Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Defective Surface Analysis of Aluminum Bonding Pads for Au Wire Bonding

  • Son, Dong-Ju (Department of Electronic Engineering, Myongji University) ;
  • Ji, Yong-Joo (Department of Electronic Engineering, Myongji University) ;
  • Jeon, Yoon-Su (Department of Electronic Engineering, Myongji University) ;
  • Soh, Dae-Wha (Department of Electronic Engineering, Myongji University) ;
  • Hong, Sang-Jeen (Department of Electronic Engineering, Myongji University)
  • Published : 2009.11.12
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Abstract

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.

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