• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.675-678
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• 2003

본 논문에서는 N-type 기판에서 Nickel-Silicide를 적용하였을 경우에 나타나는 문제점과 PAI (Pre-amorphization Implant)의 효과에 대하여 알아보았다. N-type 기판에 RTP (Rapid Thermal Process)를 통하여 Nickel-Silicide 를 형성하게 되는데, 여기까지는 안정한 Nickel mono-Silicide (NiSi)가 형성됨을 확인하였다. 하지만 후속 열처리 공정 후 심한 응집 현상 (Agglomeration)과 이상 산화 현상 (Abnormal Oxidation Phenomenon), Silicide Island 등 열안정성 (Thermal Stability) 측면에서 여러 가지 많은 문제점들이 나타났다. 이 후속 열처리의 열안정성 취약점들을 극복하는 방안으로 Ge 및 N₂ PAI를 적용하였다. PAI를 적용하였을 경우에는 그렇지 않은 경우에 비하여 고온 열처리 후에도 면저항이 비교적 잘 유지되었으며, 두께가 얇고 안정한 Nickel-Silicide 특성을 확보할 수 있었다. 특히 Ge PAI 에 비하여 N₂ PAI 의 경우가 보다 특성 개선 효과가 크게 나타났다.

• Korean Journal of Materials Research
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• v.6 no.8
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• pp.796-800
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• 1996

질소가스 분위기 중에서 Cu30V70 및 Fe30Cr70 혼합분말을 기계적 합금화 (MA)처리한 결과, 두 합금계에서 비정질화가 관찰되었다. 결정질에서 비정질상으로의 구조변화 과정을 Xtjs 회절 및 중성자 회절법에 의해 관찰되었다. 결정질에서 비정질상으로의 구조변화 과정을 X선 회절 및 중성자 회절법에 의해 관찰하였다. 그 결과, 이 합금계에서의 비정질화는 각 결정구조에서 전형적으로 존재하는 8면체 unit가 선택적으로 붕괴되어 4면체 unit로 변화되어 가는 과정임을 알 수 있었다. 또한, 중성자회절 결과로부터 질소원자는 금속원자로 이루어진 4면체의 중심에 위치하고 있음을 알 수 있었다.

• Korean Journal of Materials Research
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• v.24 no.11
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• pp.632-638
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• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• Journal of the Korean earth science society
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• v.35 no.6
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• pp.401-411
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• 2014

In order to enhance the Au Ag leach rate, a mechanochemical activation process and a mixed thiourea-thiocyanate solution has been applied to Au concentrate. To achieve mechanochemical activation, the Au concentrate was mechanically ground using a dry and a wet process. The results of a particle size distribution analysis and an XRD analysis, average particle size and crystallite size were much smaller in the dry-sample than in the concentrate sample. As well the size was smaller in the wet-sample than in the dry-sample. In SEM and XRD analysis, the amorphization effect was observed in the wet-sample due to mechanochemical activation. Au Ag leaching experiments were carried out with a thiourea solution, a thiocyanate solution and a mixed thiourea-thiocyanate solution. The Au Ag leach rate was much greater in the dry-ground-sample than in the concentrate sample, and the leach rate was greater in the wet-ground-sample than in the dry-sample. The Au Ag leach rate was much greater in the thiocyanate solution than in the thiourea solution, and the leaching rate was much greater in the mixed thiourea-thiocyanate solution than in the thiocyanate solution. Up to a 99% leach rate for Au Ag were only achieved in the wet-sample using the mixed thiourea-thiocyanate leaching solution.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.29-33
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• 2000

The amorphous tungsten nitrides, WNx, film could be fabricated by reactive sputtering process. The nitrogen concentration for the amorphization ranges from 10 at% to 40at%. The amorphous $W_{67}N_{33}$ film was crystallized into low resistivity $\alpha$-tungsten phase with equiaxed grains and excess nitrogen after the rapid thermal annealing for 1min at 1273K, which was similar to the resistivity of the sputtered pure tungsten film. The excess nitrogen was depleted from $\alpha$-tungsten crystals and then segregated at $\alpha$-tungsten/poly-Si interface. The segregated nitrogen has favored the formation of the homogeneous diffusion barrier layer comprised of silicon nitride, $Si_3N_4$, nano-crystals, which undertaken the inhibition of the high resistivity tungsten silicide reaction.

• Korean Journal of Materials Research
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• v.9 no.8
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• pp.787-791
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• 1999

TiB$_2$powders were prepared by mechanical alloying, and the effect of Zr and Ta substitution for Ti was investigated. It was possible to produce titanium diboride phase by mechanical alloying titanium and boron elemental powders for 280 hours. The amorphization reaction, a common process which occurs during mechanical alloying, has not been found. When zirconium of which atomic radius was larger than that of titanium was substituted for Ti, the alloying time was greatly reduced. On the contrary, substitution of tantalum for titanium prolonged the alloying time because of the less negative heat of formation of tantalum diboride than that of titanium diboride.

