• 마이크로전자및패키징학회지
• /
• 제27권3호
• /
• pp.29-34
• /
• 2020

본 연구에서는 무전해 니켈 도금액 pH 변화에 따른 electroless nickel immersion gold (ENIG)/Sn-3.0wt.%Ag-0.5wt.%Cu(SAC305) 솔더 접합부 취성 파괴 거동에 대하여 평가하였다. ENIG 표면처리를 위한 무전해 니켈 도금액의 pH는 4.0에서 5.5로 변화 시켰다. 무전해 니켈 도금 후 Ni-P 표면 관찰 결과, 도금액의 pH가 낮아질수록 Ni-P 층 nodule 표면에 핀홀이 증가하였다. 솔더링 후 접합부 계면에서는 (Cu,Ni)6Sn5 금속간화합물이 형성되었으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 계면 금속간화합물의 두께는 증가하였다. 고속전단 시험을 통하여 ENIG/SAC305 솔더 접합부의 취성파괴 거동을 확인하였으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 전단강도는 감소하는 경향을 보였다. 또한, 솔더 접합부의 취성 파괴율은 pH가 5일 때 가장 높은 값을 보였다.

• 대한화학회지
• /
• 제28권2호
• /
• pp.86-94
• /
• 1984

${\beta}-Ag_3SI$의 단결정을 만들어 막전극으로의 응용을 살펴보았다. 그 결과 할로겐 이온들에 대해 감응함을 알았고, 분리용액법과 혼합용액법으로 할로겐 이온들에 대한 선택계수를 얻어 이론값과 비교검토 하였으며, 전위시간 곡선으로 부터 이 전극이 유리 전극기구에 의해 전도함을 알았고, 넓은 pH 범위에서 전위가 일정한 값을 가짐을 알았다. 한편 분석화학에의 응용을 살펴 본 결과 할로겐이온의 혼합용액에서 좋은 지시전극으로 사용할 수 있음을 알았다

• 분석과학
• /
• 제19권3호
• /
• pp.226-238
• /
• 2006

The electroplating of the Ag ions from aqueous solution on activated porous carbons was investigated over a wide range of plating time. The adsorption capacities of Ag metallic carbons were associated with their internal porosity and were related to physical properties such as surface area and pore size distribution. And, surface morphologies and quantitative analysis for the metal supported carbons are investigated by scanning electron microscopy (SEM) and energy disperse X-ray (EDX) measurements to explain the changes in adsorption properties. It is considered that the pH is an very important factor at the reason of water pollutant with increasing acidity in industrial field. The results of ICP-AES analysis showed that the residual concentration of Ag ions decreased with an increasing electroplating time. The metallic Ag-activated porous carbons electroplated showed microbicidal effects and strong antibacterial activity against six kinds of strains that were used. Finally, we confirmed that the presence of the electrolytic plated Ag-activated porous carbons is a determining factor in the HCl removal by chemical reaction, clarifying the surface chemical behavior.

• 한국재료학회지
• /
• 제30권3호
• /
• pp.131-135
• /
• 2020

Silver nanowire (AgNW) networks have been adopted as a front electrode in Cu(In,Ga)Se2 (CIGS) thin film solar cells due to their low cost and compatibility with the solution process. When an AgNW network is applied to a CIGS thin film solar cell, reflection loss can increase because the CdS layer, with a relatively high refractive index (n ~ 2.5 at 550 nm), is exposed to air. To resolve the issue, we apply solution-processed ZnO nanorods to the AgNW network as an anti-reflective coating. To obtain high performance of the optical and electrical properties of the ZnO nanorod and AgNW network composite, we optimize the process parameters - the spin coating of AgNWs and the concentration of zinc nitrate and hexamethylene tetramine (HMT - to fabricate ZnO nanorods. We verify that 10 mM of zinc nitrate and HMT show the lowest reflectance and 10% cell efficiency increase when applied to CIGS thin film solar cells.

• 한국전기전자재료학회논문지
• /
• 제34권2호
• /
• pp.115-120
• /
• 2021

In this study, composite transparent electrodes were fabricated either from a conductive polymer poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) or silver nanowire (AgNW). Three transparent electrodes such as PEDOT:PSS, PEDOT:PSS and AgNW mixture, and AgNW were fabricated. As for a transparent electrode, measured sheet resistance values were 89.6, 60.6 and 28.6 Ω/sq, and the transmittance values were 80.2, 82.0 and 83.8% while surface roughness (Rq) values were 4.1, 8.1, 20.4 nm for PEDOT:PSS, PEDOT:PSS and AgNW mixture, and AgNW, respectively. To verify the overall performance of these composite electrodes, we applied these electrodes to the top electrode of the solution-processed organic solar cells (OSCs). PEDOT:PSS provided the best performance with a fill factor (FF) of 51.2% and a photoconversion efficiency (PCE) of 2.2%, while traditional metal top electrode OSC provided FF of 60.5% and PCE of 3.1%.

