• Journal of the Korean Chemical Society
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• v.29 no.2
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• pp.137-143
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• 1985

Construction of a liquid membrane type of cupric ion selective electrode and its application to the potentiometric titration have been studied. A liquid ion-exchange membrance was prepared by extracting Cu(II) in aqueous solution into 1-(2-pyridylazo)-2-naphthol/nitrobenzene. A Ag/AgCl internal reference electrode was dipped into the aqueous reference solution of $1.00 {\times} 10^{-3}M\;Cu(NO_3)_2$ buffered with HAc-NaAc buffer solution, which was in contact with the nitrobenzene extract. The electrode showed the nernstian response to Cu(II) in the concentration range from $1.00{\times} 10^{-6}$ to $1.00{\times} 10^{-3}$M. The most suitable ion-exchanger concentration in the liquid membrane was $1.00{\times} 10^{-4}$M. The selectivity coefficients of the electrode for the various metal cations were investigated. The electrode was applied to the potentiometric titration of Cu(II) with EDTA.

• Journal of the Korean earth science society
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• v.35 no.4
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• pp.259-266
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• 2014

This study was carried out to find an environmental friendly and effective way to leach Au and Ag from scrap of Printed Circuit Boards (PCBs) using sodium-hypochlorite solution. In an EDS analysis, valuable metals such as Cu, Sn, Sb, Al, Ni, Pb and Au were all found in PCBs. The highest leaching rates obtained were 1% of pulp density with a chlorine:hypochlorite of 2:1 and a concentration of NaCl at 2M. The highest Au recovery was observed with the addition of sodium metabisulfite to make a 3M solution. It is confirmed that the leaching agent (chlorine-hypochlorite) could effectively leach Au and Ag from Printed Circuit Boards (scrap parts) and the additive reagent sodium metabisulfite could easily precipitate Au from the chlorine-hypochlorite solution.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Journal of Powder Materials
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• v.15 no.3
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• pp.221-226
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• 2008

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

• Journal of the Korean Applied Science and Technology
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• v.31 no.1
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• pp.66-73
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• 2014

In this work, the current-voltage curves for stainless steel in the ethanolamine solution containing alkyl group were measured using the conventional three electrodes of cyclic voltammetry. Stainless steel as working electrode, Ag/AgCl electrode as reference electrode and Pt wire as counter electrode were used respectively. As a result, the C-V characteristics of stainless steel were to be for an irreversible process due to the oxidation current from cyclic voltammogram, using N-ethylethanolamine and N,N-dimethylethanolamine solutions. Effective diffusivity of corrosion inhibitors was decreased with increasing concentration. It was found from SEM images of the metal that the electrolyte (specific name ?)(0.5 N) as corrosion inhibitor was added into a N, N-diethylethanolamine solution ($1.0{\times}10^{-3}M$) containing copper and nickel, the corrosion inhibiting effect was enhanced.

• The Journal of Engineering Research
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• v.3 no.1
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• pp.189-197
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• 1998

Hyeroxyapatite(HAp) which has good biocompatibility was made by Wet Chemical Process. The surface of Ti-6Al-4V, coated with HAp by lon Beam Assisted Deposition (IBAD), was treated with 5ppm, 10ppm, 20ppm, and 100ppm of $AgNO_3$ solution. In this Ag impregnation process, $Ca^{2+}$ of HAp was substituted with $Ag^+$ of $AgNO_3$. In this study, the antimicrobial effect and biocompatibility of Ti-6Al-4V alloy which was coated with Ag-HAp were examined. The antimicrobial test was carried out with two kinds of bacteria(P. Aeruginosa, S. Epidermidis), which are highly infectious in a transplanting operation of implant materials. As a result of the test, it was observed that Ti-6Al-4V alloy which was treated by 20ppm of $AgNO_3$ solution has good biocompatibility. In order to observe the antimicrobial mechanism of $Ag^+$, E. coli which is the most common bacterium was treated by Ag-HAp. Then cell morphology of E. coli was observed by the transmission electron microscope(TEM). The destruction of cell wall and cytoplasm of E. coil were observed. A black spot appeared in the cytoplasm was analyzed by energy dispersive analysis X-ray (EDAX) and it showed a small amount of $Ag^+$. Thus, it was proved that $Ag^+$ destroys bacteria effectively and Ti-6Al-4V alloy which was impregnate with Ag ion show antimicrobial effect on infection bacteria.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.6
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• pp.1169-1174
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• 2011

