• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.977-982
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• 2005

Al/AlN/n-type 6H-SiC (0001) MIS structures were prepared by AlN layers on vicinal 6H-SiC(0001) substrates with reactive RF magnetron sputtering method. The AlN films were annealed at $900^{\circ}C$, $N_2$ atmosphere lot 1 minutes showed the best result. With XRD analysis, AlN(0002) peak was clearly found. The typical dielectric constant value of the AlN film in the MIS capacitors was obtained as 8.4 from photo C-V. Also, the gate leakage current density of the MlS capacitor was $10^{-10}\;A/cm^2$ order within the electric field of 1.8 MV/cm. Finally, the amount of interface trap densities, $D_{it}$, was evaluated as $5.3\times10^{10}\;eV^{-1}cm^{-2}$ at (Ec-0.85) eV.

• Korean Journal of Materials Research
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• v.24 no.12
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• pp.645-651
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• 2014

GaN is most commonly used to make LED elements. But, due to differences of the thermal expansion coefficient and lattice mismatch with sapphire, dislocations have occurred at about $109{\sim}1010/cm^2$. Generally, a low temperature GaN buffer layer is used between the GaN layer and the sapphire substrate in order to reduce the dislocation density and improve the characteristics of the thin film, and thus to increase the efficiency of the LED. Further, patterned sapphire substrate (PSS) are applied to improve the light extraction efficiency. In this experiment, using an AlN buffer layer on PSS in place of the GaN buffer layer that is used mainly to improve the properties of the GaN film, light extraction efficiency and overall properties of the thin film are improved at the same time. The AlN buffer layer was deposited by using a sputter and the AlN buffer layer thickness was determined to be 25 nm through XRD analysis after growing the GaN film at $1070^{\circ}C$ on the AlN buffer CPSS (C-plane Patterned Sapphire Substrate, AlN buffer 25 nm, 100 nm, 200 nm, 300 nm). The GaN film layer formed by applying a 2 step epitaxial lateral overgrowth (ELOG) process, and by changing temperatures ($1020{\sim}1070^{\circ}C$) and pressures (85~300 Torr). To confirm the surface morphology, we used SEM, AFM, and optical microscopy. To analyze the properties (dislocation density and crystallinity) of a thin film, we used HR-XRD and Cathodoluminescence.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.2
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• pp.77-81
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• 2011

Aluminum nitride (AlN) thin films were prepared by using nitrogen ion beam assisted reactive radio frequency (RF) magnetron sputtering on the glass substrates without intentional substrate heating. After deposition, the effect of nitrogen ion beam energy on the structural and optical properties of AlN films were investigated by x-ray diffraction (XRD), atomic force microscope (AFM) and UV-Vis. spectrophotometer, respectively. AlN films deposited with $N^+$ ion irradiation at 100 eV show the higher (002) peak intensity in XRD pattern than other films. It means that $N^+$ ion energy of 100 eV is the favorable condition for low temperature crystallization. AFM images also show that surface average roughness is increased from 1.5 to 9.6 nm with $N^+$ ion energy in this study. In an optical observation, AlN films which deposited by $N^+$ ion beam energy of 100 eV show the higher transmittance than that of the films prepared with the other $N^+$ ion beam conditions.

• Korean Chemical Engineering Research
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• v.48 no.4
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• pp.511-514
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• 2010

Perfluorinated polymer($Cytop^{TM}$) was deposited on selective area of AlGaN/GaN HEMT structure using low cost and simple spin-coating method, and the electrical characteristics of the device was analyzed for application of passivation layer on semiconductors. Gate lag measurement results of $Cytop^{TM}$ passivated and unpassivated HEMT were compared. Passivated device shows improved 65 % pulsed drain current of dc mode value. Rf measurements were also performed. $Cytop^{TM}$ passivated HEMT have similar rf performance to PECVD grown $Si_3N_4$ passivated device. $Cytop^{TM}$ passivation layer may play an important role in mitigating surface state trapping in the region between gate and drain.

• Journal of the Korean Vacuum Society
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• v.17 no.4
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• pp.353-358
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• 2008

In order to increase extraction efficiency of AlGaInP-based vertical RED LEDs, chemical wet etching technique was produced by using a roughened surface with triangle-like morphology. A commonly used $H_3PO_4$-based solution was applied for chemical wet etching. The light extraction of AlGaInP LED was related to the n-side roughed surface morphology. The morphology of roughed surface is analyzed by the atomic force microscope (AFM). As a result, the roughed surface AlGaInP LED has a root-mean-square (RMS) roughness of 44 nm. The brightness shows 41% increase after roughening n-side surface, as compared to the ordinary flat surface LED.

