• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.897-899
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• 1992

This paper deals with the characteristics of Indium Tin Oxide(ITO) sputtered by the reactive magnetron sputtering process. ITO films have been grown at various substrate temperatures(R.T, 100$^{\circ}C$, 200$^{\circ}C$, 240$^{\circ}C$) and we used the target material of alloy of Indium and Tin. The electrical and optical properties of the ITO film have been investigated and the effect of magnetic field to the properties of ITO was studied. We have studied how much the improvement of transmission rate and sheet resistivity by heat treatment was. The sample with good electrical and optical properties can be obtained for the low substrate temperature of 200$^{\circ}C$-250$^{\circ}C$.

• Journal of Magnetics
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• v.13 no.2
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• pp.43-52
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• 2008

The objective of this paper is to review the magnetic and magneto-transport properties of Co/$Co_2TiSn$ consisting of two metallic magnetic phases that are antiferromagnetically exchange-coupled at the phase boundary. The bulk Co/$Co_2TiSn$ system, which has a $Co_2$TiSn Heusler alloy precipitates in the hexagonal Co matrix, showed an unusual coercivity change with a concurrent change in temperature, and was modeled on the basis of a wall formation caused by exchange coupling at the phase boundary. For measurements of magneto-transport properties, Co/$Co_2TiSn$ thin films that had two-magnet phases were deposited using a magnetron sputtering system with a composite target. The magnetization process in the films is also explained on the basis of the model of wall formation at the phase boundary. Annealed Co/$Co_2TiSn$ films showed a 0.12% GMR effect, indicating the scattering of polarized conduction electrons due to the antiparallel exchange coupling at the phase boundary. The scattering process of conduction electrons at the phase boundary was modeled with relation to the magnetization process.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1402-1405
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• 2006

Using a indium zinc oxide (IZO) alloy target with a ratio of 90:10 in wt%, highly transparent conducting oxide (TCO) thin films are prepared on polyethersulfone (PES) substrates by lowfrequency (LF) magnetron sputtering system. These films have amorphous structures with excellent electrical stability, surface uniformity and high optical transmittance. Experiments were carried out as a function of applied voltage. At optimal deposition conditions, thin films of IZO with a sheet resistance of 29 ohm/sq. and an optical transmission of over 82 % in the visible spectrum range were achieved. The IZO thin films fabricated by this method do not require substrate heating during the film preparation or any additional post-deposition annealing treatment.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.6
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• pp.398-404
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• 2000

The Ti-Al-V-N films have been deposited on various substrates by d.c and r.f reactive magnetron sputtering from a Ti-6Al-4V alloy target in mixed $Ar-N_2$ discharges. The films were investigated by means of XRD, AES, SEM/EDX, microhardness, TG and scratch test. The XRD and SEM results indicated that the films were of single B1 NaCl phase having dense columnar structure with the (111) preferred orientation. The composition of Ti-Al-V-N film was the Ti-7.1Al-4.3V-N(wt%) films. Adhesion and microhardness of Ti-Al-V-N films deposited by r.f magnetron sputtering method were better than those deposited by d.c magnetron sputtering method. The anti-oxidation properties of Ti-Al-V-N films were also superior to that of Ti-N film deposited by the same deposition conditions.

• Journal of Surface Science and Engineering
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• v.29 no.6
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• pp.824-828
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• 1996

Co-based alloy thin films ddeposited by fcing targets sputtering(FTS) were investigated for use in high-density magnetic recording media to determine how their magnetic properties are dependent on the sputtering conditions, and thus to find appropriate parameters that allow the sputtering and thin films to meet the specificiations for magnetic properties. FTS can discharge at lower working gas pressure than other sputtering methods such as dcmagnetron sputteing because the plasma is sufficiently confined by a magnetic field applied perpendicular to both of the target planes, which results in plasma-free substrates. Co-Cr-Ta films were deposited by FTS on glass and silicon substrates at substrate temperature between room temperature and $350^{\circ}C$, and at argon gas pressure between 0.1 and 10mTorr. The films were also deposited on polyimide tapes at substrate temperature of $130^{\circ}C$ and argon gas pressure of 1 mTorr. The effective advantages of Ta as an additional element were investigated, using the same films on the tapes. As a result of the experiment, it was found that better magnetic properties were obtained in the ranges of higher temperature and lower argon gas pressure with background pressure in thr range of $1.5 \times 10^{-6}$ Torr. Ta addition at 2 to 4 atomic percent almost havled the Co-Cr grain sizes, indicating that Ta addition at an appropriate atomic percent is effective for improving the microstructure and characteristics of Co-Cr films.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.1122-1126
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• 2017

