• 대한금속재료학회지
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• 제48권11호
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 춘계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.3-5
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• 2001

Racetrack coils are used in many areas of superconductivity applications such as generators, motors, maglev, wiggler magnets and so on. The fabrication and characteristics of race-track type High Tc Superconducting (HTS) magnets were carried out. The Magnet is composed of 3 pancake coils wound by 37-filamental Bi-2223/ Ag-alloy tapes. Quench current ($I_q$) of both whole magnet and 3 pancake coils were measured. At 77K under the self-field, $I_q$ of magnet was 12A, while in the case of middle pancake coil, $I_q$ was 15A. The upper pancake coils of racetrack magnet with iron plates, magnet having optimized current distribution and initial magnet are compared with each other through 3D FEA, manufacturing and testing these magnets. The measured performance of the upper pancake coil #3 with iron plates improved by 50% on the basis of initial pancake coil #3. Quench current ($I_q$) of field winding was 12A. In addition, the fabrication processes and the characteristics of HTS magnet are described.

• Restorative Dentistry and Endodontics
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• 제22권1호
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• pp.1-33
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• 1997

The objective of this study was to analyze the in vitro and in vivo corrosion products of low and high copper amalgams. The four different types of amalgam alloy used in this study were Fine cut, Caulk spherical, Dispersalloy, and Tytin. After each amalgam alloy and Hg were triturated according to the directions of the manufacturer by means of the mechanical amalgamator(Amalgam mixer. Shinhung Co. Korea), the triturated mass was inserted into a cylindrical metal mold which was 12mm in diameter and 10mm in height. The mass was condensed by 150Kg/cm compressive force. The specimen was removed from the mold and aged at room temperature for about seven days. The standard surface preparation was routinely carried out by emery paper polishing under running water. In vitro amalgam specimens were potentiostatically polarized ten times in a normal saline solution at $37^{\circ}C$(potentiostat : HA-301. Hukuto Denko Corp. Japan). Each specimen was subjected to anodic polarization scan within the potential range -1700mV to+400mV(SCE). After corrosion tests, anodic polarization curves and corrosion potentials were obtained. The amount of component elements dissolved from amalgams into solution was measured three times by ICP AES(Inductive Coupled Plasma Atomic Emission Spectrometry: Plasma 40. Perkim Elmer Co. U.S.A.). The four different types of amalgam were filled in occlusal and buccal class I cavities of four human 3rd molars. After about five years the restorations were carefully removed after tooth extraction to preserve the structural details including the deteriorated margins. The occlusal surface, amalgam-tooth interface and the fractured surface of in vivo amalgam corrosion products were analyzed. In vivo and in vitro amalgam specimens were examined and analyzed metallographically by SEM(Scanning Electron Microscope: JSM 840. Jeol Co. Japan) and EDAX(Energy Dispersive Micro X-ray Analyser: JSM 840. Jeol Co. Japan). 1. The following results are obtained from in vitro corrosion tests. 1) Corrosion potentials of all amalgams became more noble after ten times passing through the in vitro corrosion test compared to first time. 2) After times through the test, released Cu concentration in saline solution was almost equal but highest in Fine cut. Ag and Hg ion concentration was highest in Caulk spherical and Sn was highest in Dispersalloy. 3) Analyses of surface corrosion products in vitro reveal the following results. a)The corroded surface of Caulk spherical has Na-Sn-Cl containing clusters of $5{\mu}m$ needle-like crystals and oval shapes of Sn-Cl phase, polyhedral Sn oxide phase. b)In Fine cut, there appeared to be a large Sn containing phase, surrounded by many Cu-Sn phases of $1{\mu}m$ granular shapes. c)Dispersalloy was covered by a thick reticular layer which contained Zn-Cl phase. d)In Tytin, a very thin, corroded layer had formed with irregularly growing Sn-Cl phases that looked like a stack of plates. 2. The following results are obtained by an analysis of in vivo amalgam corrosion products. 1) Occlusal surfaces of all amalgams were covered by thick amorphous layers containing Ca-P elements which were abraded by occlusal force. 2) In tooth-amalgam interface, Ca-P containing products were examined in all amalgams but were most clearly seen in low copper amalgams. 3) Sn oxide appeared as a polyhedral shape in internal space in Caulk spherical and Fine cut. 4) Apical pyramidal shaped Sn oxide and curved plate-like Sn-Cl phases resulted in Dispersalloy. 5) In Tytin, Sn oxide and Sn hydroxide were not seen but polyhedral Ag-Hg phase crystal appeared in internal space which assumed a ${\beta}_l$ phase.

