• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.383-386
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• 1998

After etching Al-Cu alloy films using SiC1$_4$/Cl$_2$/He/CHF$_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, CHF$_3$ plasma treatment subsequent to the etched has been carried out. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after CHF$_3$ and SF$_{6}$ treatment, and the layer supresses effectively the corrosion on the surface as the CHF$_3$ and SF$_{6}$ treatment pressure increases. The corrosion could be suppressed successfully with CHF$_3$ and SF6 treatment in the pressure of 300mTorr.orr.

• Bulletin of the Korean Chemical Society
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• v.16 no.7
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• pp.588-591
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• 1995

Single crystals of (ZnSe)1-x(CuMSe2)x (M=Al, Ga, or In) were grown by chemical vapor transport technique. Powdered polycrystalline samples of (ZnSe)1-x(CuMSe2)x (M=Al, Ga, or In) were also prepared by the direct combination of the elements. The chemical composition of these single crystals was determined by comparing their lattice parameters with those of the standard polycrystalline samples. The IR transmission range of single crystals of (ZnSe)1-x(CuMSe2)x (M=Al, Ga, or In) is slightly narrower than that observed for pure ZnSe. However, these materials still show good transmission in the long-wavelength IR range. The addition of small amounts of CuMSe2 (M=Al, Ga, or In) considerably increases the hardness of ZnSe.

• Journal of Hydrogen and New Energy
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• v.30 no.2
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• pp.103-110
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• 2019

Cu-Zn-Al catalysts were prepared via co-precipitation method for low-temperature water-gas shift (LT-WGS) reaction under practical reaction condition. Aging time was systematically changed to find optimum point for LT-WGS under practical condition. The Cu-Zn-Al catalyst aged for 72 hours showed the highest CO conversion within low-temperature range as well as very stable catalytic activity for 200 hours despite the practical reaction condition.

• Archives of Metallurgy and Materials
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• v.64 no.3
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• pp.931-934
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• 2019

Al-CuO is a thermite material exhibiting the exothermic reaction only when aluminum melts. For wide spread of its application, the reaction temperature needs to be reduced in addition to the enhancement of total reaction energy. In the present study, a thermite nanocomposite with a large contact area between Al and CuO was fabricated in order to lower the exothermic reaction temperature and to improve the reactivity. A cryomilling process was performed to achieve the nanostructure, and the effect of composition on the microstructure and its reactivity was studied in detail. The microstructure was characterized using SEM and XRD, and the thermal property was analyzed using DSC. The results show that as the molar ratio between Al and CuO varies, the fraction of uniform nanocomposite structure was changed affecting the exothermic reaction characteristics.

• Korean Journal of Materials Research
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• v.30 no.10
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• pp.542-549
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• 2020

Effects of Sc addition on microstructure, electrical conductivity, thermal conductivity and mechanical properties of the as-cast and as-extruded Al-2Zn-1Cu-0.3Mg-xSc (x = 0, 0.25, 0.5 wt%) alloys are investigated. The average grain size of the as-cast Al-2Zn-1Cu-0.3Mg alloy is 2,334 ㎛; however, this value drops to 914 and 529 ㎛ with addition of Sc element at 0.25 wt% and 0.5 wt%, respectively. This grain refinement is due to primary Al₃Sc phase forming during solidification. The as-extruded Al-2Zn-1Cu-0.3Mg alloy has a recrystallization structure consisting of almost equiaxed grains. However, the as-extruded Sc-containing alloys consist of grains that are extremely elongated in the extrusion direction. In addition, it is found that the proportion of low-angle grain boundaries below 15 degree is dominant. This is because the addition of Sc results in the formation of coherent and nano-scale Al₃Sc phases during hot extrusion, inhibiting the process of recrystallization and improving the strength by pinning of dislocations and the formation of subgrain boundaries. The maximum values of the yield and tensile strength are 126 MPa and 215 MPa for the as-extruded Al-2Zn-1Cu-0.3Mg-0.25Sc alloy, respectively. The increase in strength is probably due to the existence of nano-scale Al₃Sc precipitates and dense Al₂Cu phases. Thermal conductivity of the as-cast Al-2Zn-1Cu-0.3Mg-xSc alloy is reduced to 204, 187 and 183 W/MK by additions of elemental Sc of 0, 0.25 and 0.5 wt%, respectively. On the other hand, the thermal conductivity of the as-extruded Al-2Zn-1Cu-0.3Mg-xSc alloy is about 200 W/Mk regardless of the content of Sc. This is because of the formation of coherent Al₃Sc phase, which decreases Sc content and causes extremely high electrical resistivity.

