• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.330-331
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• 2006

Recently, plasma display panels (PDPs) are highlighted for the flat type display device. Therefore, much attention has been paid to secondary electron emission coefficient of the electrode protective material of PDPs. As PDPs is developing, the concern about secondary electron emission coefficient ($\gamma$) which is related with PDPs electrode protection material is increasing continually. So the concern about the way to how to measure secondary electron emission coefficient is on the rise. At present, the way to how to measure secondary electron emission coefficient is developed by some research groups, which is giving some research part's advance help. In this research, we have studied how to measure secondary electron emission coefficient which is related with various thin films more conveniently than previous measurement method. We studied the method of measurement of secondary electron emission coefficient (${\gamma}$) of amorphous silicon films by using Paschen's curve.

• 한국광물학회지
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• 제20권3호
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• pp.155-163
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• 2007

국내의 실리카 광물인 규질이암으로부터 실리콘알콕사이드와 같은 실리콘 유기화합물을 합성하였다. 이 실험에서는 알카리금속염 촉매 존재 하에서 트리에탄올아민과 규질이암의 반응에 의해 트리에탄올아민의 치환체인 트리스실라트라닐옥시에틸아민의 합성이 관찰되었다. 이 트리스실라트 라닐옥시에틸아민은 산성촉매인 발연황산의 존재 하에서 메탄올과의 반응으로 메톡시실란을 얻을수가 있었으며, 이 메톡시실란과 메탄올과의반응으로 테트라메톡시실란이 합성되었다. 반응의 중간 생성물 및 최종 산물은 FT-IR, XRD, SEM, 1H and 13C NMR 및 가스크로마토그래피에 의해 확인할 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.205-207
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• 2008

The new process for hybrid silicon thin film transistor (TFT) using DPSS laser has been developed for realizing both low-temperature poly-Si (LTPS) TFT and a-Si:H TFT on the same substrate as a backplane of active matrix liquid crystal display. LTPS TFTs are integrated on the peripheral area of the panel for gate driver integrated circuit and a-Si:H TFTs are used as a switching device for pixel in the active area. The technology has been developed based on the current a-Si:H TFT fabrication process without introducing ion-doping and activation process and the field effect mobility of $4{\sim}5\;cm^2/V{\cdot}s$ and $0.5\;cm^2/V{\cdot}s$ for each TFT was obtained. The low power consumption, high reliability, and low photosensitivity are realized compared with amorphous silicon gate driver circuit and are demonstrated on the 14.1 inch WXGA+ ($1440{\times}900$) LCD Panel.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1333-1336
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• 1998

Hydrogenated amorphous silicon(a-Si:H) films which were deposited by plasma enhanced chemical deposition(PECVD) have been recrystallized by the two-step rapid thermal annealing(RTA) employing the halogen lamp. The a-Si:H films evolve hydrogen explosively during the high temperature crystallzation step. In result, the recrystallized polycrystalline silicon(poly-Si) films have poor surface morphology. In order to avoid the hydrogen evolution, the films have undergone the dehydrogenation step prior to the crystallization step Before the RTA process, the active area of thin film transistors (TFT's) was patterned. The prepatterning of the a-Si:H active islands may reduce thermal damage to the glass substrate during the recrystallization. The computer generated simulation shows the heat propagation from the a-Si:H islands into the glass substrate. We have fabricated the poly-Si TFT's on the silicon wafers. The maximun ON/OFF current ratio of the device was over $10^5$.

• 전자공학회논문지 IE
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• 제43권2호
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• pp.11-15
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• 2006

FPD (flat panel display)의 능동구동 (active matrix) 방식의 플렉시블 디스플레이를 위해 PES의 플라스틱 기판위에 극저온 다결정 실리콘 박막 트랜지스터를 제작하였다. 상온에서도 박막의 증착이 가능한 RF 마크네트론 스퍼터링과 양질의 다결정 실리콘 박막을 얻을 수 있다고 알려진 XeCl 엑시머 레이져 열처리를 이용하였으며 모든 공정이 150$^{\circ}C$ 이하의 극저온에서 이루어졌다. 플라스틱 기판에 형성한 실리콘 박막 트랜지스터는 344 $mJ/cm^2$ 의 에너지 밀도에서 결정화 하였을 때 이동도 63.64$cm^2/V$ 로 기판에 회로를 집적할 수 있기에 충분한 특성을 얻을 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.389-392
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• 2009

Metal oxides have been proposed as an alternative channel material to hydrogenated amorphous silicon in thin film transistors (TFTs) because their higher mobility and stability make them suitable for transistor active layers. Thin films of indium zinc oxide (IZO) were deposited using a High Target Utilization Sputtering (HiTUS) system on various dielectrics, some of which were also deposited with the HiTUS. Investigations into bottom-gated IZO TFTs have found mobilities of 8 $cm^2V\;^1s^{-1}$ and switching ratios of $10^6$. There is a variation in the threshold voltage dependent on both oxygen concentration, and dielectric choice. Silica, alumina and silicon nitride produced stable TFTs, whilst hafnia was found to break down as a result of the IZO.