• Carbon letters
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• v.27
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• pp.18-25
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• 2018

In this study, graphene oxide(GO) was used as drug carriers to amorphize poorly watersoluble drugs via a co-spray drying process. Two poorly water-soluble drugs, fenofibrate and ibuprofen, were investigated. It was found that the drug molecules could be in the graphene nanosheets in amorphous or nano crystalline forms and thus have a significantly enhanced dissolution rate compared with the counterpart crystalline form. In addition, the dissolution of the amorphous drug enwrapped with the graphene oxide was higher than that of the amorphous drug in activated carbon (AC) even though the AC possessed a larger specific surface area than that of the graphene oxide. The amorphous formulations also remained stable under accelerated storage conditions ($40^{\circ}C$ and 75% relative humidity) for a study period of 14 months. Therefore, graphene oxide could be a potential drug carrier and amorphization agent for poorly water-soluble drugs to enhance their bioavailability.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.624-628
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• 2000

As a power durable-electrode in SAW filter, Al-1%Cu/tungsten nitride multi-layer thin film was fabricated by magnetron sputtering process. Tungsten nitride films had the amorphous phase at the nitrogen ratio, R, ranging from 10~40%. The amorphization could be controlled by nitrogen ratio, R= $N_2$/($N_2$+Ar) as a sputtering process parameter. Residual stress in tungsten nitride abruptly decreased with the formation of amorphous phase. Al-1%Cu thin film was deposited on the amorphous tungsten nitride. After the multi-layed thin film was annealed for 4 hours at 453K, the resistivity decreased as $3.6{\mu}{\Omega}-cm$, which was due to grain growth reduced crystal defects.

• Journal of Powder Materials
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• v.16 no.5
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• pp.363-369
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• 2009

The amorphization process and the thermal properties of amorphous Ti$_{40}$Cu$_{40}$Ni$_{10}$Al$_{10}$ powder during milling by mechanical alloying were examined by X-ray diffractometry (XRD), differential scanning calorimetry (DSC), and transmission electron microscopy (TEM). The chemical composition of the samples was examined by an energy dispersive X-ray spectrometry (EDX) facility attached to the scanning electron microscope (SEM). The as-milled powders showed a broad peak (2$\theta$ = 42.4$^{\circ}$) with crystalline size of about 5.0 nm in the XRD patterns. The entire milling process could be divided into three different stages: agglomeration (0 < t$_m$ $\leq$ 3 h), disintegration (3 h < t$_m$ $\leq$ 20 h), and homogenization (20 h < t$_m$ $\leq$ 40 h) (t$_m$: milling time). In the DSC experiment, the peak temperature T$_p$ and crystallization temperature T$_x$ were 466.9$^{\circ}C$ and 444.3$^{\circ}C$, respectively, and the values of T$_p$, and T$_x$ increased with a heating rate (HR). The activation energies of crystallization for the as-milled powder was 291.5 kJ/mol for T$_p$.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.163-163
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• 1999

MOSFET, MESFET 그리고 MODFET는 Logic ULSIs, high speed ICs, RF MMICs 등에서 중요한 역할을 하고 있으며, 그것의 gate electrode, contact, interconnect 등의 물질로는 refractory metal을 이용한 CoSi2, MoSi2, TaSi2, PtSi2, TiSi2 등의 효과를 얻어내고 있다. 그중 TiSi2는 비저항이 가장 낮고, 열적 안정도가 좋으며 SAG process가 가능하므로 simpler alignment process, higher transconductance, lower source resistance 등의 장점을 동시에 만족시키고 있다. 최근 소자차원이 scale down 됨에 따라 TiSi2의 silicidation 과정에서 C49 TiSi2 phase(high resistivity, thermally unstable phase, larger grain size, base centered orthorhombic structure)의 출현과 그것을 제거하기 위한 노력이 큰 issue로 떠오르고 있다. 여러 연구 결과에 따르면 PAI(Pre-amorphization zimplantation), HTS(High Temperature Sputtering) process, Mo(Molybedenum) implasntation 등이 C49를 bypass시키고 C54 TiSi2 phase(lowest resistivity, thermally stable phase, smaller grain size, face centered orthorhombic structure)로의 transformation temperature를 줄일 수 있는 가장 효과적인 방법으로 제안되고 있지만, 아직 그 문제가 완전히 해결되지 않은 상태이며 C54 nucleation에 대한 physical mechanism을 밝히진 못하고 있다. 본 연구에서는 증착 시 기판온도의 변화(400~75$0^{\circ}C$)에 따라 silicon 위에 DC/RF magnetron sputtering 방식으로 Ti/Si film을 각각 제작하였다. 제작된 시료는 N2 분위기에서 30~120초 동안 500~85$0^{\circ}C$의 온도변화에 따라 RTA법으로 각각 one step annealing 하였다. 또한 Al을 cosputtering함으로써 Al impurity의 존재에 따른 영향을 동시에 고려해 보았다. 제작된 시료의 분석을 위해 phase transformation을 XRD로, microstructure를 TEM으로, surface topography는 SEM으로, surface microroughness는 AFM으로 측정하였으며 sheet resistance는 4-point probe로 측정하였다. 분석된 결과를 보면, 고온에서 제작된 박막에서의 C54 phase transformation temperature가 감소하는 것이 관측되었으며, Al impuritydmlwhswork 낮은온도에서의 C54 TiSi2 형성을 돕는다는 것을 알 수 있었다. 본 연구에서는 결론적으로, 고온에서 증착된 박막으로부터 열적으로 안정된 phase의 낮은 resistivity를 갖는 C54 TiSi2 형성을 보다 낮은 온도에서 one-step RTA를 통해 얻을 수 있다는 결과와 Al impurity가 존재함으로써 얻어지는 thermal budget의 효과, 그리고 그로부터 기대할 수 있는 여러 장점들을 보고하고자 한다.