• 전기의세계
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• v.20 no.2
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• pp.9-14
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• 1971

N type single crystal CdTe is grown by doping Gallium as 0.01 percent, by using zone melting method. And also p type CdTe is grown by doping Ag, Sb, and Te as 0.01%. Resistivity and Concentration of the n.p type single crystal are measured. And then Li ions are implanted on the n type CdTe by high voltage accellerator with different amount of impurity. Indium is evaporated on the p type in high vacuum condition. These sample are heated so as to make P-N Junction in Argon gas flow. Electrical properties for solar cell are investigated. Photovoltage and current are found to be varyed according to following factor: 1) amount of impurity 2) diffusion thickness 3) temperature and time for making P-N junction. Efficiency of the P-N Junction evaporated Indium is 6.5 when it is heated at 380.deg. C for 15 minutie.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Weed & Turfgrass Science
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• v.2 no.1
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• pp.70-75
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• 2013

Seven medicinal plant extracts were tested for antifungal activities against six species of the major turfgrass pathogenic fungi (Colletotrichum graminicola, Pythium spp., Rhizoctonia cerealis, Rhizoctonia solani AG1-1, Rhizoctonia solani AG2-2, and Sclerotinia homoeocarpa) using paper disk diffusion method. Three medicinal plant extracts, including Pinus densiflora showed antifungal activities. In suppression of mycelium growth test, on medium adding P. densiflora extract showed that inhibition rate of mycelium growth were above 80% in 10 mg/10 ml concentration of the extract. The inhibition rate of Pythium spp. was 100% and C. graminicola was 84.3% in 10 mg/10 ml concentrations of P. densiflora extract, respectively. In particularly, the inhibition rate of Pythium spp. was 89.5% in 2 mg/10 ml concentrations of P. densiflora extract. As a result, P. densiflora extract showed high antifungal activity to Pythium spp. and C. graminicola of the turfgrass pathogen in in vitro test.

• Korean Chemical Engineering Research
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• v.50 no.5
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• pp.933-937
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• 2012

In the present study, we evaluate the sensitivity and optimal stripping voltammetry (SV) conditions of copper (Cu), which is one of the main trace heavy metals inducing the environmental contamination, using carbon nanotube (CNT) electrode. In addition, the reaction mechanism of stripping reaction of Cu is investigated. The electrochemical analyses such as squarewave stripping voltammetry (SWSV) and linear scan voltammetry (LSV) are used for the evaluations. As a result of that, the best SWSV conditions like squarewave amplitude of 15 mV, frequency of 60 Hz, deposition potential of -1.0V vs. Ag/AgCl and deposition time of 200s are determined with the measured Cu sensitivity of $1.824{\mu}A/{\mu}M$. As a driving force affecting the stripping reaction of Cu, surface reaction is more dominant one than diffusion. These results are compared with other reference results and it is confirmed that our suggested CNT electrode gives rise to better Cu sensitivity result than other references.

• Asian Journal of Turfgrass Science
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• v.24 no.2
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• pp.176-181
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• 2010

Brown patch (Rhizoctonia solani AG1-1), dollar spot (Sclerotinia homoeocarpa), pythium blight (Pythium spp.), anthracnose (Colletotrichum graminicola), yellow patch (Rhizoctonia cerealis) and Zoysia patch (Rhizoctonia solani AG2-2) are the major turfgrasses diseases in Korea. In this study, 23 medicinal plant extracts were tested for antifungal activities against turfgrass pathogenic fungi. In paper disk diffusion method, 12 medicinal plant extracts, including Sophora flavescens, showed antifungal activity. Also, in the test of antifungal activity on media contained the extracts of S. flavescens, Curcuma longa, Rheum undulatum, Coptis chinensis and Asiasarum sieboldi showed above 80% inhibitory effects on the mycelial growth in 110 mg/10 ml concentration of the extracts. S. flavescens, in particularly, showed antifungal activity against the six turfgrass pathogenic fungi. The inhibition rate of S. homoeocarpa was 100% in 10 mg/10 ml, 5 mg/10 ml and 2 mg/10 ml concentrations of C. longa extract. In case of Pythium spp., the extracts of S. flavescens, R. undulatum and C. chinensis showed 100 % inhibition rate on the test media.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.29-33
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• 2011

The current density in copper electroplating is directly related with the productivity and then to increase the productivity, the increase in current density is required. To obtain the high mass flow rate, rotating disk electrode(RDE) was employed. High rotational speed in RDE can increase the mass flow rate and then high speed electroplating was possible using RDE to control mass flow. Two types of cathode were used. One is RDE and another is rotating cylindrical electrode(RCE). A constant-current, constant-voltage and linear sweep voltammetry were applied to investigate current and voltage relationship. The maximum current density without evolution of hydrogen gas was increased with rotational speed. Over 400 rpm, maximum current density was higher than 1000 A/$m^2$. The diffusion coefficients of copper calculated from the slope of the plots are $5.5{\times}10^6\;cm^2\;s^{-1}$ at $25^{\circ}C$ and $10.5{\times}10^6\;cm^2\;s^{-1}$ at $62^{\circ}C$. The stable voltage without evolution of hydrogen gas was -0.05 V(vs Ag/AgCl). Additives were added to prevent dendritic growth on cathode deposits. The surface roughness was analyzed with UV-Vis Spectrophotometer. The reflectance of the copper surface over 600 nm was measured and was related with the surface roughness. As the surface roughness improved, the reflectance was also increased.

• Membrane Journal
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• v.25 no.5
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• pp.398-405
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• 2015

Facilitated transport is considered to be a possible solution to simultaneously improve permeability and selectivity, which is challenging in normal polymeric membranes based on solution-diffusion transport only. We investigated the effect of adding mesoporous $TiO_2$ ($m-TiO_2$) upon the separation performance of facilitated olefin transport membranes comprising poly(vinyl pyrrolidone), Ag nanoparticles, and 7,7,8,8-tetracyanoquinodimethane as the polymer matrix, olefin carrier, and electron acceptor, respectively. In particular, $m-TiO_2$ was prepared by means of a facile, mass-producible method using poly(vinyl chloride)-g-poly(oxyethylene methacrylate) graft copolymer as the template. The crystal phase of $m-TiO_2$ consisted of an anatase/rutile mixture, of crystallite size approximately 16 nm as determined by X-ray diffraction. The introduction of $m-TiO_2$ increased the membrane diffusivity, thereby increasing the mixed-gas permeance from 1.6 to 16.0 GPU ($1GPU=10^{-6}cm^3$(STP)/($s{\times}cm^2{\times}cmHg$), and slightly decreased the propylene/propane selectivity from 45 to 37. However, both the mixed-gas permeance and selectivity of the membrane containing $m-TiO_2$ rapidly decreased over time, whereas the membrane without $m-TiO_2$ had more stable long-term performance. This difference might be attributed to specific chemical interactions between $TiO_2$ and Ag nanoparticles, causing Ag to lose activity as an olefin carrier.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.175-183
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• 2022

With the expansion of the automobile market, the demand for Nd as an essential rare earth material for automobile motors is rapidly increasing. Research on the calcio-thermic reduction process between Nd₂O₃ and calcium-based alloys has been extensively studied in order to manufacture Nd. In this study, Ca-Cu, as a reducing for Nd₂O₃, was prepared by electrolysis in CaCl₂ molten salt. Cu wire and graphite were employed as a working electrode and a counter electrode for electrolysis reaction, respectively. The reference electrode was manufactured by putting Ag wire in a mixture of AgCl and CaCl₂ at a ratio of 1:99 mol%. The cyclic voltammetry results showed that the deposition of Ca²⁺ on the surface of working electrode was observed from a potential of -1.8 V, and the reduction potential of Ca²⁺ decreased as the reaction temperature increased. The diffusion coefficient of Ca²⁺ calculated by the chronoamperometry experiment was found to be 5.4(±6.8)×10^-6 cm²/s. In addition, Ca-Cu liquid alloy was prepared by applying a constant potential to Cu electrodes. The element ratio of Ca-Cu alloy formed by applying a potential of -2.0 V was found to Ca:Cu=1:4.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.