• 헤리티지:역사와 과학
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• 제52권1호
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• pp.4-21
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• 2019

영남지역에서 출토된 6~7세기 신라 금제 귀걸이 23점에 대한 성분 분석을 실시하고, 금판에 포함된 은(Ag) 함량을 기준으로 세 가지 유형으로 분류하였다. I 유형(20~50wt%), II 유형(10~20wt%), III 유형(10wt% 이하)으로 구분하였는데, I II 유형의 귀걸이 금판은 금(Au) 함량이 상대적으로 높은 부분에서 미세한 기공이 집중적으로 분포되는 현상이 관찰되었다. 금판 표면의 성분 차이 발생 원인을 네 가지로 구분하여 1) 표면 처리, 2) 제작 과정에서 열 확산, 3) 사금의 성분 차이, 4) 금의 정련 방법 측면에서 검토하였다. 금판 표면의 금 함량이 상대적으로 높은 부분에서는 미세한 기공이 집중적으로 관찰되며, 이와 관련하여 금 합금 표면에 의도적으로 금을 제외한 금속 성분을 제거하면서 금 함량을 높이는 고갈 도금(depletion gilding) 가능성을 제시하였다. 의도적인 표면 처리와 더불어 제작 과정에서 금판과 금속 봉 사이에 열 확산이 일어나 금판의 구리 함량이 높아진 사례를 세환이식의 분석 결과로 확인되었다. 금판의 재료적인 측면에서 살펴보면 금판에 포함된 은(Ag)이 자연금에 포함된 것인지, 합금에 의해 추가된 것인지를 국내에서 채취된 사금 분석을 통해 살펴보았다. 분석 결과 평균적으로 13wt% 정도의 은이 포함된 것으로 미루어 보아 II 유형은 자연금의 범주에 포함되고, III 유형은 정련 과정을 거친 금, I 유형은 자연금에 은이 합금된 것으로 보인다. 여기에서 III 유형의 경우 정련 과정을 거쳐 순수한 금을 만든 뒤 은을 합금했을 가능성에 대해 국내외 고대 문헌에 소개된 금 정련 방법을 조사하였다. 고대 정련 방법은 자연금에 포함된 은이 염화물 또는 황화물과 반응하여 결합됨으로써 제거되는 방법이었는데, 이러한 방법을 통해 순수한 금을 얻기 위해서는 장시간의 노력과 기술이 요구된다는 것이 밝혀졌다. 따라서 정련 과정을 통해 순금을 만든 후에 강도를 높이기 위해 소량의 은을 첨가했을 가능성은 낮아 보인다.

• 분석과학
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• 제13권3호
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• pp.291-296
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• 2000

사용후핵연료와 조성이 비슷한 모의 사용후핵연료를 고압 산분해법으로 용해시킨 후 우라늄 매질로부터 몰리브덴을 분리하지 않고 유도결합플라스마 원자방출분광기(ICP-AES)로 바로 정량할 수 있는 분석조건을 검토하였다. 몰리브덴 분석에 미치는 우라늄의 분광학적 간섭 정도를 각각의 스펙트럼으로부터 비교, 평가한 결과 202.030과 203.844 nm의 파장이 분석선으로서 가장 적합하였으며, 보다 정확하고 정밀한 분석 결과를 얻기 위하여 표준물 첨가법을 적용하였다. 우라늄 매질로부터 몰리브덴을 양이온 교환수지(Bio-Rad AG 50W-X8)로 분리한 다음 ICP-AES로 분석한 결과와 직접 분석한 결과를 비교한 결과, 상대편차는 5% 범위 내에서 잘 일치하는 결과를 얻었다. 따라서 본 방법은 모의 사용후핵연료 용해용액 내에 함유되어 있는 몰리브덴을 바로 분석할 수 있을 뿐만 아니라 몰리브덴의 함량이 수 퍼센트인 우라늄-몰리브덴 합금중 몰리브덴 정량에도 적용할 수 있었다.

