• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.174-179
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• 2017

We designed the CMOS analog integrate and fire (I&F) neuron circuit for driving memristor based on resistive-switching random access memory (RRAM). And we fabricated the RRAM device that have $HfO_2$ switching layer using atomic layer deposition (ALD). The RRAM device has gradual set and reset characteristics. By spice modeling of the synaptic device, we performed circuit simulation of synaptic device and CMOS neuron circuit. The neuron circuit consists of a current mirror for spatial integration, a capacitor for temporal integration, two inverters for pulse generation, a refractory part, and finally a feedback part for learning of the RRAM. We emulated the spike-timing-dependent-plasticity (STDP) characteristic that is performed automatically by pre-synaptic pulse and feedback signal of the neuron circuit. By STDP characteristics, the synaptic weight, conductance of the RRAM, is changed without additional control circuit.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.9 no.1
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• pp.39-45
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• 2009

OFDM is used for achieving a high-speed data transmission in mobile wireless communication systems. Conventionally, fast Fourier transform that is the main signal processing of OFDM is implemented using digital signal processing. The DSP FFT LSI requires large power consumption. Current-mode FFT LSI with analog signal processing is one of the best solutions for high speed and low power consumption. However, for the operation of current-mode FFT LSI that has the structure of parallel-input and parallel-output, current-mode serial-to-parallel and parallel-to-serial converter are indispensable. We propose a novel current-mode SPC and PSC and full chip simulation results agree with experimental data. The proposed current-mode SPC and PSC promise the wide application of the current-mode analog signal processing in the field of low power wireless communication LSI.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.6
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• pp.28-36
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• 2008

This paper describes a low-power CMOS analog front-end block for UHF band RFID tag chips. It satisfies ISO/IEC 18000-6C and includes a memory block for test. For reducing power consumption, it operates with an internally generated power supply of 1V. An ASK demodulator using a current-mode schmitt trigger is proposed and designed. The proposed demodulator can more exactly demodulate than conventional demodulator with low current consumption. It is designed using a $0.18{\mu}m$ CMOS technology. Measurement results show that it can operate properly with an input as low as $0.25V_{peak}$ and consumes $2.63{\mu}A$. The chip size is $0.12mm^2$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.834-837
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• 2015

In this paper, we designed the FPGA hardware-based real-time ECG simulator, which generates an analog ECG signal within the range of 0 to 5 volts and described function. The ECG signal generated by the simulator can be applied to laboratory tests, the medical device, and the calibration study in various ways. ECG signals generated by simulator are obtained with conventional 24bit quantization to generate the signal data, and they are sampled and quantized to 1kHz of the 8-bit resolution when used as actual data. The proposed simulator is implemented using xilix Spartan-3 and data are transmitted through an RS-232 between the PC and the FPGA simulator. The transmitted data are stored in the memory and the stored data are printed out with the analog ECG signal through DAC (0808). It can also control the heart rate (HR) via the two buttons level UP-DOWN. We used existing ECG input rating for the evaluation of the designed system and evaluated differential circuit for obtaining QRS waveform and the output signal. We finally could obtained proper the result.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.245-252
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• 2003

We designed a silicon pressure sensor interface circuit with digital calibration capability. The interface circuit is composed of an analog section and a digital section. The analog section amplifies the weak signal from the sensor and the digital section handles the calibration function and communication function between the chip and outside microcontroller that controls the calibration. The digital section is composed of I2C serial interface, memory, trimming register and controller. The I2C serial interface is optimized to suit the need of on-chip silicon microsensor in terms of number of IO pins and silicon area. The major part of the design is to build a controller circuit that implements the optimized I2C protocol. The designed chip was fabricated through IDEC's MPW. We also made a test board and the test result showed that the chip performs the digital calibration function very well as expected.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.10A
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• pp.776-783
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• 2009

Current-cut circuit is an effective method to obtain low power consumption in wireless communication systems as high speed OFDM. For the operation of current-mode FFT LSI with analog signal processing essentially requires current-mode serial-to-parallel/parallel-to-serial converter with multi input and output structure. However, the Hold-mode operation of current-mode serial-to-parallel/parallel-to-serial converter has unnecessary power consumption. We propose a novel current-mode serial-to-parallel/parallel-to-serial converter with current-cut circuit and full chip simulation results agree with experimental data of low power consumption. The proposed current-mode serial-to-parallel/parallel-to-serial converter promise the wide application of the current-mode analog signal processing in the field of low power wireless communication LSI.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.1
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• pp.130-136
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• 2008

This paper describes a low-power high-performance analog front-end block for $UHF(860{\sim}960MHz)$ band RFID tag chips. It satisfies ISO/IEC 18000-6 type C(EPCgolbal class1. generation2.) and includes a memory block for test. For reducing power consumption, it operates with a internally generated power supply of 1V. An ASK demodulator using a current-mode schmitt trigger is proposed and designed. The proposed demodulator has an error rate as low as 0.014%. It is designed using a 0.18um CMOS technology. The simulation results show that the designed circuit can operate properly with an input as low as $0.2V_{peak}$ and consumes $2.63{\mu}A$. The chip size is $0.12mm^2$

• Smart Structures and Systems
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• v.6 no.5_6
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• pp.675-687
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• 2010

Structural Health Monitoring (SHM) is the science and technology of monitoring and assessing the condition of aerospace, civil and mechanical infrastructures using a sensing system integrated into the structure. Impedance-based SHM measures impedance of a structure using a PZT (Lead Zirconate Titanate) patch. This paper presents a low-power wireless autonomous and active SHM node called Autonomous SHM Sensor 2 (ASN-2), which is based on the impedance method. In this study, we incorporated three methods to save power. First, entire data processing is performed on-board, which minimizes radio transmission time. Considering that the radio of a wireless sensor node consumes the highest power among all modules, reduction of the transmission time saves substantial power. Second, a rectangular pulse train is used to excite a PZT patch instead of a sinusoidal wave. This eliminates a digital-to-analog converter and reduces the memory space. Third, ASN-2 senses the phase of the response signal instead of the magnitude. Sensing the phase of the signal eliminates an analog-to-digital converter and Fast Fourier Transform operation, which not only saves power, but also enables us to use a low-end low-power processor. Our SHM sensor node ASN-2 is implemented using a TI MSP430 microcontroller evaluation board. A cluster of ASN-2 nodes forms a wireless network. Each node wakes up at a predetermined interval, such as once in four hours, performs an SHM operation, reports the result to the central node wirelessly, and returns to sleep. The power consumption of our ASN-2 is 0.15 mW during the inactive mode and 18 mW during the active mode. Each SHM operation takes about 13 seconds to consume 236 mJ. When our ASN-2 operates once in every four hours, it is estimated to run for about 2.5 years with two AAA-size batteries ignoring the internal battery leakage.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.