• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.277-277
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• 2010

The capacity of the carbonaceous materials reached ca. $350\;mAhg^{-1}$ which is close to theorestical value of the carbon intercalation composition $LiC_6$, resulting in a relatively low volumetric Li capacity. Notwithstanding the capacities of carbon, it will not adjust well to the need so future devices. Silicon shows the highest gravimetric capacities (up to $4000\;mAhg^{-1}$ for $Li_{21}Si_5$). Although Si is the most promising of the next generation anodes, it undergoes a large volume change during lithium insertion and extraction. It results in pulverization of the Si and loss of electrical contact between the Si and the current collector during the lithiation and delithiation. Thus, its capacity fades rapidly during cycling. We focused on electrode materials in the multiphase form which were composed of two metal compounds to reduce the volume change in material design. A combination of electrochemically amorphous active material in an inert matrix (Si-M) has been investigated for use as negative electrode materials in lithium ion batteries. The matrix composited of Si-M alloys system that; active material (Si)-inactive material (M) with Li; M is a transition metal that does not alloy with Li with Li such as Ti, V or Mo. We fabricated and tested a broad range of Si-M compositions. The electrodes were sputter-deposited on rough Cu foil. Electrochemical, structural, and compositional characterization was performed using various techniques. The structure of Si-M alloys was investigated using X-ray Diffractometer (XRD) and transmission electron microscopy (TEM). Surface morphologies of the electrodes are observed using a field emission scanning electron microscopy (FESEM). The electrochemical properties of the electrodes are studied using the cycling test and electrochemical impedance spectroscopy (EIS). It is found that the capacity is strongly dependent on Si content and cycle retention is also changed according to M contents. It may be beneficial to find materials with high capacity, low irreversible capacity and that do not pulverize, and that combine Si-M to improve capacity retention.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.27-27
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• 2010

최근에 고유가와 지구온난화로 인하여 에너지가 향후 인류의 50년을 좌우할 가장 큰 문제로 대두되고 있어서 지구의 모든 에너지의 근원인 태양광을 이용하는 태양광 발전은 무한한 청정 에너지로 각광받고 있다. 빛을 흡수하여 전기에너지로 변환하는 태양전지는 풍력, 수소연료전지, 조력, 바이오에탄올 등의 신재생에너지 기술 중에서 상품성은 가장 뛰어나지만 발전단가가 가장 높은 것이 단점이다. 태양광 발전단가를 줄여서 기존의 화석에너지를 이용한 발전단가와 견줄 수 있는 그리드 패러티(grid parity)를 달성하려면 태양전지 모듈의 고효율화와 동시에 저가화가 반드시 이루어져야 한다. 현재 태양광 모듈 시장의 90%는 효율이 12-16% 정도로 높은 단결정(single crystalline or monocrystalline) 실리콘이나 다결정(polycrystalline or multicrystalline) 실리콘 등의 벌크(bulk)형 결정질 실리콘 모듈이 차지하고 있으나 원재료인 실리콘 웨이퍼의 제조단가의 50%를 차지하고 있어서 저가화가 어렵다. 반면, 원료가스를 분해하여 대면적 기판에 증착하는 박막(thin-film) 실리콘 태양전지의 경우는 차세대 태양전지로 각광받고 있다. 박막 실리콘 모듈은 매우 적은 실리콘 원재료를 소비한다. 단결정이나 다결정 실리콘 웨이퍼의 두께가 $180-250\;{\mu}m$ 정도인 것에 비해서 박막 실리콘의 두께는 $0.3-3\;{\mu}m$ 수준이다. 더불어, 유리, 플라스틱 등의 저가 기판에 저온 대면적 증착이 가능하여 저가양산화에 유리하다. 박막 실리콘 모듈은 벌크형 실리콘 모듈(-0.5%/K) 대비 낮은 온도계수[비정질 실리콘(amorphous silicon; a-Si:H)의 경우 -0.2%/K]와 빛의 세기가 약한 산란광에서도 동작하여 평균발전시간이 증가하므로 외부환경에서 우수한 발전성능을 보이고 있다. 태양전지 모듈은 상온에서의 안정화 효율을 기준으로 가격이 책정되어($/$W_p$) 판매되기 때문에 벌크형 실리콘 모듈에 비해서 박막 실리콘 모듈은 가격대 성능비가 우수하다. 따라서 박막 실리콘 모듈은 벌크형 결정 실리콘 모듈의 대안으로 떠오르고 있으며, 레이저 기술을 이용하여 수려한 투광형 건물일체형(building integrated photovoltaic; BIPV) 모듈을 제작할 수 있는 장점도 있다. 이러한 장점에도 불구하고 기존의 양산화된 단일접합 비정질 실리콘 태양광 모듈은 효율이 6-7%로 낮아서 설치면적 및 설치 모듈의 증가가 성장의 걸림돌이 되고 있다. 박막 실리콘 태양전지의 고효율화를 도모하기 위해서 적층형 탄뎀셀로 양산 트렌드가 변화하고 있다. 이에 적층형 박막 실리콘 태양전지 효율의 한계 및 돌파구에 대해서 논의한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.41-41
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• 2003

