• Korean Journal of Materials Research
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• v.16 no.6
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• pp.341-345
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• 2006

[ $Ni_2Si$ ] mixed powders were mechanically alloyed by a ball mill and then processed by hot isostatic pressing (HIP) and spark plasma sintering (SPS). In the powder that was mechanically alloyed for 15minutes(MA 15 min), only Ni and Si were observed but in the powder that was mechanically alloyed for 30minutes(MA 30 min), $Ni_2Si$, Ni and Si were mixed together. Some of the MA 15 min powder and MA 30 min powder were processed by HIP under pressure of 150MPa at the temperature of $1000^{\circ}C$ for two hours and some of them were processed by SPS under pressure of 60 MPa at the temperature of $1000^{\circ}C$ for 60 seconds. Both methods completely compounded the powders to $Ni_2Si$. The maximum density of sintered lumps by HIP method was 99.5% and the maximum density of the sintered lump by SPS method was 99.3%. with the hardness of HRc 66 with the hardness of HRc 63. Therefore, the SPS method that can sinter in short time at low cost is considered to be more economical that the HIP method that requires complicated sintering conditions and high cost and the sintering can produce target materials in desired sizes and shapes to be used for thin film.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.699-707
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• 1995

The material that is both conductive in electricity and transparent to the visible ray is called transparent conducting thin film. It has many fields of application such as Solar Cell, Liquid Crystal display, Vidicon on T.V, transparent electrical heater, selective optical filter, and a optical electric device , etc. In the recent papers on several TCO( transparent conducting oxide ) material, the study is mainly focusing on ITO(indium tin oxide) because ITO shows good results on both optical and electrical properties. Nowaday, in the development of LCD(Liquid Crystal display), the low temperature process to reduce the production cost and to deposit ITO on polymer substrate (or low melting substrate) has been demanded. In this study, we prepared indium tin oxide(ITO) by a cylindrical DC magnetron sputtering with Indium-tin (9:1) alloy target instead of indium-tin oxide target. The resistivity of the film deposited in oxygen partial pressure of 5% and substrate temperature of 140.deg. C. is 1.6*10$\^$-4/.ohm..cm with 85% optical transmission in viaible ray.

• Design & Manufacturing
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• v.11 no.2
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• pp.15-19
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• 2017

Carbon fiber reinforced plastic (CFRP) is applied as structural material. CFRP is excellent in plane strength / stiffness and don't haves rust. Lightweight, rigid and robust at the same time as transportation material. Aluminum alloy and reinforcement material The application is increasing rapidly. In this study, the prototype of a semi - Monocoque structure frame, Longeron, Stringer, Skin of the aircraft, restraining the rigidity Clips of the aircraft was designated as the target product and the experiment was conducted. ln the experiment, (1) For CFRTP 3 points, data on heating, transfer, and cooling were measured using Thermo Couple, and optimum temperature required for flexible state was obtained. Heating was performed at a temperature 15% higher than the provided temperature. (2) By using a pneumatic press during molding, by dividing LH, center and RH according to the cooling time, thickness parameter of the target product due to the load is measured, and thickness control and time-deviations were analyzed and cross sections were observed with a low magnification microscope.

• Korean Journal of Materials Research
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• v.29 no.9
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• pp.532-541
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• 2019

Information and communication technologies are developing rapidly as IC chip size becomes smaller and information processing becomes faster. With this development, digital circuit technology is being widely applied to mobile phones, wireless LANs, mobile terminals, and digital communications, in which high frequency range of GHz is used. In high-density electronic circuits, issues of noise and EMC(Electro-Magnetic Compatibility) arising from cross talk between interconnects or devices should be solved. In this study, sheet-type electromagnetic wave absorbers that cause electromagnetic wave attenuation are fabricated using composites based on soft magnetic metal powder and silicon rubber to solve the problem of electromagnetic waves generated in wireless communication products operating at the frequency range of 2.4 GHz. Sendust(Fe-Si-Al) and carbonyl iron(Fe-C) were used as soft magnetic metals, and their concentrations and sheet thicknesses were varied. Using soft magnetic metal powder, a sheet is fabricated to exhibit maximum electromagnetic attenuation in the target frequency band, and a value of 34.2dB(99.9 % absorption) is achieved at the target frequency.

• Nuclear Engineering and Technology
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• v.55 no.6
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• pp.2139-2146
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• 2023