• Journal of Powder Materials
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• v.25 no.6
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• pp.494-500
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• 2018

In this study, the effect of the content of $MgO-CaO-Al_2O_3-SiO_2$ (MCAS) glass additives on the properties of AlN ceramics is investigated. Dilatometric analysis and isothermal sintering for AlN compacts with MCAS contents varying between 5 and 20 wt% are carried out at temperatures ranging up to $1600^{\circ}C$. The results showed that the shrinkage of the AlN specimens increases with increasing MCAS content, and that full densification can be obtained irrespective of the MCAS content. Moreover, properties of the AlN-MCAS specimens such as microhardness, thermal conductivity, dielectric constant, and dielectric loss are analyzed. Microhardness and thermal conductivity decrease with increasing MCAS content. An acceptable candidate for AlN application is obtained: an AlN-MCAS composite with a thermal conductivity over $70W/m{\cdot}K$ and a dielectric loss tangent (tan ${\delta}$) below $0.6{\times}10^{-3}$, with up to 10 wt% MCAS content.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.5
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• pp.295-303
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• 2012

Removal of total nitrogen (T-N) and total phosphorus (T-P) was evaluated in a DEPHANOX process by adding Al(III) to the separator to maintain T-P in the final effluent below 0.2 mg/L. pH in each reactor was maintained 7~8 after addition of Al(III) to the levels of 5, 10, 15 mg/L. The removal efficiency of COD and T-N decreased at higher Al(III) dose, but T-P removal efficiency increased from 76.28 to 84.02, 94.66% at Al(III) dose of 5, 10, 15 mg/L, respectively. T-P in effluent showed 0.17 mg/L at Al(III) dose of 15 mg/L. Minimum 15 mg/L of Al(III) was required to maitain T-P below 0.2 mg/L in the final effluent.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.10
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• pp.759-762
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• 2010

In this investigation, the effects of $N_2/(Ar+N_2)$ gas partial pressure on the structural, electrical, and thermal properties of AlN dielectric layers prepared on aluminum substrates using RF-magnetron sputtering method were analyzed. Among the films, the AlN dielectric film deposited under $N_2/(Ar+N_2)$ gas partial pressure of 75% exhibit the highest AlN (002) preferred orientation, which was grain size of about 15.32 nm and very dense structure. We suggest the possibilities of it's application as a dielectric layer for metal PCB because the AlN films prepared at optimized gas partial pressure can improving the insulating property, the thermal conductivity, and thermal diffusivity of the films.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.385-385
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• 2013

음극 아크로 증착한 TiAlN 박막의 표면형상과 물리적 특성을 관찰하였다. 음극 아크로 박막을 코팅할 경우, 거대 입자가 박막 표면에 존재하여 박막의 품질을 저하시킨다. 본 연구에서는 거대입자의 생성을 막기 위한 기판 청정공정을 도출하였다. 먼저 글로우 방전을 이용하여 기판을 청정한 후 $N_2$ 가스를 주입하여 TiAlN 박막을 코팅하였다. 글로우 방전의 경우 Ar 가스주입 후 공정압력은 $1.9{\sim}2.1{\times}10^{-2}$ Torr, 전압 -800 V에서 30분 동안 청정을 실시하였다. 다른 청정 방법으로는 Ar과 $N_2$ 가스를 동시에 주입하여 아크를 발생시키고 시편에 전압을 -400 V 인가하여 청정을 실시한 후 인가전압만을 -100 V로 낮추어 TiAlN을 코팅하였다. 글로우 방전 청정과 Ar과 $N_2$의 혼합가스로 아크를 발생시켜 청정을 실시한 후 코팅된 시편의 박막 표면형상과 물리적 특성을 비교해 본 결과, 앞서 서술한 두 종류의 청정공정 모두 거대입자의 수가 주목할 만하게 줄어들었다. 글로우 방전과 Ar과 $N_2$의 혼합가스로 발생시킨 아크로 청정을 실시하고 코팅한 TiAlN 박막은 거대입자의 제거와 함께 박막의 경도가 최대 47 GPa까지 향상되는 경향을 보였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.292-292
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• 2014

Wide band gap semiconductors, such as III-nitrides (GaN, AlN, InN, and their alloys), SiC, and diamond are expected to play an important role in the next-generation electronic devices. Specifically, GaN-based high electron mobility transistors (HEMTs) have been targeted for high power, high frequency, and high temperature operation electronic devices for mobile communication systems, radars, and power electronics because of their high critical breakdown fields, high saturation velocities, and high thermal conductivities. For the stable operation, high power, high frequency and high breakdown voltage and high current density, the fabrication methods have to be optimized with considerable attention. In this study, low ohmic contact resistance and smooth surface morphology to AlGaN/GaN on 2 inch c-plane sapphire substrate has been obtained with stepwise annealing at three different temperatures. The metallization was performed under deposition of a composite metal layer of Ti/Al/Ni/Au with thickness. After multi-layer metal stacking, rapid thermal annealing (RTA) process was applied with stepwise annealing temperature program profile. As results, we obtained a minimum specific contact resistance of $1.6{\times}10^{-7}{\Omega}cm2$.