• Journal of Welding and Joining
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• v.19 no.2
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• pp.176-181
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• 2001

Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.356-360
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• 2015

The specific role of current collectors was investigated at the electrolyte/electrode interface of solid oxide fuel cells (SOFCs). Ag grids were fabricated as current collectors using electrohydrodynamic (EHD) jet printing for precise control of the grid geometry. The Ag grids reduced both the ohmic and polarization resistances as the pitch of the Ag grids decreased from $400{\mu}m$ to $100{\mu}m$. The effective electron distribution along the Ag grids improved the charge transport and transfer at the interface, extending the active reaction sites. Our results demonstrate the applicability of EHD jet printing to the fabrication of efficient current collectors for performance enhancement of SOFCs.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.71-77
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• 2007

In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.

• Journal of Scientific & Technological Knowledge Infrastructure
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• s.14
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• pp.32-41
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• 2004

액세스그리드(AG)는 기존 화상회의 시스템과는 달리 그리드(Grid) 기술을 기반으로 원거리 사용자들에게 실재감 있는 그룹간 협업 연구 환경을 제공하는 시스템이다. 본 고에서는 전 세계를 중심을 활발히 전개되고 있는 AG의 기본 개념, 구축 및 운용법, 국내 AG 구축 및 연구현황에 대해 소개하고, 마지막으로 AG활성화방안을 살펴보고자 한다.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.114.1-114.1
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• 2011

Electrical sintering of the front electrode for crystalline silicon solar cells was performed applying a constant DC current to the printed lines. Conducting lines were printed on glass substrate by a drop-on-demand (DOD) inkjet printer and silver nanoparticle ink. Specific resistance and microstructure of sintered silver lines and were measured with varying DC current. To find the relation between temperature increase with changing applied current and specific resistance, temperature elevation was also calculated. Sintering process finished within a few milliseconds. Increasing applied DC current, specific resistance decreased and grain size increased after sintering. Achieved minimum specific resistance is approximately 1.7 times higher than specific resistance of the bulk silver.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.254-256
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• 2007

The Solar energy is either used as a solar thermal energy or converted to electrical power through power conversion system. The latter method is defined as a solar cell changing the solar energy into the direct electric energy or power conversion that convert the dc power into ac power.For the solar cell to be a practical alternative energy, the study should be focused not only on the solar cell ,but also the power conversion system for common power source. In this study, we get the suitable power to common load ,using Ag Grid DSC(Dye-sensitized solar cell). Our purpose is to achieve the common solar cell power generation system ,using converter and PWM(Pulse width modulation) inverter system controled by DSP.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.123-127
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• 2007

Up sizing of dye-sensitized solar cell(DSC) is the important technology to bring about commercialization of DSC. Several studies to obtain a stable large area DSC have been investigated in overseas laboratories, but have been hardly done in our country. In this study, up sizing technology of dye sensitized solar cells(DSCs) was investigated. We investigated low dark current materials for the current collecting grid. From the result, a new DSC module with metal grid was designed, and fabricated. For a new interconnection, both working and counter electrodes are alternately coupled on 10[cm]$\times$7[cm] substrate. We have achieved 68% of fill factor and photoelectric conversion efficiency of around 2.6% as the best results of new designed DSC structure.

• 한국HCI학회:학술대회논문집
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• 2007.02a
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• pp.262-267
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• 2007

다자간 분산형 협업 시스템인 Access Grid(AG)는 IP 멀티캐스트 네트워크상에서 여러 사용자들 간에 영상, 음성 및 다양한 데이터의 공유를 통해 상호 의사소통이 가능한 공동 작업환경을 제공하기 위해 개발되었다. 멀티캐스트를 사용함으로써 AG는 대역폭 효율적으로 다수 사용자 사이의 의사소통 환경을 제공하고 있다. 그러나 IP 멀티캐스트의 설정 및 관리상 복잡성으로 인해 이를 지원하지 않는 네트워크가 다수 존재한다. 이는 AG를 이용한 협업 서비스를 이용하는 데에 큰 장애물이 되고 있다, 본 논문에서는 이러한 멀티캐스트 연결성 문제에 대한 해결책으로 응용 계층의 멀티캐스트 터널링 프로토콜인 UMTP (UDP multicast tunneling protocol) 를 확장한 멀티캐스트 연결성 솔루션인 AG Connector를 제안한다.