• Journal of the Korean institute of surface engineering
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• v.29 no.4
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• pp.278-285
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• 1996

The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.

• Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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• v.2 no.2
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• pp.149-158
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• 1998

Biomass of non-living brown seaweed Sargassun fluitans pretreated with NaOH is capable of taking up more than $10\%$ $(q_{max}$ : 3.85 mmol/g for Al and 1.48 mmol/g for Cu) of its dry weight in the Al and Cu at pH of 4.5. However, the maximum Al and Cu uptakes calculated from Langmuir isotherm were 1.58 mmol/g for Al and 1.35 mmol/g for Cu at pH 3.5. Equilibrium batch sorption study was performed using two-metal system containing Al and Cu. The mathematical model of the two-metal sorption system enabled quantitative estimation of one-metal biosorption inhibition due to the influence of a second metal. NaOH-treated S. fluitans contained 2.19 mmol $(43\;wt.\%)$ carboxyl groups per gram of biomass. A modified form of Langmuir, which assumes binding of Cu as $Cu^{2+}$ and Al as $Al(OH)_2^+,$ was used to model the experimental data. This result agrees with the one of mono-valent sorption for Al in single-metal system. The modified Langmuir model gives the following affinity correlated coefficients: 0.196 for Cu and 6.820 for Ah at pH 4.5, and 2.904 for Cu and 3.131 for Al at pH 3.5. The interference of Al in Cu biosorptive uptake was assessed by `cutting' the three dimensional uptake isotherm surfaces at constant second-metal final concentrations. Equimolar final equilibrium concentrations of Cu and Al of 1 mM at pH 4.5 give Cu and hi uptakes reduced by $82.5\%\;and\;5.4\%,$ respectively. However, these values at pH 3.5 were $55\%\;(Cu)\;and\;31\%$ (Al).

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.169-172
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• 1994

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.154-154
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• 1994

• Journal of the Korean Society for Heat Treatment
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• v.31 no.3
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• pp.97-103
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• 2018

The objective of this study is to develop the mechanical properties of AlSiCu aluminum alloy by the two-step solution heat treatment. The microstructure of gravity casting specimen represents a typical dendrite structure having a secondary dendrite arm spacing (SDAS) of 40 mm. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases are generated. The eutectic Si phases are fragmented and globularized with solution heat treatment. Also, the $Al_2Cu$ intermetallic phase is resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ might be a optimum condition for enhancement of mechanical properties of AlSiCu aluminum alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.76-77
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• 2005

Single crystal $CuAlSe_2$ layers were grown on thoroughly etched semi-insulating GaAs(100) substrate at 410$^{\circ}C$ with hot wall epitaxy (HWE) system by evaporating $CuAlSe_2$ source at $680^{\circ}C$. The crystalline structure of the single crystal thin films was investigated by the photoluminescence(PL) and double crystal X-ray diffraction (DCXO). The temperature dependence of the energy band gap of the $CuAlSe_2$ obtained from the absorpt ion spectra was wel1 described by the Varshni's relation, $E_g$(T) = 2.8382 eV - ($8.86\times10^{-4}$ eV/H)$T_2$/(T + 155K). After the as-grown single crystal $CuAlSe_2$ thin films were annealed in Cu-, Se-, and Al-atmospheres, the origin of point defects of single crystal $CuAlSe_2$ thin films has been investigated by PL at 10 K. The native defects of $V_{cd}$, $V_{se}$, $Cd_{int}$, and $Se_{int}$ obtained by PL measurements were classified as donors or acceptors. And we concluded that the heat-treatment in the Cu-atmosphere converted single crystal $CuAlSe_2$ thin films to an optical n-type. Also. we confirmed that hi in $CuAlSe_2$/GaAs did not form the native defects because Al in single crystal $CuAlSe_2$ thin films existed in the form of stable bonds.

• Journal of Powder Materials
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• v.10 no.5
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• pp.337-343
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• 2003

Nanostructured Cu-$Al_2O_3$ composite powders were synthesized by thermochemical process. The synthesis procedures are 1) preparation of precursor powder by spray drying of solution made from water-soluble copper and aluminum nitrates, 2) air heat treatments to evaporate volatile components in the precursor powder and synthesis of nano-structured CuO + $Al_2O_3$, and 3) CuO reduction by hydrogen into pure Cu. The suggested procedures stimulated the formation of the gamma-$Al_2O_3$, and different alumina formation behaviors appeared with various heat treating temperatures. The mean particle size of the final Cu/$Al_2O_3$ composite powders produced was 20 nm, and the electrical conductivity and hardness in the hot-extruded bulk were competitive with Cu/$Al_2O_3$ composite by the conventional internal oxidation process.

• Journal of Korea Foundry Society
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• v.30 no.4
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• pp.137-141
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• 2010

The effects of Zn amounts on the castability and tensile properties of Al-Zn-Mg-Cu alloys were investigated for development of high strength die casting aluminium alloys. Al-Zn-Mg-Cu alloys with 3.5% Zn showed high cast cracking tendency and poor mold filling behaviour. Al-Zn-Mg-Cu alloys with 5wt% Zn and 7wt% Zn had the tensile strengths of 300~400MPa and the elongations of 2~18%. The effect of Zn on the tensile strength of Al-Zn-Mg-Cu alloys was insignificant, but Al-Zn-Mg-Cu alloy with high Zn amount had lower elongation.

• Journal of Powder Materials
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• v.11 no.6 s.47
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• pp.486-492
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• 2004

We report the crystallization and magnetic properties of non-equilibrium $Al_{0.6}(Fe_{x}Cu_{1-x})_{0.4}(x=0.25, 0.50, 0.75)$ alloy powders produced by rod-milling as well as by new chemical leaching. X-ray diffractometry, transmission electron microscopy, differential scanning calorimetry and vibrating sample magnetometry were used to characterize the as-milled and leached specimens. After 400 h or 500 h milling, only the broad peaks of nano bcc crystalline phases were detected in the XRD patterns. The crystallite size, the peak and the crystallization temperatures increased with increasing Fe. After being annealed at $600{^\circ}C$ for 1 h for as-milled alloy powders, the peaks of bcc $AlCu_{4}\;and\;Al_{13}Cu_{4}Fe_{3}\;for\;x=0.25,\;bcc\;AlCu_{4}\;and\;Al_{5}Fe_{2}\;for\;x=0.50,\;and\;Al_{5}Fe_{2},\;and\;Al_{0.5}Fe_{0.5}\;for\;x=0.75$ are observed. After being annealed at $500{^\circ}\;and\;600{^\circ}C$for 1 h for leached specimens, these non-equi-librium phases transformed into fcc Cu and $CuFe_{2}O_{4}$phases for the x=0.25 specimen, and into bcc ${\alpha}-Fe,\;fcc\;Cu,\;and\;CuFe_{2}O_{4}$ phases for both the x=0.50 and the x=0.75 specimens. The saturation magnetization decreased with increasing milling time for $Al_{0.6}(Fe_{x}Cu_{1-x})_{0.4}$ alloy powders. On cooling the leached specimens from $800{\~}850^{\circ}C$,\;the magnetization first sharply increase at about $491.4{\circ}C,\;745{\circ}C,\;and\;750.0{\circ}C$ for x=0.25, x=0.50, and x=0.75 specimens, repectively.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.