• Journal of Powder Materials
• /
• v.4 no.2
• /
• pp.106-112
• /
• 1997

$Cu-Al_20_3 $ composite powders were prepared by hydrogen reduction of $Cu^{2+}$ from ammoniacal copper sulfate solution on alumina core using autoclave. The copper reduction rate and the properties of copper layer were investigated using Scanning Electron Microscope(SEM), X-ray diffractometer, size and chemical analyzers. The reduction rate of $Cu^{2+}$ showed the maximum value when the molar ratio of [$NH_3$]/[$Cu^{2+}$] was 2. In order to prevent the agglomeration of Cu powder and ethane reduction rate, $Fe^{2+}$ and anthraquinone which act as catalysis were added in the solution. Catalysis was effectively chanced with the addition of two elemerts at a time. Optimum conditions obtained in this study were hydrogen reduction temperature of 205$^{\cire}C$, stirring speed of 500 rpm and hydrogen partial pressure of 300 psi. Obtained $Cu-Al_20_3 $ composite Powders were found to have the uniform and continuous copper coating layer of nodule shape with 3~5 $\mu$m thickness.

• Journal of Korea Foundry Society
• /
• v.15 no.4
• /
• pp.416-421
• /
• 1995

Recently Al-Cu-P alloys are used to refine primary Si of hypereutectic Al-Si alloys. Because it has inside AlP compound that acts as nucleation site in the melt, Al-Cu-P alloy has good refinement effect in lower holding temperature and after shoter holding times. In this study Al-Cu-P refinement agent was made by mechanical alloying method. When Al-13.5wt%Cu-1.5wt%P was alloyed mechanically for 30hr in Ar atmosphere by high energy ball mill, it had the refinement effect that showed primary Si size of about $30{\mu}m$ in Al-20wt%Si at $760^{\circ}C$, treated for 15min.

• Bulletin of the Korean Chemical Society
• /
• v.31 no.5
• /
• pp.1241-1246
• /
• 2010

Ternary Cu/ZnO/$Al_2O_3$ catalysts were prepared by a co-precipitation method. The precursor structures were monitored during the aging. The first precipitate structure was amorphous georgeite, which transformed into the unknown crystalline structure. The transition crystalline structure was assigned to the crystalline georgeite, which was suggested with elemental analysis, IR and XRD. The final structure of precursors was malachite. The Cu surface area of the resulting Cu/ZnO/$Al_2O_3$ was maximized to be 30.6 $m^2$/g at the aging time of 36 h. The further aging rapidly decreased Cu surface areas of Cu/ZnO/$Al_2O_3$. ZnO characteristic peaks in oxide samples almost disappeared after 24 h aging, indicating that ZnO was dispersed in around bulk CuO. TOF of the prepared catalysts of the Cu surface area ranges from 13.0 to 30.6 $m^2/g_{cat}$ was to be 2.67 ${\pm}$ 0.27 mmol/$m^2$.h in methanol synthesis at the condition of $250^{\circ}C$, 50 atm and 12,000 mL/$g_{cat}$. h irrespective of the XRD and TPR patterns of CuO and ZnO structure in CuO/ZnO/$Al_2O_3$. The pH of the precipitate solution during the aging time can be maintained at 7 by $CO_2$ bubbling into the precipitate solution. Then, the decrease of Cu surface area by a long aging time can be prevented and minimize the aging time to get the highest Cu surface area.

• Korean Journal of Materials Research
• /
• v.13 no.1
• /
• pp.59-63
• /
• 2003

The microstructural characteristics of $Al_2$$O_3$/Cu composites hot-pressed at different temperatures for atmosphere switching from $H_2$to Ar have been studied. When the composite atmosphere was switched at $1000^{\circ}C$ it led to more homogeneous microstructure than when the atmosphere was switched at $1450^{\circ}C$. The strong sensitivity of Cu to atmosphere, especially the oxygen content in the atmosphere, was found to be responsible for the observed change, based upon the interfacial phenomena related to the formation of $CuAlO_2$. The practical implication of these results is that an optimum processing condition for the design of homogeneous microstructure and stable properties can be established.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2000.11a
• /
• pp.20-20
• /
• 2000

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 1999.10a
• /
• pp.45-46
• /
• 1999

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 1999.04a
• /
• pp.28-28
• /
• 1999

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2002.04b
• /
• pp.10-10
• /
• 2002

• Journal of the Korean Vacuum Society
• /
• v.3 no.1
• /
• pp.59-64
• /
• 1994

극소전자 디바이스의 고집적화와 더불어 박막배선의 선폭은 0.5$\mu$m이하까지 축소되며 초고집적 submicron 박막금속화가 진행되고 있다. 미세회로에 적용되어지는 배선재료는 인가되는 고전류밀도로 인하여 electromigration 에 의한 결함이 쉽게 발생한다는 단점이있다. 금속박막 전도체위의 dielectric overlayer는 electromigration 에 대한 passivation 효과를 보여 극소전자 디바이스의 평균수명을 향상시 킨다.본 연구에서는 박막금속화에서 dielectric overlayer의 passivation 효과를 알아보기 위하여 약 3000 $\AA$ 두께의 Al,Al-1%Si, Ag 그리고 Cu 박막배선위에 증착하여 SiO2절연보호막의 유무에 따른 박막배선 의 수명변화 및 신뢰도를 측정하였다. 박막배선에 인가된 전류밀도는 1x106 A/cm2와 1x107 A/cm2 이었다. SiO2 dielectric overlayer는 Al,Al-1%Si Ag. Cu 박막배선에서는 electromigration에 대한 보호막 혀과를 보이며 평균수명을 모두 향상시킨다. SiO2 passivation 효과는 Al, Ag, Cu 박막중 Cu 박막배선에서 가 장 크게 나타났다. SiO2 dielectric overlayer가 형성되지 않은 경우 Al 박막배선의 수명이 가장 긴 것으 로 나타났으나 SiO2 가 형성된 경우는 Cu 박막배선의 수명이 가장 길게 나타났다.

• Journal of Korea Foundry Society
• /
• v.15 no.4
• /
• pp.408-415
• /
• 1995

Polycrystalline Al-Cu ribbons were produced by planar flow casting(PFC). Solidification behavior and microstructual changes of the ribbons have been investigated as a function of ribbon thickness and processing parameters. The solidification front velocity, V varies within the ribbon, decreasing with increasing the distance, S from the wheel-contact surface, as $V=17.6S^{-1}$. In Al-4.5wt%Cu alloy, rapid decrease in solidification velocity toward the free surface causes a change in solidification morphology from planar to cellular, and finally, to dendritic. The length and inclination of columnar grains solidified with planar front were related to the wheel velocity. The transition from particulate degenerate eutectic structure to regular lamellar eutectic structure was observed to be caused by a difference of the relative growth velocites of ${\alpha}-Al$ and ${\theta}$ during solidification in the Al-Cu eutectic alloy.