During reactor operation, the divertor must withstand unprecedented simultaneous high heat fluxes and high-energy neutron irradiation. The extremely severe service environment of the divertor imposes a huge challenge to the bonding quality of divertor joints, i.e., the joints must withstand thermal, mechanical and neutron loads, as well as cyclic mode of operation. In this paper, potassium-doped tungsten (KW) is selected as the plasma facing material (PFM), oxygen-free copper (OFC) as the interlayer, oxide dispersion strengthened copper (ODS-Cu) alloy as the heat sink material, and reduced activation ferritic/martensitic (RAFM) steel as the structural material. In this study, a vacuum brazing technology is proposed and optimized to bond Cu and ODS-Cu alloy with the silver-free brazing material CuSnTi. The most appropriate brazing parameters are a brazing temperature of 940 ℃ and a holding time of 15 min. High-quality bonding interfaces have been successfully obtained by vacuum brazing technology, and the average shear strength of the as-obtained KW/Cu and ODS-Cu alloy joints is ~268 MPa. And a fabrication route for manufacturing the flat-type divertor target based on brazing technology is set. For evaluating the reliability of the fabrication technologies under the reactor relevant condition, the high heat flux test at 20 MW/m² for the as-manufactured flat-type KW/Cu/ODS-Cu/RAFM mockup is carried out by using the Electron-beam Material testing Scenario (EMS-60) with water cooling. This paper reports the improved vacuum brazing technology to connect Cu to ODS-Cu alloy and summarizes the production route, high heat flux (HHF) test, the pre and post non-destructive examination, and the surface results of the flat-type KW/Cu/ODS-Cu/RAFM mockup after the HHF test. The test results demonstrate that the mockup manufactured according to the fabrication route still have structural and interfacial integrity under cyclic high heat loads.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.57-62
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• 2008

From the progressing results, it was found that thin film using 52 wt% Ni - 38 wt% Cr - 3 wt% Al - 4 wt% Mn - 3 wt% Si target has good characteristics for low TCR (temperature coefficients of resistance) and high resistivity. The optimum sputtering condition was DC 250 W, 5 mtorr, and 50 sccm and the proper annealing condition was $350^{\circ}C$/3.5 hr in air atmosphere. At these fabricated conditions, thin film resistors with TCR values of less than ${\pm}10ppm/^{\circ}C$ were obtained. The TCR of the packaged-samples made at proper fabrication conditions was $-3{\sim}15ppm/^{\circ}C$ after the thermal cycling and $-20{\sim}180ppm/^{\circ}C$ after PCT (pressure cooker test), we could confirm reliability for the thin film resistor and find the need for enduring research about packaging method.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1469-1472
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• 2006

We investigated the electrical and optical properties of ZnO:Al thin films as a function of the thermal process conditions. The film was prepared by RF magnetron sputtering followed by annealing in a box furnace in air. An ZnO:Al (98:2) alloy with the purity of 99.99% (3 inch diameter) was used as the target material. The electrical properties of the transparent electrode, exhibited surface oxidation as a result of rapid oxygen absorption with increasing annealing temperature. The processed ZnO:Al films and commercial ITO(indium-tin-oxide) were applied to an OLED stack to investigate the current density and luminescence efficiency. The efficiency of the device using the ZnO:Al electrode was higher than that from the device using the ITO electrode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.15-18
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• 1996

The elemental segregation in the sputter-deposited AgInSbTe recording thin films was studied by means of Auger electron spectroscopy and ESCA for the specimens of as-deposited and as heat-treated conditions. Auger electron spectroscopy and ESCA revealed an extremely thin layer of elemental inhomogeneity, especially for the silver, even in as-deposited condition. The chemical analysis results obtained in this alloy system are discussed in terms of process parameters and target microstructure.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.248-255
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• 2012

AlN thin films containing various amounts of Co, AlN-Co, and Al-Co alloy particles were prepared using a two-facing-target type dc reactive sputtering (TFTS) system. The as-deposited films exhibited the variable nature expected from an AlN-rich phase, and an amorphous-like phase, depending on the Co content in the films. Specific favorable microstructures were prepared by optimizing annealing conditions. Those microstructures and their magnetic properties and resistivity were investigated. As-deposited films showed very small saturation magnetization and an amorphous-like structure. However, when annealed, the as-deposited amorphous-like phase decomposes into phases of AlN, Co and Al-Co. These annealing induced changes in the microstructure improve the magnetization and resistivity of the films. Further improvement of soft magnetic properties could lead to the material being used for high density magnetic recording head material.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.4
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• pp.793-800
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• 1997

Periotest(Siemens, Germany) has been used to test mobility of the implants clinically, however the effects of target materials and connection methods on the PTVs(Periotest Values) have not been evaluated. Periotest has been regarded as a reliable and objective tool to test implant and natural teeth mobility clinically, however this instrument showed different PTVs under various test conditions. This in vitro study was designed to compare PTVs of different veneering materials and prosthodontic designs (single and bridge restorations). To compare the effects of veneering materials on PTVs, 1 mm thickness of five different testing materials (porcelain, type III gold alloy, pure titanium, composite resin, acrylic resin) were placed on the resin block. Three full length of 13 mm Mark II implant fixtures were embedded into autopolymerizing resin block to fabricate single and bridge restorations. To evaluate effects of the connection method in single restorations, PTVs of screw retained(UCLA type) and cementation type(Cera-One system) were compared. Finally, to test reliability of PTVs of the final restorations, screw retained three unit short span PFM bridges were fabricated on the standard and Estheti-Cone abutments. All testing components were tightened with torque controller and PTVs of all specimens were measured 15 times for statistical analysis with SAS program. Following conclusions were made within the limit of this in vitro study. 1. PTVs of type III gold alloy, grade II titanium, composite resin veneering materials showed no significant differences, however acrylic resin and porcelain showed significant differences (P<0.05). 2. Single tooth restorations showed consistent PTVs as long as proper torque force was applied. 3. PTVs of bridge type prostheses was inconsistent regardless of abutment types. 4. PTVs of the prostheses showed higher scores and standard deviations than those of abutments regardless types of connection (P<0.05).