• 한국전기전자재료학회논문지
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• 제26권3호
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• pp.246-251
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• 2013

Screen printing is commonly used to form the front/back electrodes in silicon solar cell. But it has caused high resistance and low aspect ratio, resulting in decreased conversion efficiency in solar cell. Recently the plating method has been combined with screen-printed c-Si solar cell to reduce the resistance and improve the aspect ratio. In this paper, we investigated the effect of light induced silver plating with screen-printed c-Si solar cells and compared their electrical properties. All wafers were textured, doped, and coated with anti-reflection layer. The metallization process was carried out with screen-printing, followed by co-fired. Then we performed light induced Ag plating by changing the plating time in the range of 20 sec~5min with/without external light. For comparison, we measured the light I-V characteristics and electrode width by optical microscope. During plating, silver ions fill the porous structure established in rapid silver particle sintering during co-firing step, which results in resistance decrease and efficiency improvement. The plating rate was increased in presence of light lamp, resulting in widening the electrode with and reducing the short-circuit current by shadowing loss. With the optimized plating condition, the conversion efficiency of solar cells was increased by 0.4% due to decreased series resistance. Finally we obtained the short-circuit current of 8.66 A, open-circuit voltage of 0.632 V, fill factor of 78.2%, and efficiency of 17.8% on a silicon solar cell.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.193-193
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• 2012

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is the most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. Single-chamber PECVD system for a-Si:H solar cell manufacturing has the advantage of lower initial investment and maintenance cost for the equipment. However, in single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of single-chamber PECVD system. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. In order to remove the deposited B inside of the plasma chamber during p-layer deposition, a high RF power was applied right after p-layer deposition with SiH4 gas off, which is then followed by i-layer, n-layer, and Ag top-electrode deposition without vacuum break. In addition to the p-i interface control, various interface control techniques such as FTO-glass pre-annealing in O2 environment to further reduce sheet resistance of FTO-glass, thin layer of TiO2 deposition to prevent H2 plasma reduction of FTO layer, and hydrogen plasma treatment prior to n-layer deposition, etc. were developed. The best initial solar cell efficiency using single-chamber PECVD system of 10.5% for test cell area of 0.2 $cm^2$ could be achieved by adopting various interface control methods.

• 전기화학회지
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• 제10권4호
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• pp.283-287
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• 2007

한국에너지기술연구원에서는 중온 ($700{\sim}800^{\circ}C$) 작동용 연료극 지지체 평관형 SOFC 스택을 구성하는 단위 번들을 개발했다. 연료극 지지체 평관형 셀은 Ni/YSZ 서밋 연료극 지지체 튜브, 8몰% $Y_2O_3$ stabilized $ZrO_2$ (YSZ) 전해질, $LaSrMnO_3$ (LSM)과 LSM-YSZ composite 및 $LaSrCoFeO_3(LSCF)$로 구성된 다중층 공기극으로 구성됐다. 제조된 연료극지지체 평관형 셀은 유도 브레이징 법에 의해 페리틱 (ferritic) 금속 캡에 접합됐고, 공기극의 전류집전을 위해 공기극 외부에 Ag 선 및 $La_{0.6}Sr_{0.4}CoO_3(LSCo)$ paste를 이용했으며, 연료극의 전류집전은 Ni felt, wire, 그리고 paste를 이용했다. 단위 번들을 만들기 위한 연료극 지지체 평관형 셀의 반응 면적은 셀 당 $90\;cm^2$ 이었으며, 2개의 셀이 병렬로 연결되어 1개의 단위 번들이 됐고, 총 12개의 단위 번들이 직렬로 연결되어 스택을 구성한다. 공기 및 3%의 가습된 수소를 산화제 및 연료로 사용한 단위 번들의 운전 결과 최대 성능은 $800^{\circ}C$에서 $0.39\;W/cm^2$의 출력이 나타났다. 본 연구를 통해 연료극 지지체 평관형 SOFC 셀의 기본 기술과 KIER 만의 독특한 연료극 지지체 평관형 SOFC 스택을 구성하는 단위 번들의 개념을 확립할 수 있었다.