• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of the Korean Geotechnical Society
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• v.20 no.6
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• pp.85-94
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• 2004

In the companion paper, a constitutive model was proposed in order to represent brittleness and dilatancy for cohesionless soils. An optimized design methodology was proposed on the basis of real-coded genetic algorithm in order to determine parameters fir the proposed model systematically. The material parameters were then determined by that algorithm. In order to verify the proposed model, triaxial tests were peformed under $K_0$ conditions for weathered soils. In addition, the results of istropic compressed triaxial tests for granular materials verified the proposed model. For those results the brittle stress-strain relationship and the dilatancy could be modeled reasonably by the proposed model. As a result it was found that the proposed model can appropriately represent the behavior on weathered soil and granular soil.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Structural Engineering and Mechanics
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• v.89 no.6
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• pp.557-570
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• 2024

Due to interfacial ageing, chemical action and interfacial damage, the interface debonding may appear in the interfaces of composite laminates. Particularly, the laminates display a side-dependent effect at small scale. In this work, a three-dimensional (3D) and anisotropic thick nanoplate model is proposed to investigate the effects of imperfect interface and nonlocal parameter on the bending deformation, vibrational response and buckling stability of one-dimensional (1D) hexagonal quasicrystal (QC) layered nanoplates. By combining the linear spring model with the transferring matrix method, exact solutions of phonon and phason displacements, phonon and phason stresses of bending deformation, the natural frequencies of vibration and the critical buckling loads of 1D hexagonal QC layered nanoplates are derived with imperfect interfaces and nonlocal effects. Numerical examples are illustrated to demonstrate the effects of the imperfect interface parameter, aspect ratio, thickness, nonlocal parameter, and stacking sequence on the bending deformation, the vibrational response and the critical buckling load of 1D hexagonal QC layered nanoplate. The results indicate that both the interface debonding and nonlocal effect can reduce the stiffness and stability of layered nanoplates. Increasing thickness of QC coatings can enhance the stability of sandwich nanoplates with the perfect interfaces, while it can reduce first and then enhance the stability of sandwich nanoplates with the imperfect interfaces. The biaxial compression easily results in an instability of the QC layered nanoplates compared to uniaxial compression. QC material is suitable for surface layers in layered structures. The mechanical behavior of QC layered nanoplates can be optimized by imposing imperfect interfaces and controlling the stacking sequence artificially. The present solutions are helpful for the various numerical methods, thin nanoplate theories and the optimal design of QC nano-composites in engineering practice with interfacial debonding.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.44 no.2
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• pp.141-147
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• 2024

In this study, micro CT images were used to confirm the tensile fracture strength according to the pore distribution characteristics of 3D printed concrete. Unlike general specimens, concrete structures printed by 3D printing techniques have the direction of pores (voids) depending on the stacking direction and the presence of filaments contact surfaces. Accordingly, the pore distribution of 3D printed concrete specimens was analyzed through quantitative and qualitative methods, and the tensile strength by direction was analyzed through a finite element technique. It was confirmed that the pores inside the 3D printed specimen had directionality, resulting in their anisotropic behavior. This study aims to analyze the characteristics of 3D concrete printing specimen and correlate them with simulation-based mechanical properties to improve performance of 3D printed material and structure.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.3
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• pp.123-131
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• 2007

The buckling behavior of a fiber reinforced plastic pipe was researched. When a cylindrical structure is made of isotropic material, it shows two dimensional buckled shape which has same deformed section along the longitudinal direction. But an anisotropic cylindrical structure shows three dimensional buckled shape which has different deformed section along the longitudinal direction. Because the modulus of elasticity is varied in a certain direction when ply angles are changed, the strength of a pipe are changed as ply angles are changed. In this study, the limitation of two dimensional and three dimensional buckling mode was investigated and the buckling strength of a laminated composite pipe was evaluated.

• Journal of the Korean GEO-environmental Society
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• v.1 no.1
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• pp.5-12
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• 2000

Mudstone, found Du-Ho Dong and around there in Po-Hang, is used as construction material. When it is exposed to the air and contacts with water, the strength is decreased rapidly and then it causes a lot of problems. In the field, clay soils with $K_o$ condition have anisotropic characteristics which behave differently according to the change of principal stress direction. In this study, $K_o$ consolidation is performed to make the completely weathered mudstone under the same conditions of construction place. Then, the triaxial compression test is performed at different shear velocity and anisotropy by sampling degree and the stress - strain behavior is shown the strain softening behavior. The stress - strain relationship from triaxial compression test is compared with the prediction value of Cam-clay model. From the results of tests, $K_o$ value decreases with the increase of sampling degree. Generally the behavior of $K_o$ consolidated specimen shows work-softening characteristic. The trend of behaviour of the measured is nearly to same to the predicted by Cam-clay model. But the measured value of deviator stress is very higher than the predicted. Therefore, Cam-clay model was not appropriate to the completely weathered mudstone consolidated with $K_o$ condition in Pohang region.

• Composites Research
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• v.12 no.5
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• pp.31-39
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• 1999

Glass-fiber reinforced polymeric composites provide the desitable properties of high stiffness and strength as well as specific weight. Hence, they have become some of the most important materials in several industries. These composites can be grouped into thermoplastic and thermoset composites, with thermoplastic composites having several advantages over thermoset composites in mechanical properties and processing. As a result, the study of the material behavior and forming techniques of such composites has attracted considerable attention in recent years. When the continuous fiber-reinforced polymeric composites are molded by flow molding, the molded parts leads to be nonhomogeneity and anisotropic because of the separation and orientation of fibers. As the characteristics of the products are greatly dependent on the separation, it is very important to clarify the separation in relarion to molding conditions, fiber mat structures and mold geometry. In this study, the effects of the mold geometry and the fiber mat structure on the compression moldability are studied using the cup-type molding.

• The Journal of Engineering Geology
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• v.33 no.4
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• pp.573-586
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• 2023

Joints or weak planes can induce anisotropy in the strength and deformability of fractured rock masses. Comprehending this anisotropic behavior is crucial to engineering geology. This study used plaster as a friction material to mold specimens with a single joint. The strength and deformability of the specimens were measured in true triaxial compression tests. The measured results were compared with three-dimensional numerical analysis based on the distinct element method, conducted under identical conditions, to assess the reliability of the modeled values. The numerical results highlight that the principal stress conditions in the field, in conjunction with joint orientations, are crucial factors to the study of the strength and deformability of fractured rock masses. The strength of a transversely isotropic rock mass derived numerically considering changes in the dip angle of the joint notably increases as the intermediate principal stress increases. This increment varies depending on the dip of the joint. Moreover, the interplay between the dip direction of the joint and the two horizontal principal stress directions dictates the strength of the transversely isotropic rock mass. For a rock mass with two joint sets, the set with the steeper dip angle governs the overall strength. If a rock bridge effect occurs owing to the limited continuity of one of the joint sets, the orientation of the set with longer continuity dominates the strength of the entire rock mass. Although conventional three-dimensional failure criteria for fractured rock masses have limited applicability in the field, supplementing them with numerical analysis proves highly beneficial.