• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.3
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• pp.130-134
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• 2018

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Transactions of the Korean hydrogen and new energy society
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• v.25 no.1
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• pp.19-27
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• 2014

Mg hydride has a high hydrogen capacity (7.6%), at high temperature, and is a lightweight and low cost material, thus it a promising hydrogen storage material. However, its high operation temperature and very slow reaction kinetics are obstacles to practical application. In order to overcome these disadvantages of Mg hydride, graphene powder was added to it. The addition of graphene has been shown to reduce the operating temperature of dehydrogenation. Moreover, in this report the environmental aspects of $MgH_x$-Graphene composites are investigated by means of the environmental life cycle assessment (LCA) method. $MgH_x$-Graphene mixture was prepared by hydrogen induced mechanical alloy (HIMA). The synthesized powder was characterized by XRD(X-ray Diffraction). The hydrogenation behaviors were evaluated by using a Sievert's type automatic PCT apparatus. Such evaluation of Materials also conducted in the LCA. From the result of P-C-T(Pressure-Composition-Temperature) curves, the $MgH_x$-3wt.% graphene composite was evaluated as having a 5.86wt.% maximum hydrogen storage capacity, at 523K. From absorption kinetic testing, the $MgH_x$-7wt.% graphene composite was evaluated as having a maximum 6.94wt.%/ms hydrogen absorption rate, at 573K. Environment evaluation results for the $MgH_x$-graphene composites and other materials indicated environmental impact from the electric power used and from the materials themselves.

• Investigative Magnetic Resonance Imaging
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• v.19 no.2
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• pp.76-87
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• 2015

Purpose: There is an ongoing search for a stent material that produces a reduced susceptibility artifact. This study evaluated the effect of manganese (Mn) content on the MRI susceptibility artifact of ferrous-manganese (Fe-Mn) alloys, and investigated the correlation between MRI findings and measurements of Fe-Mn microstructure on X-ray diffraction (XRD). Materials and Methods: Fe-Mn binary alloys were prepared with Mn contents varying from 10% to 35% by weight (i.e., 10%, 15%, 20%, 25%, 30%, and 35%; designated as Fe-10Mn, Fe-15Mn, Fe-20Mn, Fe-25Mn, Fe-30Mn, and Fe-35Mn, respectively), and their microstructure was evaluated using XRD. Three-dimensional spoiled gradient echo sequences of cylindrical specimens were obtained in parallel and perpendicular to the static magnetic field (B0). In addition, T1-weighted spin echo, T2-weighted fast spin echo, and $T2^*$weighted gradient echo images were obtained. The size of the low-intensity area on MRI was measured for each of the Fe-Mn binary alloys prepared. Results: Three phases of ${\alpha}^{\prime}$-martensite, ${\gamma}$-austenite, and ${\varepsilon}$-martensite were seen on XRD, and their composition changed from ${\alpha}^{\prime}$-martensite to ${\gamma}$-austenite and/or ${\varepsilon}$-martensite, with increasing Mn content. The Fe-10Mn and Fe-15Mn specimens comprised ${\alpha}^{\prime}$-martensite, the Fe-20Mn and Fe-25Mn specimens comprised ${\gamma}+{\varepsilon}$ phases, and the Fe-30Mn and Fe-35Mn specimens exhibited a single ${\gamma}$ phase. The size of the low-intensity areas of Fe-Mn on MRI decreased relative to its microstructure on XRD with increasing Mn content. Conclusion: Based on these findings, proper conditioning of the Mn content in Fe-Mn alloys will improve its visibility on MR angiography, and a Mn content of more than 25% is recommended to reduce the magnetic susceptibility artifacts on MRI. A reduced artifact of Fe-Mn alloys on MRI is closely related to the paramagnetic constitution of ${\gamma}$-austenite and/or ${\varepsilon}$-martensite.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.241-241
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• 2007