• 분석과학
• /
• 제5권4호
• /
• pp.417-423
• /
• 1992

음극 벗김 전압전류법을 이용하여 비소(III)의 벗김 봉우리에 대한 금속 이온의 영향에 대하여 조사하였다. 비소(III)의 환원 벗김 봉우리 이론적인 전위값이 -0.84V(vs. Ag/AgCl)인데 비하여, 0.1N- 염산을 사용하였을 때 전위값은 -0.79V(vs. Ag/AgCl)이고, 여기에 구리(II)를 10배 첨가하였을 때 -0.84V로써 이론적인 전위값과 일치하였으며 전류값은 $0.86{\mu}A$로 가장 높게 나타났다. 비소(III)의 벗김 봉우리를 증가시키는 금속이온으로 납(II), 구리(II) 등이 있었고, 특히 구리(II)이온이 비소(III)의 벗김 봉우리를 가장 많이 증가시켰다.

• 한국표면공학회지
• /
• 제53권4호
• /
• pp.182-189
• /
• 2020

Indium tin oxide (ITO) used a transparent electrode of a photoelectric device has a low sheet resistance and a high transmittance. However, ITO is disadvantageous in that the process cost is expensive, and the process time is long. Silver nanowires (AgNWs) transparent electrodes are based on a low cost solution process. In addition, it has attracted attention as a next-generation transparent electrode material that replaces ITO because it has similar electrical and optical characteristic to ITO, it is noted as a. AgNW thin films are mainly produced by spin-coating. However, the spin-coating process has a disadvantage of high material loss. In this study, the material loss was reduced by using about 2~10 ㎕ of AgNW solution on a (25 × 25) ㎟ substrate using the shear-coating method. It was also possible to align AgNWs in the drag direction by dragging the meniscus of the solution. The electro-optical properties of the AgNW thin film were adjusted by changing the experimental parameters that the amount of AgNWs suspension, the gap between the substrate and the blade, and the coating speed. As a result, AgNW thin films with a transmittance of 90.7 % at a wavelength of 550 nm and a sheet resistance of 15 Ω/□ was deposited and exhibited similar properties to similar AgNW transparent electrodes studied by other researchers.

• Corrosion Science and Technology
• /
• 제6권2호
• /
• pp.50-55
• /
• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• 분석과학
• /
• 제11권4호
• /
• pp.248-253
• /
• 1998

수용액에서 poly-dibenzo-18-crown-6를 이용한 알칼리, 알칼리토금속이온 및 전이금속이온들의 흡착 및 분리특성을 조사하였다. 알칼리금속이온들과 알칼리토금속이온들의 흡착정도와 분포비의 순위는 각각 Li(I)

• The Journal of Advanced Prosthodontics
• /
• 제7권5호
• /
• pp.392-399
• /
• 2015

PURPOSE. The aim of this study was to evaluate the effect of metal primers on the bonding of dental alloys and veneer resin. Polyvinylpyrrolidone solution's tarnish effect on bonding strength was also investigated. MATERIALS AND METHODS. Disk-shape metal specimens (diameter 8 mm, thickness 1.5 mm) were made from 3 kinds of alloy (Co-Cr, Ti and Au-Ag-Pd alloy) and divided into 4 groups per each alloy. Half specimens (n=12 per group) in tarnished group were immersed into polyvinylpyrrolidone solution for 24 hours. In Co-Cr and Ti-alloy, Alloy Primer (MDP + VBATDT) and MAC-Bond II (MAC-10) were applied, while Alloy Primer and V-Primer (VBATDT) were applied to Au-Ag-Pd alloys. After surface treatment, veneering composite resin were applied and shear bond strength test were conducted. RESULTS. Alloy Primer showed higher shear bond strength than MAC-Bond II in Co-Cr alloys and Au-Ag-Pd alloy (P<.05). However, in Ti alloy, there was no significant difference between Alloy Primer and MAC-Bond II. Tarnished Co-Cr and Au-Ag-Pd alloy surfaces presented significantly decreased shear bond strength. CONCLUSION. Combined use of MDP and VBATDT were effective in bonding of the resin to Co-Cr and Au-Ag-Pd alloy. Tarnish using polyvinylpyrrolidone solution negatively affected on the bonding of veneer resin to Co-Cr and Au-Ag-Pd alloys.