• 한국진공학회지
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• 제22권1호
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• pp.26-30
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• 2013

고유전율 절연체의 한 종류인 산화알루미늄 박막을 전자빔 증착법으로 형성하는 과정에서 산소 이온 빔의 조사를 이용, 산소 이온 빔 보조 증착 효과를 기대하였다. 산소 이온 보조 증착법으로 형성된 산화 알루미늄 박막의 두께 측정 결과, 높은 에너지에서의 이온 빔에 의한 식각 효과를 확인할 수 있었으며, 산소 이온 보조 증착 결과보다 높은 커패시턴스 값도 관찰할 수 있었다.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.329-334
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• 2008

Aluminum oxide films were deposited on n-type GaN substrates by RF magnetron sputtering technique for MIS devices applications using optimized conditions, Well-behaved C - V characteristics were obtained measured in MIS capacitors structures. The calculated interface trap density measured at $300^{\circ}C$ was about $9\times10^{10}/cm^2$ eV in the upper bandgap. The gate leakage current densities of the MIS structures were about $10^{-9}A/cm^2$ and about $10^{-4}A/cm^2$ measured at room temperature and at $300^{\circ}C$ for $a{\pm}1MV/cm$, respectively. These results indicate that the interface property of this structure is enough quality to MIS devices applications.

• 한국수소및신에너지학회논문집
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• 제29권5호
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• pp.434-441
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• 2018

The pore size of nickel (Ni) bottom electrode layer (BEL) for low-temperature solid oxide fuel cells embedded with ultrathin-film electrolyte was controlled by changing the substrate surface morphology and deposition process parameters. For ~150-nm-thick Ni BEL, the upper side of an anodic aluminum oxide (AAO) substrate with ~65-nm-sized pores provided ~1.7 times smaller pore size than the lower side of the AAO substrate. For ~100-nm-thick Ni BEL, the AAO substrate with ~45-nm-sized pores provided ~2.6 times smaller pore size than the AAO substrate with ~95-nm-sized pores, and the deposition pressure of ~4 mTorr provided ~1.3 times smaller pore size than that of ~48 mTorr. On the AAO substrate with ~65-nm-sized pores, the Ni BEL deposited for 400 seconds had ~2 times smaller pore size than the Ni BEL deposited for 100 seconds.

• 한국산학기술학회논문지
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• 제4권4호
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• pp.361-365
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• 2003

Oxide etcher장비에서 실리콘 웨이퍼를 잡고 공정을 수행할 수 있는 단극 (unipolar) 형태의 E-chuck을 제작하였다. 단극 형태의 E-chuck을 개발하기 위하여 핵심기술인 폴리이미드 박막의 코팅기술과 알미늄 표면의 양극처리기술을 개발하였다. E-chutk은 폴리이미드 재료를 표면 물질로 사용하여 플라스마에 의한 표면 손상을 최소화하였다. Oxide etcher 장비에 사용되는 핵심 부품인 E-chuck의 제조 과정을 살펴보고 히터 내장형 E-chuck을 위한 박막형 전열체 기술을 개발하였다.

• 한국전기전자재료학회논문지
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• 제14권8호
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• pp.675-678
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• 2001

We fabricated the organic light emittign diodes (OLEDs) with ITO/Cu-Pc/triphenyl-diamine (TPD)/TPD+tris-(8-hydroxyquinoline) aluminum (Alq$_3$)/Al. The electrical properties of Cu-Pc thin film were studied as a hole injection layer. the energy gap of Cu-Pc thin films is decreased according to the substrate heat treatment temperature increased. It could be controlled the hole mobility by changing the heat treatment condition of Cu-Pc. The emission wavelengths could be controlled by changing hole mobility and recombination zone in emission layer.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2010년도 춘계학술대회
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• pp.814-817
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• 2010

