• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.4
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• pp.57-64
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• 1995

Three models for the transformation of ferrite chip noise filter that has jagged type of electrode into cylinderical ferrite beadfilter were presented. The properties of filters were also calculated based on the proposed models. The measured properties of ferrite chip noise filter with jagged-type electrode fabricated with Ag electrode and Ni-Zn ferrite revealed that the model 3 was the best one to describe the behavior of filters. In particular, the calculated values of model 3 agreed well with measured ones as functions of electrode patterns and chip thickness. The present study showed that the properties of fiters could be designed by theoretical models and fabricated with required characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.198-201
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• 1996

In order to investigate control factors to critical current density, Ag sheathed Bi2223 superconducting tapes were fabricated using PIT process. Optimizing the reduction ratio of rolling, critical current density 7f rolled Bi2223 tape could be improved with the value of 15,000 A/$\textrm{cm}^2$(77 K, zero field). The correlation between J$\_$c/ and work inhomogeneity was revealed as a dependence of COV of measured oxide layer thickness.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.939-940
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• 2006

An integrated inductor using the low-temperature co-fired ceramics(LTCC ) technology for low-power electronics was fabricated. In the inductor NiZn ferrite sheet(${\mu}_r=230$), was embedded to increase inductance. The inductor has Ag spiral coil with 14 turns($7turns{\times}2layers$), a dimension of 0.6mm in width, 10um in thickness, and 0.15mm pitch. To evaluate the inductance, including the parasitic resistance, the fabricated inductor was calculated and measured. It was confirmed that calculated values were very close to the measured values. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1W output power and up to 0.5MHz switching frequency using the inductor fabricated was develop.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.155-158
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• 1998

MLS capacitor with lipid ultra thin films were deposited by Langmuir-Blodgett (LB) method on the sillicon wafer. The current versus voltage and capacitance versus voltage relationships are depend on the applied voltage, electrode area and electrode materials. LB films deposited were made of L-$\alpha$-DLPC, the 1 layer's thickness of 35$\AA$ was measured by ellipsometer. And MLS capacitor with different electrode materials, the work function of these materials was investigated to increase the leakage current. The result indicated the lower leakage current and very high saturation value of capacitance was reached within 700-800 pF when the two electrode was Ag. And $\varepsilon$$_1$, $\varepsilon$$_2$ versus photon energy showed good film formation.

• Proceedings of the KSR Conference
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• 2002.05a
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• pp.549-554
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• 2002

Recently, interest in hygiene has been arouse in the health care field. Consequently, Filters with antibacterial agent applied to improve air quality by sterilizing bacteria, fungi, etc. We actually installed antibacterial air filter containing 2.5wt%Ag zeolite on the air intake route to air-conditioner in passenger cu, and evaluated filter's performance on antibacterial effect. By the microbe liquid spattering method, we found that the antibacterial air filter has notably sufficient antibacterial efficiency against standard strains and wild type strains. Antibacterial effect was observed at whole area of filter media by zone of inhibition test. The evaluation of microbe quantity was conducted through mixing dilution plate culture method. In comparison with ordinary filter, the amount of germs attached on antibacterial air filters was larger. The amount of germs attached on ordinary filters was very small since ordinary filters contained less dust. In comparison in antibacterial air filter with thickness, the amount of germs attached on 9mm filter was smaller than that of on 6mm filter. i.e. thicker filter, superior efficiency.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.55 no.10
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• pp.534-539
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• 2006

An integrated inductor using the low-temperature co-fired ceramics(LTCC) technology for low-power electronics was fabricated. In the inductor NiZn ferrite sheet$({\mu}_r=230)$, was embedded to increase inductance. The inductor has Ag spiral coil with 14 turns$(7turns{\times}2layers)$, a dimension of 0.6mm in width, 10um in thickness, and 0.15mm pitch. To evaluate the inductance, including the parasitic resistance, the fabricated inductor was calculated and measured. It was confirmed that calculated values were very close to the measured values. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC boost DC/DC converter with 1W output power and up to 0.5MHz switching frequency using the inductor fabricated was developed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1115-1121
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• 1998

MLS capacitor with lipid ultra thin films were deposited by Langmuir-Blodgett (LB) method on the silicon wafer. The current versus voltage and capacitance versus voltage relationships are depend on the applied voltage, electrode area and electrode materials. LB films deposited were made of L-$\alhpa$-DLPC, the 1 layer’s thickness of 35${\AA}$ was measured by ellipsometer. And MLS capacitor with different electrode materials, the work function of these materials was investigated to increase the leakage current. The result indicated the lower leakage current and very high saturation value of capacitance was reached within 700-800 pF when the two electrode was Ag. And $\varepsilon$1, $\varepsilon$2 versus photon energy showed good film formation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.58-59
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• 2007

We have fabricated top-emission. organic ligth-emitting diodes in a structure of Glass/Al/2-TNATA/TPD/$Alq_3$/LiF/Al/Ag. By varying a film thickness of 2-TNATA and TPD, current efficiency, luminance efficiency, and viewing angle dependence of the device were measured. The top device using $Alq_3$ showed electroluminescent peak wavelengths of 522nm and 505nm at $0^{\circ}$ and $60^{\circ}$ viewing angles, respectively. It is thought that a microcavity effect affects on peak wavelength position for different viewing angles.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.