KSLV-II ullage motor is a type of the separation motor of Korea Space Launch Vehicle. Simultaneously operates with the retro Motor to perform the stage separation. The internal ballistics design, application of propellant composition, and the design of the combustion chamber and the canted nozzle were performed in accordance with the target performance of the ullage motor. Ti-6Al-4V alloy was applied to the combustion as material of chamber and nozzle. The heat resistant material of the nozzle was selected to ensure the heat resistance of the propellant containing a large amount of aluminum. And the combustion performance of the ullage motor satisfying the KSLV-II requirements was secured by performing the ground combustion test.

• Journal of the Korean Ceramic Society
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• v.37 no.7
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• pp.686-692
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• 2000

Tin-doped In2O3 (ITO) films were fabricated using a d.c. magnetron reactive sputteirng of a In-10 wt% Sn alloy target in an Ar and O2 gas mixture. To understand the behavior of the carrier mobility in ITO films with O2 partial pressure, the resistivity, carrier concentration and mobility, film density, and intrinsic stress in the films were measured with O2 partial pressure. It was found experimentally that the carrier mobility increased rapidly as the film density increased. In the ITO film with the density close to theoretical one, the mean free path was the same as the columnar diameter. This indicated that the mobility in ITO films was strongly influenced by the crystall size. However, in the case where the film density was smaller than a theoretical density, the mean free paths were also smaller the columnar diameter. It was analyzed that the electron scattering at pores and holes within the crystalline was the major obstacle for electron conduction in ITO films. The measurement of intrinsic stress in ITO films also made it clear that the density of ITO films was controlled by the bombardment of oxygen neutrals on the growing film.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.52 no.2
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• pp.56-60
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• 2003

In this work, we have fabricated thin film resistors using the DC/RF magnetron sputter of 51wt%Ni-41wt%Cr-8wt%Si alloy target and studied the effect of the process parameters on the electrical properties. In fabrication process, sputtering power, substrate temperature and annealing temperature have been varied as controllable parameters. TCR decreases with increasing the substrate temperature, but TCR increases over 300 [$^{\circ}C$]. The films are annealed to 400 [$^{\circ}C$] in air atmosphere, TCR increases with increasing the annealing temperature. The resistivity was 172 [${\mu}{\Omega}{\cdot}cm$] and 209 [${\mu}{\Omega}{\cdot}cm$] for the RF and DC as a sputtering power sources, respectively. Also, TCR was -52 [$ppm/^{\circ}C$] and -25 [$ppm/^{\circ}C$]. As a results of them, it is suggested that the sheet resistance and TCR of thin films can be controlled by variation of sputter process parameter and annealing of thin film.

• Journal of Advanced Navigation Technology
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• v.17 no.5
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• pp.574-580
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• 2013

In this paper, The process of thin-film coating technology was applied to improve adhesion of the hardness thin film and nitride layer. This thin-film coating technology have formed composite thin-film to gain hardness and toughness used in press mold. The thin-film coating manufacturing technology increased vacuum present in the vacuum chamber and improved the throw ratio of the gun power using physical vapor deposition coating technology. Ti alloys target improved performance and surface material through the development of a composite film coating technology for various precision machining parts.

• Design & Manufacturing
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• v.16 no.2
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• pp.53-59
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• 2022

Unlike other press forming processes, ISF (Incremental sheet forming) doesn't require a punch and die set. However, during the ISF processes unwanted bending deformation occurred around the target geometry. This paper is aimed to analyze the effect of the die structure, which is supported by bolts, on the geometric accuracy of the ISF processes. In this research, the ISF processes with Al5052 sheet of 0.5 mm, the tool diameter of 6 mm and the stepdown of 0.4 mm was employed. L-shaped, step-shaped, relief-shaped geometry were employed in experiments. Sectional view and the plastic strain were compared. From this research we find out that the bolt supported ISF processes increases the geometric accuracy of products very effectively.