• Journal of Korea Foundry Society
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• v.24 no.1
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• pp.45-51
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• 2004

Fe and Si are common impurity elements in the aluminum alloys. In this investigation, the effects of the addition of Fe and Si on the age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd casting alloys were examined through hardness measurements, calorimetric techniques and observation of the transmission electron microscopy. The addition of Fe depresses the formation of GPII and ${\theta}'$, and thus retards the peak aging time and reduces the peak hardness of the Al-Cu-Mn-Ti-Zr-Cd alloys. On the contrary, the addition of Si accelerates the formation of GPII and ${\theta}'$ and thus accelerates age-hardening behaviors of the Al-Cu-Mn-Ti-Zr-Cd alloys.

• Journal of Powder Materials
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• v.6 no.4
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• pp.301-306
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• 1999

Mechanical properties of oxide based materials could be improved by nanocomposite processing. To investigate optimum route for fabrication of nanocomposite enabling mass production, high energy ball milling and Pulse Electric Current Sintering (PECS) were adopted. By high energy ball milling, the $Al_2O_3$-based composite powder with dispersed Cu grains below 20 nm in diameter was successfully synthesized. The PECS method as a new process for powder densification has merits of improved sinterability and short sintering time at lower temperature than conventional sintering process. The relative densities of the $Al_2O_3$-5vol%Cu composites sintered at $1250^{\circ}C$ and $1300^{\circ}C$ with holding temperature of $900^{\circ}C$ were 95.4% and 95.7% respectively. Microstructures revealed that the composite consisted of the homogeneous and very fine grains of $Al_2O_3$ and Cu with diameters less than 40 nm and 20 nm respectively The composite exhibited enhanced toughness compared with monolithic $Al_2O_3$. The influence of the Cu content upon fracture toughness was discussed in terms of microstructural characteristics.

• Journal of Powder Materials
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• v.18 no.4
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• pp.365-371
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• 2011

In this study, gradient porous Al-Cu sintered body was fabricated by powder metallurgy processing. Al-Cu powder mixtures were prepared by low energy ball milling with various milling time. After ball milling for 3h, the shape of powder mixtures changed to spherical type with size of 100~500 ${\mu}m$. Subsequently, Al-Cu powder mixtures were classified (under 150, 150~300 and over 300 ${\mu}m$) and compacted (20, 50 and 100 MPa). Then, they were sintered at $600^{\circ}C$ for various holding time (10, 30, 60 and 120 min) in $N_2$ atmosphere. The sintered bodies had 32~45% of porosity. As a result, the optimum holding time was determined to be 60 min at $600^{\circ}C$ and sintered bodies with various porosity were obtained by controlling the compacting pressure.

• Journal of Korea Foundry Society
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• v.30 no.2
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• pp.83-88
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• 2010

Bulk amorphous alloys with reasonable glass forming ability and large plasticity were found in Zr-Cu-Al alloys. Further increase in the GFA and the ductility is expected by appropriately choosing a fourth element. In this study, we select Be as the fourth element and added to the Zr-Cu-Al system to synthesize $(Zr_{57.4}Cu_{38.1}Al_{4.5})_{100-x}Be_x$(x=0~16) alloys and the glass forming ability and the plasticity were measured. With Be addition, the supercooled liquid region (${\Delta}T_x$), the plasticity and GFA as high as $134^{\circ}C$, 20.5%, 7 mm, respectively, can be obtained. Herein, we present the effect of Be addition on the variations of various mechanical properties and thermal characteristics of the $(Zr_{57.4}Cu_{38.1}Al_{4.5})_{100-x}Be_x$ alloys.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.1
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.