• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.4-4
• /
• 2009

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.

• Transactions on Electrical and Electronic Materials
• /
• 제15권4호
• /
• pp.221-225
• /
• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• 대한기계학회논문집
• /
• 제18권3호
• /
• pp.729-737
• /
• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2002년도 춘계학술대회논문집
• /
• pp.477-482
• /
• 2002

This research is concerned with the study of an active vibration absorber using piezoelectric actuators and Isolation pad. The active isolation system consists of 4-pairs of PZT actuators bonded on the surface of an aluminum plate and a passive damping material. The active system is connected to the passive system in series. The Signals of the accelerometers are fed into the PZT actuator through the controller. We proposed a new control technique which can deal with the shock as well as the base excitation in this study. The Positive Acceleration Feedback(PAE) tuned to the natural frequency of the vibration isolation system is used to suppress the vibrations caused by the shock using the top accelerometer signal. The Negative Acceleration Feedback (NAF) based on the base acceleration signal is used to counteract the base motion. Experimental results show that the proposed active vibration isolation system can suppress vibrations.

• 한국정밀공학회지
• /
• 제16권7호
• /
• pp.94-100
• /
• 1999

This study adopted the ultra precision machining system which was composed of an air bearing spindle, a granite bed, air pad and a linear feeding mechanism. It also applied the cutting experiment on the aluminum alloy. To evaluate the safety of high speed machining, we examined the surface roughness according to the changes of cutting speed and obtained the speed limit. This paper also studied the effect of cutting condition such as feed rates and depths of cut on the surface roughness within the speed limit. This provided practical information regarding ultra precision machining.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.247-251
• /
• 2002

In this paper the maximum current carrying capability of ACAs flip chip joint is investigated based on two failure mechanisms: (1) degradation of the interface between gold stud bumps and aluminum pads; and (2) ACA swelling between chips and substrates under high current stress. For the determination of the maximum allowable current, bias stressing was applied to ACAs flip chip joint. The current level at which current carrying capability is saturated is defined as the maximum allowable current. The degradation mechanism under high current stress was studied by in-situ monitoring of gold stud bump-aluminum pad ACA contact resistance and also ACA junction temperature at various current level. The cumulative failure distributions were used to predict the lifetime of ACAs flip chip joint under high current stressing. These experimental results can be used to better understand and to improve the current carrying capability of ACA flip chip joint.

• 수산해양기술연구
• /
• 제32권4호
• /
• pp.457-464
• /
• 1996

The vibration damping of various multilayer damping sheet with different constraining layer and viscoelastic layer were investigated by Rheovibron and vibration test. Damping increased as dynamic loss tangent increased. Constrained type damping sheet showed better damping than extensional type damping sheet. Aluminum foil attached asphalt impregnated paper pad showed best damping.

• 항공우주시스템공학회지
• /
• 제14권3호
• /
• pp.51-59
• /
• 2020

초소형 위성인 큐브위성의 경우 위성체의 제한적인 중량 및 부피를 고려하여 경량화 및 전기적 회로설계 측면에서 유리한 PCB 기반의 전개형 태양전지판이 폭넓게 적용되고 있으나, PCB의 낮은 두께 방향 열전도율로 인해 태양전지셀의 방열이 어려운 점이 있다. 본 논문에서 제안한 6U 큐브위성용 태양전지판은 PCB 기반의 태양전지판으로 제작되고, 판넬 외곽에 장착된 알루미늄 보강재 접속부에 열전도 패드가 적용된다. 따라서 판넬 전면부의 태양전지셀에서 방열면인 판넬 후면으로 열전달이 원활하도록 하여 PCB 적용에 따른 장점을 유지하면서도 방열성능을 극대화함으로서 태양전지셀 온도 하강에 따른 전력생성효율 향상이 가능한 장점을 갖는다. 본 연구에서 제안된 열전도 패드가 적용된 태양전지판의 열제어 측면에서의 유효성 입증을 위해 궤도 열해석을 통해 기존 PCB 태양전지판과 비교 분석을 실시하였다.

• 대한기계학회논문집A
• /
• 제35권10호
• /
• pp.1229-1235
• /
• 2011

신뢰성이 가장 우수한 프레팅 피로손상 파라미터를 찾아내기 위해 알루미늄 합금 A7075-T6 을 대상으로 피로시험을 수행하였다. 시편 표면에 홈을 가공하여 패드 접촉압력에 따라 패드-시편 접촉면에서 프레팅 피로균열이 발생하거나 또는 홈에서 일반 피로균열이 발생할 수 있게 하였다. 광학현미경을 이용하여 균열의 발생위치와 방향을 측정하고, 문헌에서 가장 많이 사용되는 프레팅 피로손상 파라미터들의 신뢰성을 평가하였다. 파라미터 값과 최대손상평면 방향을 산출하는데 필요한 응력과 변형률 자료는 유한요소해석으로 산출하였다. 전단모드 피로파손을 가정하는 Fatemi-Socie 파라 미터와 McDiarmid 파라미터가 가장 신뢰성이 높은 것으로 판명되었다.

• 대한수의학회지
• /
• 제45권3호
• /
• pp.445-450
• /
• 2005

A 1.35 kg, three-year-old, female, Yorkshire terrier was referred to the veterinary medical teaching hospital of Chungnam National University with an alopecia, scale, polydipsia and polyuria. During hospitalization, the patient revealed swelling and pain of all four foot pads. The hematology indicated nonregenerative anemia. Blood serum chemistry revealed elevation of BUN, serum creatinine and phosphorus contents. Radiographs of feet revealed increased radiodensity in the soft tissue of the foot pad. In ultrasonographs of abdomen, kidneys showed diffusely echodense renal cortex with loss of the normal corticomedullary boundary. Fine needle aspiration of the swollen pad cysts contained a amorphous basophillic chalky, white and pasty material. The culture result was negative for bacteria. In conclusion, it was diagnosed as metastatic calcinosis circumscripta secondary to chronic renal failure. An oral charcoal absorbent and aluminum hydroxide were used to treat this condition. After six weeks treatment, hyperphosphatemia was corrected and metastatic calcinosis circumscriptawas not presented any more.