• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.1
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• pp.122-131
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• 1995

The research trends for metal matrix composites have been on basic mechanical properties, fatigue behavior after aging and fractographic observations. In this study, the fatigue crack initiation as well as the fatigue crack growth behavior and the fracture mechanism were investigated through observations of the fracture surface on silicon carbide particles reinforced aluminum metal matrix composites(SiCp/Al). Based on the fractographic study done by scanning electron microscope and replica, crack growth path model and fracture mechanism are presented. The mechanical properties, such as the tensile strength, yield strength and elongation of SiCp/Al composites are improved in a longitudinal direction, however, the fatigue life is shorter than the basic Al6061 alloys. From fractographic observations, it is found that the failure mode is ductile in basic Ai6061 alloys. And because some SiC particles were pulled out from the matrix and a few SiC particles could be seen on the fracture surface of SiCp/Al, crack growth paths are believed to follow the interface of the matrix and its particles.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.372-377
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• 2013

Machinable SiC ceramics are prepared with the addition of $Al_2TiO_5$. Ready-to-press SiC and $Al_2TiO_5$ powders are mixed and pressureless sintered at $1750^{\circ}C$ and $1850^{\circ}C$ for 1 h. The weight ratios of the SiC and $Al_2TiO_5$ powders are 100 : 0, 100 : 10, and 100 : 20. After sintering, only SiC peaks are detected in the X-ray diffraction analyses. The density, strength, and grain size of the SiC increase with increases in the $Al_2TiO_5$ content and sintering temperature. The $Al_2TiO_5$-doped specimens are easy to micro-hole machine. Based on the density and strength data, the ceramics sintered at $1850^{\circ}C$ can be used as machinable ceramics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.828-833
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• 2000

Growth characteristics and microstructure of AIN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the micorstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.

• Journal of Powder Materials
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• v.11 no.3
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• pp.259-264
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• 2004

Aluminum based metal matrix composite reinforced with SiC particles was fabricated by the powder-in sheath rolling method. A stainless steel tube with outer diameter of 12 mm and wall thickness of 1mm was used as a sheath. Mixture of aluminum powder and SiC particles of which volume content was varied from 5 to 20vol.% was filled in the tube by tap filling and then rolled to 75% reduction at ambient temperature. The rolled specimen was sintered at 56$0^{\circ}C$ for 0.5hr. The tensile strength of the (SiC)$_{p}$/Al composite increased with the volume content of SiC particles, and at 20vol.% it reached a maximum of 100㎫ which is 1.6 times higher than unreinforced material. The elongation decreased with the volume content of $Al_{2}$O$_{3}$ particles. The mechanical properties of the (SiC)$_{p}$/Al composite fabricated by the powder-in sheath rolling is compared with that of (Al$_{2}$O$_{3}$)$_{p}$/Al composite by the same process.ess.

• Journal of Powder Materials
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• v.26 no.5
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• pp.415-420
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• 2019

SiAlON ceramics are used as ceramic cutting tools for heat-resistant super alloys (HRSAs) due to their excellent fracture toughness and thermal properties. They are manufactured from nitride and oxide raw materials. Mixtures of nitrides and oxides are densified via liquid phase sintering by using gas pressure sintering. Rare earth oxides, when used as sintering additives, affect the color and mechanical properties of SiAlON. Moreover, these sintering additives influence the cutting performance. In this study, we have prepared $Yb_{m/3}Si_{12-(m+n)}Al_{m+n}O_nN_{16-n}$ (m = 0.5; n = 0.5, 1.0) ceramics and manufactured SiAlON ceramics, which resulted in different colors. In addition, the characteristics of the sintered SiAlON ceramics such as fracture toughness and microstructure have been investigated and results of the cutting test have been analyzed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.577-582
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• 2002

The solidification cracking susceptibilities of AI-Mg-Si alloy laser welds were assessed using the self-restraint tapered specimen crack test. The cracking susceptibility of 6061 and 6082 Al-Mg-Si alloy laser welds was substantially reduced when the filler wire containing high Si such as Al-12 wt.% Si (4047A) was used. The amount of eutectic was observed to affect the solidification cracking of Al-Mg-Si alloy laser welds. Abundant eutectic seems to heal the cracking and reduces the cracking susceptibility, while an initial increase in eutectic liquid leads to the increased cracking tendency.

• Korean Journal of Materials Research
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• v.2 no.6
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• pp.408-416
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• 1992

Stable TiS$i_2$was formed by RTA on single-Si and on poly-Si. Subsequently, an Al-1% Si layer with 600-nm thick was deposited on top of the TiS$i_2$, Finally, the specimens were annealed for 30min at 400-60$0^{\circ}C$in $N_2$ambient. The thermal stability of Al-1% Si/TiS$i_2$bilayer and interfacial reaction were investigated by measuring sheet resistance, Auger electron spectroscopy (AES), and scanning electron microscopy (SEM). The composition and phase of precipitates formed by the reaction of Al-1% Si with Ti-silicide were studied by energy dispersive spectroscopy (EDS), X-ray diffraction (XRD). In the case of single-Si substrate the reaction of Al-1% Si layer with TiS$i_2$layer resulted in precipitates, consuming all TiS$i_2$layer at 55$0^{\circ}C$. On the other hand, the disappearance of TiS$i_2$on poly-Si occurred at 50$0^{\circ}C$ and more precipitates were formed by the reaction of Al-1% Si/TiS$i_2$on potty-Si substrate than those of the reaction on single-Si substrate. This phenomenon resulted from the fact that Ti-silicide formed on poly-Si was more unstable than on single-Si by the effect of grain boundary. By EDS analysis the precipitates were found tobe composed of Ti, Al, and Si. X-ray diffraction showed the phase of precipitates to be theT$i_7$A$l_5$S$i_12$ternary compound.

• Journal of Korea Foundry Society
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• v.21 no.6
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• pp.328-335
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• 2001

The objective of this study is to investigate on manufacturing Al-scrap into hypereutectic Al-Si alloy by using electromagnetic force. The Fe element in the aluminium scrap was controlled by intermetallic compound method and using EMF(electromagnetic force). The most lumped compound was found after 10min holding at $690^{\circ}C$. A number of segregated compound was revealed when imposed to EMF at 30A. The refinement of primary Si particles was achieved by EMF stirring. Primary Si particles were refined and spheroidized most of all with the magnetic intensity of 180G for 10 min.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.3
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• pp.102-108
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• 2018

The objective of this study is to develop the mechanical properties of an AlSiCu aluminum alloy using the two-step solution heat treatment. The microstructure of the gravity casting specimen represents a typical dendrite structure with a secondary dendrite arm spacing (SDAS) of 40 um. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases is generated. The eutectic Si phases are fragmented and globularized with the solution heat treatment. The $Al_2Cu$ intermetallic phase is also resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ may be an optimal condition to enhance the mechanical properties of the AlSiCu aluminum alloy.