence of unknown gain and phase error is presented. The algorithm does not depend on the array geometry and does not require a prior knowledge of the Directions Of Arrival (DOA) of the signals. The method requires the code sequence of a reference user only. The proposed algorithm is based on the subspace method and root finding approach, and it provides estimates of the calibration vector, the DOA and the channel impulse response, by using the code sequence of a reference user. The performance of the proposed algorithm was investigated by means of computer simulations and was verified using field data measured through a custom-built W-CDMA test-bed. The data show that experimental results match well with the theoretical calibration algorithm. Also, teh study propose an efficient algorithm using the simulated annealing technique. This algorithm overcomes the requirement of initial guessing in the subspace-based approach.

Comparative study of some algorithms for global optimization (광역최적화 방법론의 비교 연구)

  • Yang, Seung-Ho;Lee, Hyeon-Ju;Lee, Jae-Uk
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 2006.11a
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    • pp.693-696
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    • 2006
  • Global optimization is a method for finding more reliable models in various fields, such as financial engineering, pattern recognition, process optimization. In this study, we compare and analyze the performance of the state-of-the-art global optimization techniques, which include Genetic Algorithm (DE,SCGA), Simulated Annealing (ASA, DSSA, SAHPS), Tabu & Direct Search (DTS, DIRECT), Deterministic (MCS, SNOBIT), and Trust-Region algorithm. The test functions for the experiments are Benchmark problems in Hedar & Fukushima (2004), which are evaluated with respect to efficiency and accuracy. Through the experiment, we analyse the computational complexity of the methods and finally discuss the pros and cons of them.

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Fabrication and Reliability Properties of Ni-Cr Alloy Thin Film Resistors (Ni-Cr계 합금을 이용한 박막저항의 제작 및 신뢰성)

  • Lee, Boong-Joo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.1
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    • pp.57-62
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    • 2008
  • From the progressing results, it was found that thin film using 52 wt% Ni - 38 wt% Cr - 3 wt% Al - 4 wt% Mn - 3 wt% Si target has good characteristics for low TCR (temperature coefficients of resistance) and high resistivity. The optimum sputtering condition was DC 250 W, 5 mtorr, and 50 sccm and the proper annealing condition was $350^{\circ}C$/3.5 hr in air atmosphere. At these fabricated conditions, thin film resistors with TCR values of less than ${\pm}10ppm/^{\circ}C$ were obtained. The TCR of the packaged-samples made at proper fabrication conditions was $-3{\sim}15ppm/^{\circ}C$ after the thermal cycling and $-20{\sim}180ppm/^{\circ}C$ after PCT (pressure cooker test), we could confirm reliability for the thin film resistor and find the need for enduring research about packaging method.

Plastic Deformation Behavior of Al6061 depending on Heat Treatment Condition (연속주조 Al6061 합금의 열처리에 따른 소성변형거동)

  • Park J. H.;Kwon Y. N.;Lee Y. S.;Lee J. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.127-130
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    • 2004
  • In the recent years, lightweight components fabricated with aluminum alloys have been applied into building the automobiles. Among the several competing fabrication methods, hot forging is taken as the most reliable technique to produce suspension parts such as control arms. Generally, Al forging products have been used widely for the aircraft building with the extruded stock as a starting material. For the economical base, however, the cast stocks turn to be as the forging stocks recently after a continuously casting technique was developed to produce quite a uniform microstructure enough to use for the forging process. Even more, there is a tendency to omit the homogenization step before forging, which is considered to be an indispensable process for all kinds of Al alloy, In the present study, a series of compression test was carried out to find out how the cast structure and the following heat treatments influence the deformation behavior, that is, forging characteristic.

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Characterization of Shape Memory Alloy Springs by Beat Treatment Condition (열처리 조건에 따른 형상기억합금 스프링의 특성변화)

  • Kim, Myung-Soon;Na, Seung-Woo;Lee, Sang-Hoon;Lee, Seung-Ki
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1985-1987
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    • 1996
  • Shape memory alloy springs have been fabricated and annealed at $400^{\circ}C$, $450^{\circ}C$ and $500^{\circ}C$ in atmosphere and in nitrogen gas. The optimal heat treatment condition in view of maximum generated force has been decided by the iso-thermal test with variation of annealing condition. Experimental results show that the heat treatment with high temperature in nitrogen gas is desirable for high generated force and can be used for the design of shape memory alloy springs.

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Rejuvenation Technologies for Hot Gas Path Components made of Nickel Based Superalloys (니켈기 초합금 소재 고온부 부품의 재생정비기술)

  • Kang, Sin-Ho;Choi, Heui-Sook;Kim, Dae-Eun
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.424-429
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    • 2003
  • Hot gas path components, which are made of nickel based superalloys, are subject to periodic replacement due to degradation of thermomechanical properties that might bring catastrophic failure during normal operation of gas turbine units. In order to rejuvenate the metallurgical condition of the serviced components, heat treating techniques such as solution annealing and aging heat treatments have widely been employed. However, the effectiveness of those typical heat treatments is not apparent enough in terms of quantitative grounds. On the other hand the demand of the rejuvenation heat treatment and hot isostatic pressing (HIP) have constantly been raised by the end users. Therefore it is necessary to verify how the typical heat treating techniques affect to the aged and degraded material. As the result of experimental work in this study, GTD-111 and GTD-222 Ni-based superalloys were collected and analyzed quantitatively through microscopic observation, microhardness evaluation and creep test.

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Influence of atmospheric air-holding time before air annealing on the secondary electron emission coefficient(${\gamma}$) from a MgO protective layer

  • 정진만
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.202-202
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    • 2000
  • AC-PDP(Plasma Display Paner)는 기체 방전을 이용한 디스플레이로서 기체에 직접 노출되는 MgO 보호막의 2차전자 방출계수(${\gamma}$는 AC-PDP의 방전특성을 결정짓는 중요한 요소이다. MgO 보호막의 이차전자 방출계수는 AC-PDP에 주입하는 기체의 종류, 결정 방향성과 표면오염상태 등에 영향을 받는다. 본 연구에서는 유리 기판위에 Al 전극을 증착, 에칭후 screen printing으로 유전체를 도포, 소성 한 21inch 규격의 test panel에 MgO 보호막을 E-Beam으로 5000$\AA$ 증착한 후 MgO 보호막을 대기에 노출되는 시간간격을 변수로 하여 대기 열처리 한 MgO보호막의 2차 전자방출계수를 ${\gamma}$-FIB(Focused Ion Beam) 장치를 이용하여 측정하였다. 그리고 대기 노출 간격은 1분, 5분, 20분으로 하여 2차 전자방출계수를 측정하였고, 2차전자방출계수 측정 시 가속전압은 50V에서 200V까지 변화를 주었으며, Ne+을 사용하여 1.2$\times$10-4Torr의 진공도를 유지하며 측정하였다. 또한 각각의 MgO막의 에너지 갭을 광학적 방법을 이용하여 구하였다.

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