We fabricated SmBCO coated conductors(CCs) on IBAD-MgO templates using co-evaporation method. IBAD-MgO templates consist of PLD-LMO/epi-MgO/IBAD-MgO/Ni-alloy and showed good in-plane texture of below FWHM 7 degree. Evaporation rates of Sm, Ba, and Cu were precisely controlled to get the optimum composition ratio after deposition process. To optimize the oxygen partial pressure of reaction region, wide range of the partial pressure was investigated from 1 mTorr to 15 mTorr. By reducing the oxygen partial pressure to 5mTorr, (103)grains in SmBCO layer have been increased. On the other hand, there were only (001)grains in SmBCO layer deposited at 15 mTorr $O_2$. Deposition temperature was also investigated from $600^{\circ}C\;to\;800^{\circ}C$ to make high Ic SmBCO CCs. SmBCO on IBAD MgO template showed that the Ic increased gradually at higher growth temperature to $800^{\circ}C$, which the highest Jc and Ic is $2.6\;MA/cm^2$ and 500 A/cm-w., respectively.

• Korean Journal of Heritage: History & Science
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• v.37
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• pp.267-284
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• 2004

As an initial step to understand the transitions in Korean bronze technology the present study has examined metallurgical microstructures of 8 artifacts excavated from the Silla Wang-Gyong site in Kyongju. Important trends have been found in alloy compositions and also in manufacturing processes. In the design of alloys, the Sn content was apparently changing toward the peritectic point, 22 mass %, of the Cu-Sn phase diagram while the Pb addition was intentionally avoided. This trend in composition was found accompanied by the introduction, subsequent to casting, of such special thermo-mechanical treatments as quenching and forging in artifact manufacture. In addition, the Sn content in alloys containing a significant amount of As was relatively low and no evidence of forging was observed in them. The use of quenching and forging and the rejection of Pb and As from alloys are all necessary requirements if the brittle nature of high Sn alloys is to be overcome in bronze working. This paper will show that the Wang-Gyong era corresponds to that of innovations leading to the technical climax in Korean bronze tradition, which has been maintained up to the present.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.882-892
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• 2011

The influence of rhenium (Re) and ruthenium (Ru) addition on the solidification and solute redistribution behaviors in advanced experimental Ni-base superalloys has been investigated. A series of model alloys with different levels of Re and Ru were designed based on the composition of Ni-6Al-8Ta and were prepared by vacuum arc melting of pure metallic elements. In order to identify the influence of Re and Ru addition on the thermo-physical properties, differential scanning calorimetry analyses were carried out. The results showed that Re addition marginally increases the liquidus temperature of the alloy. However, the ${\gamma}^{\prime}$ solvus was significantly increased at a rate of $8.2^{\circ}C/wt.%$ by the addition of Re. Ru addition, on the other hand, displayed a much weaker effect on the thermo-physical properties or even no effect at all. The microsegregation behavior of solute elements was also quantitatively estimated by an electron probe microanalysis on a sample quenched during directional solidification of primary ${\gamma}$ with the planar solid/liquid interface. It was found that increasing the Re content gradually increases the microsegregation tendency of Re into the dendritic core and ${\gamma}^{\prime}$ forming elements, such as Al and Ta, into the interdendritic area. The strongest effect of Ru addition was found to be Re segregation. Increasing the Ru content up to 6 wt.% significantly alleviated the microsegregation of Re, which resulted in a decrease of Re accumulation in the dendritic core. The influence of Ru on the microstructural stability toward the topologically close-packed phase formation was discussed based on Scheil type calculations with experimentally determined microsegregation results.

• The korean journal of orthodontics
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• v.28 no.2 s.67
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• pp.329-341
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• 1998

Sterilization has received much attention in orthodontic practices over the past several years. The present study was undertaken to investigate the effects of sterilization on the physical properties of orthodontic pliers-AEZ, Unitek, and Dentronix ligature cutters. This study was designed to examine the tips of ligature cutters before and after 200 and 400 sterilization cycles using the Bowmar RHT-1000, the Dentronix DDS-5000, and the Eschmann SES-2000. The tip surface and the fracture surface were observed with a scanning electron microscope. The microstructure was observed with an optical microscope. The hardness test was carried out with the mic개-Vickers hardness tester and the Rockwell C Scale hardness tester. The chemical composition was analyzed by energy dispersive X-ray spectrometer. The results of this study were as follows : 1. The number and the size of corrosion products on the tip surface and the proportion of cleavage planes in fractured specimen increased, but the hardness of the tip decreased in proportion to sterilization cycles. From these observations, it was considered that mechanical properities decreased in proportion to sterilization cycles. 2. The number and the size of chromium carbides increased in proportion to sterilization cycles. Coarse microstructure decreased mechanical properities. 3. The AEZ and Unitek ligature cutters were Fe-Cr stainless steels, but the Dentronix ligature cutter was Co-Cr alloy. There were many differences among manufactures, but the chemical composition was .not changed after sterilization cycles. 4. The tip edge of ligature cutter used in a clinic revealed microcracks with the SEM observation. Clinical experience confirmed that ligature cutters were gradually degraded by sterilization.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1165-1169
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• 1998

