• 한국표면공학회지
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• 제32권3호
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• pp.265-275
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• 1999

Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

• Journal of Ceramic Processing Research
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• 제13권spc2호
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• pp.363-367
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• 2012

DLC (diamond liked carbon) coating of the tungsten carbide (WC) alloy core surface for molding a glass aspheric lens improves the quality of glass lens and the molding core and is characterized by high hardness, high elasticity, abrasion resistance and chemical stability. In this study, the effect of DLC coating of a thin film by means of the filtered AIP (arc ion plating) technique was examined on Ra and shape of the coated surface. Roughness before and after DLC coating was measured and the result showed that the roughness was improved after coating as compared to before coating. It was observed that DLC coating of the WC alloy core surface for molding had an effect on improving the roughness and shape of the core surface. It is considered that this will have an effect on improving abrasion resistance and the service life of the core surface.

• 한국표면공학회지
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• 제24권2호
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• pp.88-95
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• 1991

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.567-572
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• 2001

In order to investigate the fracture behaviors(penetration modes) and resistance to penetration during ballistic impact of Titanium alloy laminates and nitrified Titanium alloy laminates which were treated by PVD(Physical Vapor Deposition) method, ballistic tests were conducted. Evaporation, sputtering, and ion plating are three kinds of PVD method. In this research, Ion plating was used to achieve higher surface hardness and surface hardness test were conducted using a Micro vicker's hardness tester. Resistance to penetration is determined by the protection ballistic limit($V_{50}$), a statistical velocity with 50% probability for complete penetration. Fracture behaviors and ballistic tolerance, described by penetration modes, are respectfully observed at and above ballistic limit velocities, as a result of $V_{50}$ test and Projectile Through Plates (PTP) test methods. PTP tests were conducted with $0^{\circ}$ obliquity at room temperature using 5.56mm ball projectile. $V_{50}$ test with $0^{\circ}$ obliquity at room temperature were conducted with projectiles that were able to achieve near or complete penetration during PTP tests. Surface hardness, resistance to penetration, and penetration modes of Titanium alloy laminates are compared to those of nitrified Titanium alloy laminates.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Korean Chemical Engineering Research
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• 제45권6호
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• pp.633-637
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• 2007

Alkali 물질이 포함되지 않은 $(NH_4)_2Co(SO_4)_2{\cdot}6H_2O$, $(NH_4)_2WO_4$, $(NH_4)H_2PO_4$ 등의 전구체를 사용하여 구리배선의 보호막 제조를 위한 Co 합금박막의 무전해도금을 수행하였다. pH, Co 전구체 농도, 증착온도 등의 공정변수들의 변화에 대한 Co 합금박막의 두께와 표면형상을 살펴봄으로써 이들 공정변수가 alkali 물질이 포함되지 않은 화학물질로 무전해도금된 Co 합금박막의 특성에 끼치는 영향을 살펴보았다. pH, Co 전구체 농도, 증착온도가 증가할수록 Co 합금 박막의 두께가 증가하였고 이는 alkali 물질이 포함된 Co 합금박막의 무전해도금 결과와 비슷하다. SEM(scanning electron microscopy)을 이용한 Co 합금박막의 표면형상 관측 결과, 본 연구에서 사용된 공정조건에서 Co 합금박막의 무전해도금을 위한 적절한 pH와 온도의 범위가 각각 8.5~9.5와 $75{\sim}85^{\circ}C$임을 얻었다. 본 연구를 통하여 alkali 물질이 포함되지 않은 화학물질을 이용한 무전해도금으로 구리배선의 보호막 제조용 Co 합금박막의 증착이 가능함을 확인하였다.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.71-76
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• 2008

전기도금법에 의한 니켈-철 합금 도금층은 전류인가방식, 전류밀도, 첨가제, 도금 욕에서 철과 니켈에 농도비 등과 같은 공정 변수에 따라 그 조성이 민감하게 변화하고 특히 전류인가방식에 따라 도금 층의 조성과 기계적인 특성이 달라지는 경향을 보이고 있다. 본 연구에서는 전류의 인가방식과 전류밀도 변화에 따른 경도, 내마모성, 인성,표면 거칠기 및 잔류응력 등의 기계적인 물성의 변화를 연구하였다. 전류인가방식을 직류에서 펄스전류로 변환시킴에 따라 인장강도가 15% 증가하였으며, 잔류음력이 10% 감소하였고, 내마모성이 30% 향상되었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 춘계학술발표회 초록집
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• pp.89-89
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• 2006

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 추계학술대회 논문집
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• pp.2-2
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• 2007

• 한국표면공학회지
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• 제50권3호
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.