• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.38.1-38.1
• /
• 2010

The trend to thinner crystalline silicon solar wafers in production of solar cells investigates re-evolution of back surface field (BSF) formation. We have studied mechanisms of back contact formation in Al evaporation and screen printed Al paste for Si solar cells by TEM analysis. We observed that Si diffuse into Al during heat up. The Si diffusion process made vacancies in Si wafer. The Al began to seep into the Si wafer (Al spike). During heat down, the Al spike were shrink which causes the doped region (BSF).

• Korean Journal of Materials Research
• /
• v.21 no.5
• /
• pp.243-249
• /
• 2011

To reduce manufacturing costs of crystalline silicon solar cells, silicon wafers have become thinner. In relation to this, the properties of the aluminium-back surface field (Al-BSF) are considered an important factor in solar cell performance. Generally, screen-printing and a rapid thermal process (RTP) are utilized together to form the Al-BSF. This study evaluates Al-BSF formation on a (111) textured back surface compared with a (100) flat back surface with variation of ramp up rates from 18 to $89^{\circ}C$/s for the RTP annealing conditions. To make different back surface morphologies, one side texturing using a silicon nitride film and double side texturing were carried out. After aluminium screen-printing, Al-BSF formed according to the RTP annealing conditions. A metal etching process in hydrochloric acid solution was carried out to assess the quality of Al-BSF. Saturation currents were calculated by using quasi-steady-state photoconductance. The surface morphologies observed by scanning electron microscopy and a non-contacting optical profiler. Also, sheet resistances and bulk carrier concentration were measured by a 4-point probe and hall measurement system. From the results, a faster ramp up during Al-BSF formation yielded better quality than a slower ramp up process due to temperature uniformity of silicon and the aluminium surface. Also, in the Al-BSF formation process, the (111) textured back surface is significantly affected by the ramp up rates compared with the (100) flat back surface.

• Current Applied Physics
• /
• v.18 no.12
• /
• pp.1600-1604
• /
• 2018

This paper reports on a systematic and quantitative assessment of light induced degradation (LID) and regeneration in full Al-BSF and passivated emitter rear contact cells (PERC) along with the fundamental understanding of the difference between the two. After LID, PERC cells showed a much greater loss in cell efficiency than full Al-BSF cells (~0.9% vs ~0.6%) because the degradation in bulk lifetime also erodes the benefit of superior BSRV in PERC cells. Three main regeneration conditions involving the combination of heat and light ($75^{\circ}C/1\;Sun/48h$, $130^{\circ}C/2\;Suns/1.5h$ and $200^{\circ}C/3\;Suns/30s$) were implemented to eliminate LID loss due to BO defects. Low temperature/long time ($75^{\circ}C/48h$) and high temperature/short time ($200^{\circ}C/30s$) regeneration process was unable to reach 100% stabilization. The intermediate temperature/time ($130^{\circ}C/1.5h$) generation achieved nearly full recovery and stabilization (over 99%) for both full Al-BSF and PERC cells. We discussed the effect of temperature, time and suns in regeneration mechanism for two cells.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.394-394
• /
• 2011

최근 태양전지의 후면에서 통상적으로 사용되는 Al을 이용한 후면의 BSF형성과 그에 관한 연구보다 계면의 recombination을 줄이기 위하여 passivation 특성이 좋은 층을 후면에 형성하고 국부적으로 BSF를 형성하는 back contact을 형성하여 특성을 향상시키는 연구가 많이 이루어지고 있다. 본 연구는 이러한 local back contact을 boron-BSF를 이용하여 형성하고 passivation layer는 oxide를 이용한 구조를 SILVACO 2-dimension simulation을 이용하여 그 특성을 분석하였다. Boron-local back contact 구조에서 boron-BSF의 doping concentration, depth, lateral width, boron-BSF spacing 가변을 통해 태양전지의 특성변화에 대해서 spectrum response를 통한 QE 분석 및 I-V를 분석하여 최적화하였다.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.101.2-101.2
• /
• 2010