A single crystal cast blade was manufactured by CMSX 6, one of the first generarion nickel based single crystal superalloys by the selector method in a vacuum furnace. The single crystal has been grown with cooling rate of 2.5 mm/min, after pouring the molten alloy of 163$0^{\circ}C$ to the mold heated to 150$0^{\circ}C$. The cast structure could be classified into matrix (dendrite) and eutectic regions in ${\gamma}$'shape and size. The eutectic region showed higher Ti content. As the additional results of ${\gamma}$'precipitates by EPMA and CBED analysis the ${\gamma}$'size was less than 0.5~0.7$\mu\textrm{m}$, showing the chemical composition close to Ni$_3$Al of Ll$_2$ lattice structure. But ${\gamma}$'size has increased to bigger than 1.0$\mu\textrm{m}$, being near to eutectic region, changing its shape to bar or huge block types. These showed the chemical structure near to Ni$_3$Ti of D $O_{24}$ lattice structure. Therefore, ${\gamma}$'morphology of dendrite and eutectic regions depends absolutely on its chemical composition and lattice structure.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.174-175
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• 2012

(In, Ga) N-based III-nitride semiconductor materials have been viewed as the most promising materials for the applications of blue and green light emitting devices such as light-emitting diodes (LEDs) and laser diodes. Although the InGaN alloy can have wide range of visible wavelength by changing the In composition, it is very hard to grow high quality epilayers of In-rich InGaN because of the thermal instability as well as the large lattice and thermal mismatches. In order to avoid phase separation of InGaN, various kinds of structures of InGaN have been studied. If high-quality In-rich InGaN/GaN multiple quantum well (MQW) structures are available, it is expected to achieve highly efficient phosphor-free white LEDs. In this study, we proposed a novel InGaN double hetero-structure grown on GaN nano-pyramids to generate broad-band red-color emission with high quantum efficiency. In this work, we systematically studied the optical properties of the InGaN pyramid structures. The nano-sized hexagonal pyramid structures were grown on the n-type GaN template by metalorganic chemical vapor deposition. SiNx mask was formed on the n-type GaN template with uniformly patterned circle pattern by laser holography. GaN pyramid structures were selectively grown on the opening area of mask by lateral over-growth followed by growth of InGaN/GaN double hetero-structure. The bird's eye-view scanning electron microscope (SEM) image shows that uniform hexagonal pyramid structures are well arranged. We showed that the pyramid structures have high crystal quality and the thickness of InGaN is varied along the height of pyramids via transmission electron microscope. Because the InGaN/GaN double hetero-structure was grown on the nano-pyramid GaN and on the planar GaN, simultaneously, we investigated the comparative study of the optical properties. Photoluminescence (PL) spectra of nano-pyramid sample and planar sample measured at 10 K. Although the growth condition were exactly the same for two samples, the nano-pyramid sample have much lower energy emission centered at 615 nm, compared to 438 nm for planar sample. Moreover, nano-pyramid sample shows broad-band spectrum, which is originate from structural properties of nano-pyramid structure. To study thermal activation energy and potential fluctuation, we measured PL with changing temperature from 10 K to 300 K. We also measured PL with changing the excitation power from 48 ${\mu}W$ to 48 mW. We can discriminate the origin of the broad-band spectra from the defect-related yellow luminescence of GaN by carrying out PL excitation experiments. The nano-pyramid structure provided highly efficient broad-band red-color emission for the future applications of phosphor-free white LEDs.