다공성 알루미나 나노틀은 2단계의 양극산화 과정에 의해 세공의 직경이 균일하며, 배열이 규칙적이며 나노틀에 완벽하게 수직으로 배향되어 있다. 게다가 세공의 직경과 세공간의 간격은 양극산화시 전압과 전해질등을 바꾸어 주면 쉽게 조절할 수 있다. 금속을 세공내에 전기 화학적으로 탐지하면 각 세공 내에 규칙적인 직경의 금속 나노선이 생성된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.209-212
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• 2001

Polyimide(PI) films have been considered as the interlayer dielectric materials due to low dielectric constant, low water absorption, high gap-fill and planarization capability. The PI film was etched with using inductively coupled plasma (ICP). The etching characteristics such as etch rate and selectivity were evaluated to gas mixing ratio. High etch rate was 8300$\AA$/min and vertical profile was approximately acquired 90$^{\circ}$ at CF$_4$/(CF$_4$+O$_2$) of 0.2. The selectivies of polyimide to PR and SiO$_2$ were 1.2, 5.9, respectively. The etching profiles of PI films with an aluminum pattern were measured by a scanning electron microscope (SEM). The chemical states on the PI film surface were investigated by x-ray photoelectron spectroscopy (XPS). Radical densities of oxygen and fluorine in different gas mixing ratio of 07CF4 were investigated by optical emission spectrometer (OES).

• 한국표면공학회지
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• 제35권2호
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• pp.122-128
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• 2002

This study was conducted to synthesize the diamond like carbon films by plasma enhanced chemical vapor deposition (PECVD). The effects of gas composition on growth and mechanical properties of the films were investigated. A little amount of hydrogen or oxygen were added to base gas mixture of methane and argon. Methane dissociation and diamond like carbon nucleation were enhanced by installing negatively bias grid near substrate. The deposited films were indentified as hard diamond like carbon films by micro-Raman spectroscopy. The surface and fractured cross section of the films which were observed by scanning electron microscopy showed that film growth is very slow as about 0.3$\mu\textrm{m}$/hour, and relatively uniform with hydrogen addition. Vickers hardness of tungsten carbide (WC) cutting tool increased from about 1000 to 1600~1800 by deposition of DLC film, that of commercial TiN coated tool was about 1270. In cutting test of aluminum 6061 alloy, DLC coated cutting tool showed 1/3 or lower crater and flank wear than TiN coated or non-coated WC cutting tools.

• 대한금속재료학회지
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• 제48권8호
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• pp.730-740
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• 2010

Aluminum, magnesium, titanium and high Mn steel are difficult to use in electron backscatter diffraction (EBSD) sample preparation due to the formation of an oxidation layer under conventional polishing. Alcohol-based polishing with colloidal silica suspension was introduced for these delicate samples. A hard particle-embedded sample was analyzed successfully using mechanical polishing. Ion-milling was effective in removing oxidized, deformed and transformed layers after mechanical polishing and was able to reduce artifacts significantly. The microstructure of a cross-section of a thin copper film was evaluated by attachment of a dummy to the film for mechanical polishing.

• 마이크로전자및패키징학회지
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• 제12권3호
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• pp.235-241
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• 2005

Incorporation of solid electrodes frequently involves plasma-based processing. The effect of plasma can influence the physical characteristics, depending on the magnitude in plasma. The undesired feature of plasma-induced damage should be prevented in characterizing the ultra-thin materials, such as ultra-thin films and organic monolayers. The current work at first proves the applicability of a liquid phase electrode in the electrical/dielectric properties through comparative work using Al and Hg on ultrathin $Al_2O_3$ films deposited through atomic layer deposition at low temperature: Two types of metals such as Aluminum (Al) and mercury (Hg) were used as electrodes in $Al_2O_3$ thin films in order to investigate the effect of electrode preparation on the current-voltage characteristics and impedance features as a function of thickness in $Al_2O_3$ film thickness. The success of Hg in $Al_2O_3$ thin films is applied to the AC and DC characterization of the organic monolayers obtained using the Langmuir-Blodgett method. From the DC current-voltage characteristics, the diode-like response is found to originate from the bulk response of the organic materials, evidenced by the fact and the capacitance is inversely related to the absolute thickness of organic layers.