• The Korean Journal of Ceramics
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• 제5권2호
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• pp.142-147
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• 1999

The interaction between commercial $Si_3N_4$ powder and two types of additives (nitrate and oxide additives) during the sintering of $Si_3N_4$ was investigated. The nitrates solution or oxide particles were added as a sintering additives. The surface of mixed powder was observed with FT-IR, TG, and HREM. DTA was used to characterize the reactivity of the powders. The formation of crystalline phases and phase transformation were analyzed by XRD. The adsorption of the additives on the surface of silicon nitride was confirmed in the nitrate salts. It was shown that the adsorption occurred by interaction between the amorphous $SiO_2$ layer on the $Si_3N_4$ surface and metal cations $(Al^{3++\; and \;Y^{3+})$ and anions $(NO_3\;^-\; or\; OH^-)$, resulting in a higher degree of homogeneous distribution of additives.

• 한국세라믹학회지
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• 제49권6호
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• pp.523-527
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• 2012

Silicon carbide (SiC) has recently drawn an enormous amount of industrial interest due to its useful mechanical properties, such as its thermal resistance, abrasion resistance and thermal conductivity at high temperatures. In this study, RF thermal plasma (PL-35 Induction Plasma, Tekna CO., Canada) was utilized for the synthesis of high-purity SiC powder from an organic precursor (hexamethyldisilazane, vinyltrimethoxysilane). It was found that the SiC powders obtained by the RF thermal plasma treatment included free carbon and amorphous silica ($SiO_2$). The SiC powders were further purified by a thermal treatment and a HF treatment, resulting in high-purity SiC nano-powder. The particle diameter of the synthesized SiC powder was less than 30 nm. Detailed properties of the microstructure, phase composition, and free carbon content were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM), a thermogravimetric (TG) analysis, according to the and Brunauer-Emmett-Teller (BET) specific surface area from N2 isotherms at 77 K.

• 한국지구과학회지
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• 제22권3호
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• pp.208-222
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• 2001

이 연구는 전남 광양광산과 그 주변의 하천에 형성되어 있는 부유성 비정질 퇴적물의 지구화학적 특성을 밝히기 위해 수행되었다. 부유성 비정질 퇴적물의 주요성분은 Fe$_2$O$_3$이며, Fe$_2$O$_3$의 함량은 17.9${\cdot}$72.3wt.% 범위로 나타난다. Fe함량이 증가하면 Si, Al, Mg, Na, K, Mn 및 Ti 함량이 감소하며 Te, Au, Ga, Bi, Cd, Hg, Sb, 및 Se등의 함량은 증가한다. 하상 침전물인 비정질 퇴적물에는 As(최대 54.9ppm), Bi(최대 3.77ppm), Cd(최대 3.65ppm), Hg(최대64ppm), Sb(최대 10.1ppm), Cu (최대 37.1ppm), Mo(최대 8.86ppm), Pb(최대 9.45ppm) 및 Zn(최대 29.7ppm) 등의 중금속원소가 농집되어 있다. 황갈색 침전물에는 Au(최대 4.40ppm)와 Ag(최대 0.24ppm) 함량이 매우 높게 나타나며, Au함량은 하천의 상류지역에 높은 함량을 보이다가 하류지역으로 갈수록 그 함량이 감소한다. 반면에 Ag 함량은 상류지역의 하천에 낮은 함량을 보이다가 하류지역으로 갈수록 그 함량이 증가하여 나타난다. XRD분석에서 하상의 황갈색 침전물은 X-선회절선이 뚜렷하지 않은 비정질이거나 결정도가 미약한 철수산화물로 밝혀졌으며, 석영, 침철석, 고령토, 일라이트 등이 관찰된다. IR분석에서 비정질 하상 퇴적물은 OH기, H$_2$O, SO$_4$ 및 Fe-O 기에 의한 흡수밴드가 관찰된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.83-87
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• 2002

Plasma enhanced chemical vapor deposited (PECVD) silicon nitride ($SiN_X$) is widely used as a gate dielectric material for the hydrogenated amorphous silicon(a-Si:H) thin film transistors (TFT's). We investigated $SiN_X$ films were deposited PECVD at low temperature ($300^{\circ}C$). The reaction gases were used pure nitrogen and a helium diluted of silane gas(20% $SiH_4$, 80% He). Experimental investigations were carried out with the variation of $N_2/SiH_4$ flow ratios from 3 to 50 and the rf power of 200 W. This article presents the $SiN_X$ gate dielectric studies in terms of deposition rate, hydrogen content, etch rate and C-V, leakage current density characteristics for the gate dielectric layer of thin film transistor applications. Electrical properties were analyzed through high frequency (1MHz) C-V and current-voltage (I-V) measurements. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment.