• Transactions of Materials Processing
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• v.6 no.2
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• pp.136-144
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• 1997

(Ag-10%Ni)/Cu clad metals for electric contact switch were fabricated by cold-roll bonding process. 2 or 3 passes of cold-rolling was carried out for each process to investigate the effect of the rolling passes on the bonding property. The effect of the annealing temperature of copper before the cold-roll bonding on the bond strength was also studied. The specimen bonded with copper annealed below 30$0^{\circ}C$ before roll bonding showed good bond strength. This is because high stored energy in copper promoted the short range diffusion and the grain refinement of copper by the static recrystallization increased the degree of the interfacial coherency. The maximum peel strength of clad metals bonded with Cu annealed below 30$0^{\circ}C$ was 120N.

• Journal of Korean Ophthalmic Optics Society
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• v.3 no.1
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• pp.217-222
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• 1998

Coating films of $SiO_2-TiO_2-AgO$ have been prepared on soda-lime-silica slide glasses and single crystal silicon wafer by the sol-gel method using a spin-coating technique. Commercially available tetraethyl orthosilicate, titanium trichloride, and silver-nitrates were used as starting materials. The heat treatment temperature of this coating films was $500^{\circ}C$ properly, obtained from TG-DTA result. The films with thickness of 310 nm were prepared by 5 times coating. In the case of l0 mol% AgO, the film showed a crack-free and smooth surface, but the higher Ago content exhibited the more pin hole and the segregated cluster of AgO. The IR absorbance of the films decreased in the range of 400 nm to 700 nm with the increase of annealing temperature. And the reflectance of the coating films decreased and the color was changed light yellow to white yellow with the increase of Ago content.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.262-267
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• 2000

To tap the possibility of exploiting the precipitates as flux-pinning center in the Bi-2223 superconducting system, as-received Bi-2223/Ag tapes with the starting composition of Bi$_{1.8}$Pb$_{0.4}$Sr$_2$Ca$_{2.2}$Cu$_3$O$_8$ were post-annealed at various temperature, oxygen partial pressure, and annealing time. The 2$^{nd}$ phases in the annealed specimen were analysed with XRD, SEM, TEM, and EDS. The size and the distribution of the precipitates such as (Ca,Sr)$_2$(Pb,Bi)O$_4$ and Bi$_{0.5}$Pb$_3$Sr$_2$Ca$_2$CuO$_{12+{\delta}}$ (3221) in the Bi-2223 matrix was controllable by varying heat-treatment condition without breaking the connectivity of the 2223 grains. The nano-size precipitates within the 2223 grains are conjectured as working as flux-pinning sites, resulting in increased J$_c$ value.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.403-403
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• 2011

결정질 태양전지는 태양전지 시장에 큰 서막을 장식하였다. 현재 여러 종류의 태양전지 기술들이 많이 나오고 있지만 결정질 태양전지는 변환 효율이 좋고 신뢰성이 높아서 높은 시장 점유율을 차지하고 있다. 하지만 응용 분야가 적고 기판 가격이 비싸다는 단점이 있다. 현재에는 응용분야 개선을 위하여 Flexible solar cell에 대한 연구가 활발하다. Flexible solar cell에 상부전극은 결정질 태양전지에서 사용되는 Ag나 Al 전극 대신 TCO 종류의 일종인 ITO를 많이 사용한다. Flexible Solar cell은 Organic Solar cell과 Amorphous Solar Cell 두 가지 범주를 가지고 있다. 본 연구에서는 Amorphous Solar Cell의 전극에 사용되는 ITO의 온도 Stress에 따른 특성을 연구함으로써 Engineer의 근본적인 이슈인 저비용, 고효율에 초점을 맞추어 소자특성을 확인해 보도록 한다. Glass에 E-beam evaporation 장비를 이용하여 ITO를 증착하였고 제작된 소자를 200, 250, 300, 350$^{\circ}C$의 온도변수를 두어 1시간동안 Annealing 하였다. 각 Annealing 온도에 따른 Sheet resistivity,와 visible 영역의 transmittant를 측정하였다. visible영역에서의 transmittant는 Annealing 200$^{\circ}C$에서 300$^{\circ}C$로 온도가 증가함에 따라 transmittant는 증가하다가 350$^{\circ}C$에서 감소하였다. Sheet resistivity의 경우 Annealing 200$^{\circ}C$에서 300$^{\circ}C$로 온도가 증가함에 따라 ITO의 Sheet resistivity가 줄어들다가 350$^{\circ}C$에서 증가하였다. 300$^{\circ}C$로 Annealing한 ITO가 가시광선 영역에서 transmittant가 가장 높은 80%로 측정 되었다. Sheet resistivity역시 300$^{\circ}C$로 Annealing한 ITO가 8${\Omega}/{\Box}$로 가장 낮았다. Annealing 온도가 ITO의 electrical 특성과 optical 특성에 변화를 주었음을 알 수 있었다. Resistivity가 낮은 ITO 전극으로 박막 셀을 제작한다면 좋은 효율을 얻을 수 있을 거라 생각된다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.

• Journal of IKEEE
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• v.27 no.1
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• pp.25-29
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• 2023

Effect of the processes of polysilazane solid electrolyte layer and silver (Ag) active electrode on the electrical characteristics of memristor was investigated. The memristor with the solid electrolyte annealed at higher temperature exhibited the higher set voltage and better memory retention characteristics than that annealed at lower temperature. The increase in the set voltage and the improvement of the memory retention characteristic at high annealing temperature were attributed to a reduction in the void density and an increase in the void uniformity inside the solid electrolyte, respectively. In the case where the polysilazane solution's concentration is high, the memristor exhibited rapid degradation of low resistive state even annealed at high temperature. Lastly, it was shown that the memristor with the solution-processed Ag active electrode showed WORM property unlike that with the vacuum-processed Ag active electrode. The WORM property was possibly due to morphological defects present in the solution-processed Ag active electrode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.329-332
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• 1999

In this paper, BST((Bao.&o,dTi0:3) thin films were deposited by the rf magnetron sputtering method on Pt/$SiO_2$/Si substrate. Pt, $RuO_2$, Ag, Cu films for the formation of top electrode were deposited on BST thm films. And then Top Electrodes/BST/Pt capacitors were annealed with rapid thermal annealing(RTA) at various temperature. We have investigated effect of post-annealing on the electrical properties such as dielectric constant and leakage current of the capacitors. It was found that electrical properties of the capacitors were greatly depended on the annealing temperatures as well as the materials of top electrodes. In BST thin films with Pt top electrode was annealed at $700^{\circ}C$. the dielectric constant was measured to the value of 346 at l[kHzl and the leakage current was obtained to the value of $8.76\times10^8$[A/$\textrm{cm}^2$] at the forward bias of 2[V].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.117-121
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• 2018

Perovskite solar cells have received increasing attention in recent years because of their outstanding power conversion efficiency (exceeding 22%). However, they typically contain toxic Pb, which is a limiting factor for industrialization. We focused on preparing Pb-free perovskite films of Ag-Bi-I trivalent compounds. Perovskite thin films with improved optical properties were obtained by applying an anti-solvent (toluene) washing technique during the spin coating of perovskites. In addition, the surface condition of the perovskite film was optimized using a multi-step thermal annealing treatment. Using the optimized process parameters, $AgBi_2I_7$ perovskite films with good absorption and improved planar surface topography (root mean square roughness decreased from 80 to 26 nm) were obtained. This study is expected to open up new possibilities for the development of high performance $AgBi_2I_7$ perovskite solar cells for applications in Pb-free energy conversion devices.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.45-51
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• 2001

The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1325-1326
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• 2007

We have demonstrated new functionalities of Ag doped chalcogenide glasses based on their capabilities as solid electrolytes. Formation of such amorphous systems by the introduction of silver via photo-induced diffusion in thin chalcogenide films is considered. The influence of silver on the properties of the newly formed materials is regarded in terms of diffusion kinetics and Ag saturation is related to the composition of the hosting material. Silver saturated is related to the composition of the hosting material. Silver saturated Ge-Ch glasses have been used in the formation of solid electrolyte which is the active medium in programmable metallization cell (PMC) devices. This paper concerns our more recent work on silver-doped germanium selenide electrolytes and describes the electrical characteristics of PMC devices made from these materials following annealing at $300^{\circ}C$.