• Title/Summary/Keyword: Ag+ solution

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Preparation of Ag Nano-Powder from Aqueous Silver Nitrate Solution through Reduction with Hydrazine Hydrate (Hydrazine Hydrate 환원(還元)에 의한 질산은(窒酸銀) 수용액(水溶液)으로부터 은(銀) 나노분말(粉末)의 제조(製造) 연구(硏究))

  • Lee, Hwa-Young
    • Resources Recycling
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    • v.15 no.4 s.72
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    • pp.19-26
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    • 2006
  • The preparation of Ag nano-powder from aqueous silver nitrate solution, which would be available for the recycling of silver bearing wastes, was investigated by a reductive precipitation reaction using hydrazine hydrate as a reducing agent. Silver solution was prepared by dissolving silver nitrate with distilled water, and then the dispersant, Tamol NN8906 or Tween 20, was also mixed to avoid the agglomeration of particles during the reductive reaction followed by the addition of hydrazine hydrate to prepare Ag nano-particles. Ag particles obtained from the reduction reaction from silver solution were characterized using the particle size analyzer and TEM to determine the particle size distribution and morphology. It was found that about 100% excess of hydrazine hydrate was required to reduce completely silver ions in the solution. Ag powders with very narrow distribution could be obtained when Tamol NN8906 was used as the dispersant. In case of Tween 20, the particle size distribution showed typically the bimodal or multimodal distribution and the morphology of Ag particles was found to be irregular shape in both cases.

Diffusion Coefficient of Ag(I) ion in the Concentrated Nitric Acid Solution (고농도 질산용액에서 Ag(I) 이온의 확산계수 측정)

  • Park Sang Yoon;Choi Wang Kyu;Lee Kune Woo;Moon Jei Kwon;Oh Won Zin
    • Journal of the Korean Electrochemical Society
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    • v.2 no.2
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    • pp.93-97
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    • 1999
  • From the anodic peak currents of cyclic voltammograms for Ag(I)/Ag(II) couple obtained with the variation of nitric acid concentration, Ag(I) concentration and solution temperature at a Pt electrode in concentrated nitric acid solutions, the diffusion coefficients of Ag(I) ion were evaluated to estimate the limiting current density of Ag(II)-mediated electrochemical oxidation (MEO) process, which has been effectively used for the complete destruction of hazardous organic materials. The results showed that, due to the water decomposition reaction which occurred simultaneously with the Ag(I) ion oxidation, background subtractions for the cyclic voltammograms were required to estimate the correct peak currents. The empirical relationship for the diffusion coefficient of Ag(I) was suggested as a function of solution viscosity and temperature.

Recovery of Silver from the Spent Solution Generated from Electrochemical Oxidation of Radioactive Wastes (放射性 폐기물의 전기화학적 분해 폐액으로부터 銀의 回收)

  • 문제권;정종훈;오원진;이일희
    • Resources Recycling
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    • v.10 no.5
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    • pp.22-28
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    • 2001
  • Recovery of silver in the spent solution generated from MEO(Mediated Electrochemical Oxidation) process, which is a process to decompose radioactive organic mixed wastes at low temperature, was performed using chemical method. Silver nitrate in 5M nitric acid solution could be completely recovered as AgCl by using 1% excess of the stoichiometric HCl equivalents. Then, AgCl was transformed to Ag metal by reduction reaction with hydrogen peroxide under alkaline media. The optimum pH for the reduction to silver metal was found to be in the range of 12.8∼13.0.

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The Stability of Plating Solution and the Current Density Characteristics of the Sn-Ag Plating for the Wafer Bumping

  • Kim, Dong-Hyun;Lee, Seong-Jun
    • Journal of the Korean institute of surface engineering
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    • v.50 no.3
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    • pp.155-163
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    • 2017
  • In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

Surface Plasmon Resonances of Metal Colloidal Particles Synthesized by a Photo-Chemical Process (광화학적 방법을 이용한 금속입자의 합성과 광학적 특성 연구)

  • Ko, Min-Jin;Plawsky, Joel
    • Journal of the Korean Chemical Society
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    • v.43 no.1
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    • pp.1-7
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    • 1999
  • Metal colloidal particles have been prepared by a photo-chemical process in an aqueous solution containing semiconductor nanocrystallites. Metal colloidal particles produced in CdS and AgBr exhibit different absorption spectra. Au particles produced in solution with CdS show typical Au plasmon resonance absorption spectra. On the other hand Ag particles in solution with AgBr shows surface plasmon resonance absorption spectra which are red-shifted, as compared to that of a dispersion of homogeneous Ag colloidal particles in the same host. The extent of red-shift depends on the UV illumination time. This phenomenon is interpreted within the context of effective medium theory for small volume fractions. From the theory, a metal coated particle predicts Ag plasmon resonance, red shifted with respect to 400 nm that would be associated with a silver particle in solution. The absorption peak position is very sensitive to the coating thickness.

