• Electrical & Electronic Materials
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• v.9 no.3
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.47-58
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• 2004

Loss factors of A356, Mn-Cu alloy and aluminum matrix composites reinforced with $SiC_p$ and Ni-coated graphite particles at various contents have been investigated using clamped-free cantilever beam method. The loss factors of half-power bandwidth of the specimens were measured over a wide range of frequencies from 50 to 3300Hz. Among the specimens, Al-10%$SiC_p$-10%$C_p$ showed the highest loss factor at the mode I, while Mn-Cu alloy showed the highest loss factors at the modes II and III. Consequently, at the mode I the Al-10%$SiC_p$--10%$C_p$ showed the loss factor of 0.00093, which is 2.64 and 1.58 times higher than those of A356 and Mn-Cu alloy, respectively.

• Journal of Korea Foundry Society
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• v.30 no.3
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• pp.100-110
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• 2010

The solidification sequence and formation of intermetallic phase of Fe-rich Al-Si-Cu alloy were investigated by using real-time imaging of synchrotron X-ray radiation. Effects of cooling rate during uni-directional solidification on the resultant solidification behavior was also studied in a specially constructed vacuum chamber in the SPring-8 facility. The series of radiographic images were complementarily analyzed with conventional analysis of OM and SEM/EDX for phase identification. Detailed solidification sequence and formation mechanisms of various phases were discussed based on real-time image analysis. The growth rates of $\alpha$-AlFeMnSi and ${\beta}-Al_5FeSi$ were measured in order to understand the growth behavior of each phase. It is suggested that real-time imaging technique can be a powerful tool for the precise understanding of solidification behavior of various industrial materials.

• Transactions of Materials Processing
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• v.27 no.6
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• pp.339-346
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• 2018

This study investigated the microstructure and wear properties of extruded hyper-eutectic Al-Si (15wt.%) alloy in an engine oil environment. The wear mechanism of the material was also analyzed and compared to conventional gray cast iron. In microstructural observation results of Al-15wt.%Si alloy, primary Si phase ($45.3{\mu}m$) and eutectic Si phase ($3.1{\mu}m$) were found in the matrix, and the precipitations of $Mg_2Si({\beta}^{\prime})$, $Al_2Cu({\theta}^{\prime})$ and $Al_6(Mn,Fe)$ were also detected. In the case of gray cast iron, ferrite and pearlite were observed. It was also observed that flake graphite ($20-130{\mu}m$) were randomly distributed. Wear rates were lower in the Al-Si alloy as compared to those of gray cast iron in all load conditions, confirming the outstanding wear resistance of Al-15wt.%Si alloy in engine oil environment. In the $4kg_f$ condition, the wear rate of gray cast iron was $6.0{\times}10^{-5}$ and that of Al-Si measured $0.8{\times}10^{-5}$. The microstructures after wear of the two materials were analyzed using scanning electron microscope (SEM) and electron backscatter diffraction (EBSD). The primary Si and eutectic Si of Al-Si alloy effectively mitigated the abrasive wear, and the Al matrix effectively endured to accept a significant amount of plastic deformation caused by wear.

• Bulletin of the Korean Chemical Society
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• v.11 no.1
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• pp.1-7
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• 1990

We present a theoretical investigation on the etching of an Al solid by $SiCl_4$ molecules at a collision energy of 600 eV. The classical trajectory method is employed to calculate Al etching yields, degree of anisotropy, kinetic energy distribution and angular distribution. The calculated results are compared with the reaction of a Cu solid by $SiCl_4$. The major products of the reaction are aluminum monomers and dimers together with considerable quantities of multimers. The Al solid shows better etching yield and better anisotropy than the Cu solid. This is consistent with the problem in the CMOS micro-fabrication of the CuAl and CuAlSi alloys. The relevance of these calculations for the dry etching of CuAl alloy is discussed.

• Journal of Powder Materials
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• v.29 no.3
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• pp.233-239
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• 2022

Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.237-241
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• 2000

The effects of Si addition on the precipitation processes of in Al-Cu-Si alloy films were studied by the transmission electron microscopy. Deposition of an Al-1.5Cu-1.5Si (wt. %) film at $305^{\circ}C$ resulted in formation of fine, uniformly distributed spherical $\theta$-phase particles due to the precipitation of the $\theta$ and Si phase particles during deposition. For deposition at $435^{\circ}C$, fine $\theta$-phase particles precipitated during wafer cooldown, while coarse Si nodules formed at the sublayer interface during deposition. The film susceptibility to corrosion is discussed in relation to the film microstructure and deposition temperature.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.86-86
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.85-85
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• 2002

• Journal of Korea Foundry Society
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• v.30 no.5
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• pp.161-166
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• 2010

In this examination, the effect of Sr addition and holding time on microstructure of Al-10.5wt%Si-2wt%Cu secondary die-casting alloy was investigated. Degree of undercooling was improved with increasing the Sr content in this alloy. Up to 0.02wt%Sr addition, acicular and lamellar eutectic structure was observed in the microstructure. Meanwhile, the eutectic Si was modified toward the fine fibrous form by increasing Sr content with more than 0.03wt% and holding time of the melt. The well- modified alloys showed decreased eutectic silicon size from 3.25 ${\mu}m$ to less than 0.8 ${\mu}m$. From these results, the optimal strontium content and holding time were identified on the Al-10.5wt%Si-2wt%Cu secondary die-casting alloy.