텅스텐(W)은 높은 thermal stability 와 process compatibility 및 우수한 corrosion r resistance 둥으로 integrated circuit (IC)의 gate 및 interconnection 둥으로의 활용이 대두되고 있으며, 차세대 thin film transistor liquid crystal display (TFT-LCD)의 gate 및 interconnection m materials 둥으로 사용되고 았다. 그러나, 이러한 장점을 가지고 있는 팅스텐 박막이 실제 공정상에 적용되가 위해서는 건식 식각이 주로 사용되는데, 이는 wet chemical 을 이용한 습식 식각을 사용할 경우 낮은 etch rate, line width 의 감소 및 postetch residue 잔류 동의 문제가 발생하기 때문이다. 또한 W interconnection etching 을 하기 위해서는 높은 텅스텐 박막의 etch rate 과 하부 layer ( (amorphous silicon 또는 poly-SD와의 높은 etch selectivity 가 필수적 이 라 할 수 있다. 그러 나, 지금까지 연구되어온 결과에 따르면 텅스탠과 하부 layer 와의 etch selectivity 는 2 이하로 매우 낮게 관찰되고 았으며, 텅스텐의 etch rate 또한 150nm/min 이하로 낮은 값을 나타내고 있다. 따라서 본 연구에서는 halogen-based inductively coupled plasma 를 이용하여 텅스텐 박막 식각시 여러 가지 첨가 가스에 따른 높은 텅스탠 박막의 etch rate 과 하부 layer 와의 높은 etch s selectivity 를 얻고자 하였으며, 그에 따른 식각 메커니즘에 대하여 알아보고자 하였다. $CF_4/Cl_2$ gas chemistry 에 첨 가 가스로 $N_2$와 Ar을 첨 가할 경 우 텅 스텐 박막과 하부 layer 간의 etch selectivity 증가는 관찰되지 않았으며, 반면에 첨가 가스로 $O_2$를 사용할 경우, $O_2$의 첨가량이 증가함에 따라 etch s selectivity 는 계속적으로 증가렴을 관찰할 수 있었다. 이는 $O_2$ 첨가에 따라 형성되는 WOF4 에 의한 텅스텐의 etch rates 의 감소에 비하여, $Si0_2$ 등의 형성에 의한 poly-Si etch rates 이 더욱 크게 감소하였기 때문으로 사료된다. W 과 poly-Si 의 식각 특성을 이해하기 위하여 X -ray photoelectron spectroscopy (XPS)를 사용하였으며, 식각 전후의 etch depth 를 측정하기 위하여 stylus p pmfilometeT 를 이용하였다.