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Preparation and Optical Properties of Ag-Coated Cu Powder by Dropping Method of Coating Agent (피복제 적하법에 의한 Ag 피복 Cu 미립자의 제조 및 광학적 특성)

  • Yu, Yeon-tae
    • Korean Journal of Materials Research
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    • v.13 no.9
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    • pp.555-560
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    • 2003
  • Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

Ag Nanowires Prepared by a Modified Polyol Method with 1,4-Benzoquinone Additives

  • Kang, Miseon;Chung, Eunseon;Kim, Sang-Ho;Rhee, Seog Woo
    • Bulletin of the Korean Chemical Society
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    • v.35 no.11
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    • pp.3209-3212
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    • 2014
  • This paper describes a selective synthetic method of fabricating Ag nanowires by using a modified polyol process. To synthesize the Ag nanowire, an ethylene glycolic solution of silver nitrate and an ethylene glycolic solution of polyvinylpyrrolidone solution containing a small amount of organic oxidant, 1,4-benzoquinone, were slowly added to a hot ethylene glycol medium at $160^{\circ}C$ for 8 min using a syringe pump. The reaction mixtures were heated for an additional 45 min and cooled to room temperature. Finally, the silver nanomaterials were isolated from the mixture by centrifugation. The crystal structure of the nanomaterials was investigated by powder X-ray diffraction analyses, and their morphology was investigated by scanning electron microscopy. A small amount of organic oxidant, 1,4-benzoquinone, played a significant role in controlling the morphology during crystal growth. Consequently, Ag nanowires rather than Ag nanoparticles were selectively obtained.

A Study on fabrication of the Ag fine pattern using Near Field Electro Spinning(NFES) (근접장 전기방사 방식을 이용한 Ag 미세 패턴 형성)

  • Sim, Hyo-Sun;Seo, Hwa-Il;Youn, Doo-Hyeb
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.65-70
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    • 2011
  • These days, printed electronics attract attention from electronics industry. In this paper, the fabrication of the fine patterns by Near Field Electro Spinning (NFES) was studied by using Ag ink on silicon wafer (substrate). Two types of ink, the high viscous ink Ag-200 and low viscous ink Ag-15, were used. The fine and uniform patterns were easily fabricated by using Ag-200 because jet breakup is less occurred in high viscosity solution. As increasing flow rate of solution, aspect ratio of Ag pattern decreased. And there was optimum applied voltage for fine pattern. In case of Ag-200, the optimum applied voltage was about 2.02KV. When pattern was fabricated by NFES, the pattern width and height were affected by many factors such as viscosity, flow rate of solution, applied voltage etc.

Preparation of Poly (Vinyl Alcohol) Nanofibers Containing Silver Nanoparticles by Gamma-ray Irradiation

  • Kim, Yun-Hye;Shin, Junwha;Youn, Min-Ho;An, Sung-Jun;Lim, Youn-Mook;Gwon, Hui-Jeong;Nho, Young-Chang
    • Journal of Radiation Industry
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    • v.2 no.3
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    • pp.129-133
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    • 2008
  • PVA nanofibers containing silver nanoparticles were prepared by two methods. The first method was electrospinning of irradiated solution. The prepared $PVA/AgNO_3$ solution was irradiated by gamma-rays. And then the irradiated solution was electrospun. The second method was irradiation of electrospun nanofibers. Nanofibers prepared by electrospinning of unirradiated $PVA/AgNO_3$ solution. The morphology of the nanofibers was observed with a SEM, TEM. When the irradiated $PVA/AgNO_3$ solution were electrospun, the average size of the Ag nanoparticles was increased, but their number was decreased.

Implementation of UDP-Tunneling Based Multicast Connectivity Solution for Multi-Party Collaborative Environments (다자간 협업 환경을 위한 UDP 터널링 기반의 멀티캐스트 연결성 솔루션의 구현)

  • Kim, Nam-Gon;Kim, Jong-Won
    • Journal of KIISE:Computing Practices and Letters
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    • v.13 no.3
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    • pp.153-164
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    • 2007
  • The Access Grid (AG) provides collaboration environments over the IP multicast networks by enabling efficient exchange of multimedia contents among remote users; however, since lots of current networks are still multicast-disabled, it is not easy to deploy this multicast-based multi-party AG. For this problem, the AG provides multicast bridges as a solution by putting a relay server into the multicast networks. Multicast-disabled clients make UDP connections with this relay server and receive forwarded multicast traffics in unicast UDP packets. This solution is facing several limitations since it requires duplicate forwarding of the same packet for each unicast peer. Thus, in this paper, we propose an alternate solution for the multicast connectivity problem of the AG based on the UMTP (UDP multicast tunneling protocol). By taking advantage of flexibilities of UMTP, the proposed solution is designed to improve the efficiency of network and system utilization, to allow reuse of multicast-based AG applications without modification, and to partially address the NAT/firewall traversal issues. To verify the feasibility of proposed solution, we have implemented a prototype AG connectivity tool based on the UMTP, named as the AG Connector.