CdTe thin-film solar cell technology is well known that it can theoretically improve its conversion efficiency and manufacturing costs compared to the conventional silicon solar cell technology, due to its optical band gap energy (about 1.45eV) for solar energy absorption, high light absorption capability and low cost requirements for producing solar cells. Although the prior studies obtained the high light absorption, CdTe thin film solar cell has not been come up to the sufficient efficiency yet. So, doping method was selected for the improvement of the electrical characteristics in CdTe solar cells. Some elements including Cu, Ag, Cd and Te were generally used for the p-dopant as substitutional acceptors in CdTe thin film. In this study, the sputtering-deposited CdTe thin film was immersed in $AgNO_3$ solution for ion exchange method to dope Ag ions. The effects of immersion temperature and Ag-concentration were investigated on the optical properties and electrical characteristics of CdTe thin film by using Auger electron spectroscopy depth-profile, UV-visible spectrophotometer, and a Hall effect measurement system. The best optical and electrical characteristics were sucessfully obtained by Ag doping at high temperature and concentration. The larger and more uniform diffusion of Ag ions made increase of the Ag ion density in CdTe thin film to decrease the series resistance as well as mede the faster diffusion of light by the metal ions to enhance the light absorption.

• Korean Chemical Engineering Research
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• v.48 no.1
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• pp.98-102
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• 2010

Magnolia kobus leaf extract was used for the synthesis of bimetallic Au core-Ag shell nanoparticles. Gold seeds and silver shells were formed by first treating aqueous solution of $HAuCl_4$ and then $AgNO_3$ with the plant leaf extract as reducing agent. UV-visible spectroscopy was monitored as a function of reaction time to follow the formation of bimetallic nanoparticles. The synthesized bimetallic nanoparticles were characterized with transmission electron microscopy(TEM), energy dispersive X-ray spectroscopy(EDS), and X-ray photoelectron spectroscopy(XPS). TEM images showed that the bimetallic nanoparticles are a mixture of plate(triangles, pentagons, and hexagons) and spherical structures. The atomic Ag contents of the bimetallic Au/Ag nanoparticles determined from EDS and XPS analysis were 34 and 65 wt%, respectively, suggesting the formation of bimetallic Au core-Ag shell nanostructure. This core-shell type nanostructure is expected to have potential for application in surface enhanced Raman spectroscopy and in the sensitive detection of biomolecules.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.551-554
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• 2002

As a general rule, the brazing process between cemented carbides and steel used by Silver (Ag) type brazing filler. The composition of Ag type filler were used Ag-Cu-Zn-Cd type filler mainly. But, the demand of Cadmium (Cd)-free in Ag type filler was raised recently. The reason why Cd-free in Ag brazing filler were occupied to vaporize as a CdO$_2$ when brazing process, because of Cd element was almost low boiling point of all Ag type filler elements. And, CdO$_2$ was a very harmful element for the human body. This experiment was developed Cd-freeing on Ag type filler that was used Indium (In) instead of Cd element. In this experiment, there were changed from 0 to 5% In addition in Ag brazing filler and investigated to most effective percentage of Indium. As a result, the change of In addition instead of Cd, there was a very useful element and obtained same property only 3% In added specimens compared to Cd 19% added specimens. These specimens were obtained same or more deflective strength. In this case, there were obtained 70 MPa over strength and wide brazing temperature range 650-800 C. A factor of deflective strength were influenced by composition and the shape of $\beta$ phase and between $\beta$ phase and cemented carbides interface. Indium element presented as $\alpha$ phase and non-effective factor directly, but it's occupied to solid solution hardening as a phase. $\beta$ phase were composed 84-94% Cu-Ni-Zn elements mainly. Especially, the presence of Ni element in interface was a very important factor. Influence of condensed Ni element in interface layer was increased the ductility and strength of brazing layer. Therefore, these 3% In added Ag type filler were caused to obtain a high brazing strength.

• Journal of the Korean Magnetics Society
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• v.5 no.1
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• pp.48-53
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• 1995

The structure, magnetic properties and magnetoresistance phenorrena of Ag-Co nano-granular alloy films prepared by a thermal co-evaporation were studied. Supersaturated fee Ag-Co solid solution and fee Co clusters coexisted in the as-deposited state. As Co content increases from 20 to 55 at.% Co, the grain size of the Ag matrix decreases from 147 to $67{\AA}$, and the Co solubility in the Ag matrix increases from 2.5 to 6.7%. Ag-Co alloy films having composition below 25 at.% Co showed mainly superparamagnetic behavior and above that composition, they showed both paramagnetic and ferromagnetic l::ehavior in the as-deposited state. The maximum magnetoresistance of 19% at R. T. and 10 kOe was obtained in the as-deposited 30 at.% Co alloy film. Heat treatment did not improve the MR ratio tecause most of the Co was already precipitated in the as-deposited state.