• Current Photovoltaic Research
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• v.7 no.1
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• pp.9-14
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• 2019

Carrier selective solar cell structure has allured curiosity of photovoltaic researchers due to the use of wide band gap transition metal oxide (TMO). Distinctive p/n-type character, broad range of work functions (2 to 7 eV) and risk free fabrication of TMO has evolved new concept of heterojunction intrinsic thin layer (HIT) solar cell employing carrier selective layers such as $MoO_x$, $WO_x$, $V_2O_5$ and $TiO_2$ replacing the doped a-Si layers on either front side or back side. The p/n-doped hydrogenated amorphous silicon (a-Si:H) layers are deposited by Plasma-Enhanced Chemical Vapor Deposition (PECVD), which includes the flammable and toxic boron/phosphorous gas precursors. Due to this, carrier selective TMO is gaining popularity as analternative risk-free material in place of conventional a-Si:H. In this work hole selective materials such as $MoO_x$, $WO_x$ and $V_2O_5$has been investigated. Recently $MoO_x$, $WO_x$ & $V_2O_5$ hetero-structures showed conversion efficiency of 22.5%, 12.6% & 15.7% respectively at temperature below $200^{\circ}C$. In this work a concise review on few important aspects of the hole selective material solar cell such as historical developments, device structure, fabrication, factors effecting cell performance and dependency on temperature has been reported.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.6
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• pp.258-263
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• 2020

Silicon carbide (SiC) fibers mainly fabricated from polycarbosilane, a ceramic precursor, are applied as reinforcing materials for ceramic matrix composites (CMCs) because of their high temperature oxidation resistance, tensile strength, and light weight. In this study, continuous SiC fibers used to fabricate rope-type flexible heating elements capable of generating high-temperature heat (> 650℃). For high-efficiency heating elements, the resistance of SiC fiber rope was measured by 2-point probe method according to the cross-sectional area and length. In addition, the fabrication conditions of rope-type SiC fiber heating elements were optimized by controlling the oxygen impurities and the size of crystal grains present in the amorphous SiC fiber. As a result, the SiC fiber heating element having a resistance range of about 100~200 Ω exhibited an excellent power consumption efficiency of 1.5 times compared to that of the carbon fiber heating element.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.133-140
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• 2010

10 nm thick Ni layers were deposited on 200 nm $SiO_2/Si$ substrates using an e-beam evaporator. Then, 60 nm or 20 nm thick ${\alpha}$-Si:H layers were grown at low temperature (<$200^{\circ}C$) by a Catalytic-CVD. NiSi layers were already formed instantaneously during Cat-CVD process regardless of the thickness of the $\alpha$-Si. The resulting changes in sheet resistance, microstructure, phase, chemical composition, and surface roughness with the additional rapid thermal annealing up to $500^{\circ}C$ were examined using a four point probe, HRXRD, FE-SEM, TEM, AES, and SPM, respectively. The sheet resistance of the NiSi layer was 12${\Omega}$/□ regardless of the thickness of the ${\alpha}$-Si and kept stable even after the additional annealing process. The thickness of the NiSi layer was 30 nm with excellent uniformity and the surface roughness was maintained under 2 nm after the annealing. Accordingly, our result implies that the low temperature Cat-CVD process with proposed films stack sequence may have more advantages than the conventional CVD process for nano scale NiSi applications.

• Tribology and Lubricants
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• v.38 no.1
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• pp.8-14
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• 2022

Amorphous carbon (a-C) has excellent wear resistance and, therefore is used as a coating to protect numerous mechanical components to prolong their lifetimes. Among the a-C coatings, diamond-like carbon (DLC) and DLC-containing silicon (Si-DLC) receive extensive attention owing to their enhanced wear resistance and low frictional characteristics. In this study, the friction and wear characteristics of DLC and Si-DLC coatings are analyzed. For comparative analysis, DLC-coated and Si-DLC-coated vanes are utilized with the counterpart of a roller for the friction tests. Since the lubricated mechanical components are generally vulnerable to wear when a lubricant film does not form properly, friction tests are conducted under boundary lubrication conditions to promote wear. A cylinder-on-cylinder type tribometer is used to perform the friction tests with various normal load conditions. After the friction test, a 3D laser confocal microscope is used for quantifying the wear volume to calculate the wear rate of each specimen. Consequently, the DLC-coated specimen shows a lower coefficient of friction (COF) and wear rate than the specimen without the coating, while the Si-DLC coating shows a higher COF than the bare specimen. The results of this study are expected to contribute to improving the efficiency and reliability of compressors.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.72-72
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• 2001