태양전지에서 고효율을 얻기 위해서는 알루미늄 원자의 확산에 의한 불순물층으로서 p+층이 필수적이다. P+층은 형성전자의 재결합을 방지하고, 생성 캐리어의 수집 효율을 향상시키는 BSF(Back Surface Field) 효과의 역할을 한다. 도포된 알루미늄 페이스트가 부족할 경우 BSF효과가 나타나지 않으며 과할 경우 웨이퍼가 휨이 발생하여 최적 인쇄도포량이 중요하다. 본 연구에서는 레오미터 측정조건을 스크린 프린팅 인쇄 조건과 유사하게 진행하여 저장탄성율(G') 과 손실탄성율(G")의 관계를 살펴보았다. 회복단계에서 G'>G" 이고 Cross point가 없을 경우 도포량이 1.8g 이상이였으며, 웨이퍼의 휨(bowing)이 크게 발생하였고, 이와 반대로 회복시 20초 후에 Cross point가 나타난 경우 10% 정도 도포량 감소와 함께 휨 발생도 1 mm 이하로 양호한 특성을 확인할 수 있었다.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.122.2-122.2
• /
• 2011

결정질 태양전지 제작에서, passavtion은 표면의 반사도를 줄여주는 반사 방지막의 역할과 표면의 dangling bond를 감소시켜, 표면 재결합 속도를 줄이고 minority carrier lifetime을 증가하는 데 큰 영향을 미친다. 그렇기 때문에 저가형 고효율 태양전지 제작에서 우수한 특성을 가지는 passivation막은 매우 중요한 이슈이다. 본 연구에서는 LBC(local back contact) 구조를 가지는 단결정 태양전지 후면에, 기존의 Full Al-BSF의 passivation 막을 SiNx와 ONO passivation 막으로 각각 대체하여, LBC 구조에서 더 적합한 passivation 막을 찾고자 하였다. SiNx와 ONO passivation 막은 단결정 LBC 구조 태양전지 후면에 각각 형성되었고 $800^{\circ}C$, 20 sec 조건으로 소성되었다. 실험결과는 minority carrier lifetime과 surface recombination velocity로 관찰하였다. 그 결과, SiNx passivation 막의 표면 재결합 속도는 29.7cm/s이고, ONO passivation 막의 표면 재결합 속도는 24.5cm/s로, Full Al-BSF 표면 재결합 속도 750cm/s에 비해 더 적합한 passivation 막으로 확인할 수 있었다. 결과적으로 SiNx,ONO passivation 막이 Full Al-BSF보다 전극에 수집되는 캐리어의 양이 많아짐에 따라 효율향상을 가져올 수 있을 것이다.

• Journal of the Semiconductor & Display Technology
• /
• v.12 no.3
• /
• pp.47-51
• /
• 2013

Current research trends of solar cells has focused on the high conversion efficiency and low-cost production technology. Passivation technology that can be easily adapted to mass production. Therefore, this study conducted experiments with aim of the following two methods for the fabrication of high-efficiency crystalline silicon solar cells. In the first task, an attempt is formation of local Al-BSF to a number of locally doped dots to increase the conversion efficiency of solar cells to reduce the loss of $V_{oc}$ overcome. The second major task, rear surface apply in $Al_2O_3/SiN_x$ stack layer, $Al_2O_3$ prominent negative fixed charge characteristics. As the result of task, Local Al-BSF and $Al_2O_3/SiN_x$ stack layer applied to the p-type single crystalline silicon solar cells, the average $V_{oc}$ of 644mV, $I_{sc}$ of 918mV and conversion efficiency of 18.70% were obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.7
• /
• pp.571-574
• /
• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• Current Photovoltaic Research
• /
• v.4 no.1
• /
• pp.12-15
• /
• 2016

Screen printing technique followed by firing has commonly been used as metallization for both laboratory and industrial based solar cells. In the solar cell industry, the firing process is usually conducted in a belt furnace and needs to be optimized for fabricating high efficiency solar cells. The printed-Al layer on the silicon is rapidly heated at over $800^{\circ}C$ which forms a layer of back surface field (BSF) between Si-Al interfaces. The BSF layer forms $p-p^+$ structure on the rear side of cells and lower rear surface recombination velocity (SRV). To have low SRV, deep $p^+$ layer and uniform junction formation are required. In this experiment, firing process was carried out by using conventional tube furnace with $N_2$ gas atmosphere to optimize $V_{oc}$ of laboratory cells. To measure the thickness of BSF layer, selective etching was conducted by using a solution composed of hydrogen fluoride, nitric acid and acetic acid. The $V_{oc}$ and pseudo efficiency were measured by Suns-$V_{oc}$ to compare cell properties with varied firing condition.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.91.1-91.1
• /
• 2010

There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).