• Restorative Dentistry and Endodontics
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• 제12권1호
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• pp.39-49
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• 1986

The purpose of this study was to observe characteristic properties through the polarization curves and SEM images from 4 different types of amalgam obtained by using the potentiostats (Princeton EG & G) & SEM (Jeol/35), and to investigate the degree of corrosion on the oxidation peak of the each phase of amalgam. After each amalgam alloy and Hg was triturated as the direction of the manufacturer by means of the mechanical amalgamator (Shofu Co.), the triturated mass was inserted into the cylindrical metal mold which was 12mm in diameter and 10.0mm in height and was condensed by using routine manner. The specimen was removed from the mold and stored at room temperature for about 24 hours. The standard surface preparation was routinely carried out. Anodic polarization measurement was employed to confirm the corrosion behaviour of the amalgams in a 0.9% saline solution (P.H: 6.8-7.0) at $37^{\circ}C$. The initial rest potential (corrosion potential) was determined after 30 minutes of immersion of specimen in electrolyte, and the potential scan was begun at the point of 100mV cathodic from the corrosion potential. The scan rate was 0.17mV/sec. in the study to observe the degree of corrosion of each phase. SEI and EPMA images on the determined oxidation peaks of each amalgam were observed. The results were as follows: 1. In the four anodic polarization curves, low copper amalgams have three oxidation peaks and high copper amalgams have two oxidation peaks, -270mV, +26mV and +179mV(SEC) in the low copper lathe cut, and -300mV, +39mV and +163mV(SEC) in the low copper spherical. -4mV and +154mV(SEC) in the Dispersalloy, and +17mV and +180mV(SEC) in the Tytin as high copper amalgams. 2. ${\gamma}_2$ phase in the low copper amalgam and ${\eta}$ phase in the high copper amalgam were the most corrodible phases and Ag-Cu eutectic in high copper amalgam was the most slowly corroded phase. 3. Low copper amalgam was more susceptible in corrosion than high copper amalgam.

• 한국재료학회지
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• 제5권2호
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• pp.151-156
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• 1995

$(Ba, Sr)TiO_{3}$계에 저융점의 Glass물질을 첨가하여 저온소결이 가능하며, 고유전율을 갖는 유전체 재료를 제조하여, 그 특성을 조사하였다. 본 연구에서는 고유전율의 $(Ba, Sr)TiO_{3}$계에 PbO함량이 서로 다른 Glass물질을 첨가하여 조성변화에 따른 저온소결거동 및 유전특성을 조사하였으며, 적층형 세라믹 Capacitor(MLCC)에 응용하기 위하여 다양한 조성으로 제조하였다. $PbO-ZnO-B_{2}O_{2}$계 Glass 성분을 첨가하여 소결온도를 $1350^{\circ}C$에서 $1050^{\circ}C$까지 낮출수 있었으며, 4wt% glass 첨가로 $1150^{\circ}C$ 이하에서 2시간 소결한 저온소결용 재료는 실온에서 8000정도의 높은 비유전율과 0.005의 낮은 유전손실 그리고 광역온도범위에서 유전상수의 안정성을 가진 우수한 특성을 나타내며, 입자크기가 1~3 $\mu$m 정도로 치밀한 미세구조를 가지고 있다. 본 연구의 저온소결용 유전체 재료는 Z5U 규격을 만족시키고 기존의 $BaTiO_{3}$계 재료에 비해 낮은 소결온도를 가지므로 MLCC에 응용시 내부전극으로 Ag-Pd alloy 사용이 가능한 것으로 밝혀졌다.

• 보존과학회지
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• 제27권1호
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• pp.41-47
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• 2011

은 소지 위에 금을 도금한 은제금도금유물을 대상으로 성분분석을 위해 X선 형광 분석기를 이용하여 비파괴분석을 실시하면 소지금속인 Ag에서 전자궤도에 따라 무게백분율(wt.%)의 값이 큰 차이가 나타나는 특이점을 확인할 수 있다. 이러한 특이점을 이용하여 육안으로는 파악하기 쉽지 않은 유물에서도 은제금도금기법이 사용되었는지를 판단할 수 있는 근거를 제시하고자 재현시료를 제작하여 비교분석을 실시하였다. 그 결과 수은아말감도금법과 전기도금법으로 제작된 시료에서는 실제 유물들의 분석결과와 같은 결과를 볼 수 있었다. 하지만 금은합금시료의 경우 도금시료와는 달리 주성분들의 전자궤도에 따른 차이가 미미한 것을 확인할 수 있었다. 도금시료에서 나타나는 이러한 원인으로는 단일재료가 아닌 도금으로 인한 이중구조에 의해 도금층에서 XRF 빔을 흡수하면서 발생하는 것으로 보인다. 따라서 비파괴분석에서 나타나는 이러한 결과를 이용한다면 단면을 관찰하지 않아도 은제금도금 기법의 사용 여부를 판단할 수 있을 것으로 확인하였다.