Plasma polymerized thin films have been deposited on Si(lOO) substrates at $25-400^{\circ}C$ using thiophene ($C_4H_4S$) precursor by plasma assisted chemical vapor deposition (PACVD) method for low-dielectric device application. In order to compare physical properties of the as-grown thin films, the effects of the plasma power, gas flow ratio and deposition temperature on the dielectric constant and thermal stability were mainly studied. XRD and TED studies revealed that the as-grown thin films have highly oriented amorphous polymer structure. XPS data showed that the polymerized thin films that grown under different RF power and deposition temperature as well as different gas ratio of $Ar:H_2$ have different stoichiometric ratio of C and S compared with that of monomer, indicating a formation of mixture polymers. Moreover, we also realized that oxygen free and thermally stable polymer thin films could be grown at even $400^{\circ}C$. The results of SEM, AFM and TEM showed that the polymer films with smooth surface and sharp interface could be grown under various deposition conditions. From the electrical property measurements such as I-V and C-V characteristics, the minimum dielectric constant and the best leakage current were obtained to be about 3.22 and $10-11{\;}A/\textrm{cm}^2$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.400-406
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• 2024

Next-generation wide-bandgap semiconductors such as SiC, GaN, and Ga2O3 are being considered as potential replacements for current silicon-based power devices due to their high mobility, larger size, and production of high-quality wafers at a moderate cost. In this study, we investigate the gradual modulation of chemical composition in multi-stacked metal oxide semiconductor thin films to enhance the performance and bias stability of thin-film transistors (TFTs). It demonstrates that adjusting the Ga ratio in the indium gallium oxide (IGO) semiconductor allows for precise control over the threshold voltage and enhances device stability. Moreover, employing multiple deposition techniques addresses the inherent limitations of solution-processed amorphous oxide semiconductor TFTs by mitigating porosity induced by solvent evaporation. It is anticipated that solution-processed indium gallium oxide (IGO) semiconductors, with a Ga ratio exceeding 50%, can be utilized in the production of oxide semiconductors with wide band gaps. These materials hold promise for power electronic applications necessitating high voltage and current capabilities.

• The Journal of Korean Society for Radiation Therapy
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• v.25 no.1
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• pp.57-67
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• 2013

Purpose: Replacing the film which used to be used for checking the set-up of the patient and dosimetry during radiation therapy, more and more EPID equipped devices are in use at present. Accordingly, this article tried to evaluated the accuracy of the position check-up and the usefulness of dosimetry during the use of an electronic portal imaging device. Materials and Methods: On 50 materials acquired with the search of Korea Society Radiotherapeutic Technology, The Korean Society for Radiation Oncology, and Pubmed using "EPID", "Portal dosimetry", "Portal image", "Dose verification", "Quality control", "Cine mode", "Quality - assurance", and "In vivo dosimetry" as indexes, the usefulness of EPID was analyzed by classifying them as history of EPID and dosimetry, set-up verification and characteristics of EPID. Results: EPID is developed from the first generation of Liquid-filled ionization chamber, through the second generation of Camera-based fluoroscopy, and to the third generation of Amorphous-silicon EPID imaging modes can be divided into EPID mode, Cine mode and Integrated mode. When evaluating absolute dose accuracy of films and EPID, it was found that EPID showed within 1% and EDR2 film showed within 3% errors. It was confirmed that EPID is better in error measurement accuracy than film. When gamma analyzing the dose distribution of the base exposure plane which was calculated from therapy planning system, and planes calculated by EDR2 film and EPID, both film and EPID showed less than 2% of pixels which exceeded 1 at gamma values (r%>1) with in the thresholds such as 3%/3 mm and 2%/2 mm respectively. For the time needed for full course QA in IMRT to compare loads, EDR2 film recorded approximately 110 minutes, and EPID recorded approximately 55 minutes. Conclusion: EPID could easily replace conventional complicated and troublesome film and ionization chamber which used to be used for dosimetry and set-up verification, and it was proved to be very efficient and accurate dosimetry device in quality assurance of IMRT (intensity modulated radiation therapy). As cine mode imaging using EPID allows locating tumors in real-time without additional dose in lung and liver which are mobile according to movements of diaphragm and in rectal cancer patients who have unstable position, it may help to implement the most optimal radiotherapy for patients.