• 한국레이저가공학회지
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• 제10권4호
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• pp.1-6
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• 2007

This study includes the effects of shielding gas types and flow rate on Nd:YAG Laser weldability of sintered material. The types of shielding gas were evaluated for He, Ar and N2. Bending strength, porosity rate, hardness and aspect ratio testing of laser weld are carried out to evaluated the weldability. As a results, Ar gas was showed the best welding strength even it has the most porosity content on weld metal, and depend on increases the gas flow rate, it was not only got deeper penetration depth but also showed higher bending strength. Therefore we could know that bending strength is not only affect the porosity content but also melting area.

• Nuclear Engineering and Technology
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• 제20권4호
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• pp.241-245
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• 1988

핵연료봉의 PCI 파손은 원자로의 운전제한과 밀접한 관계가 있기 때문에, 출력급증 조건에서 핵연료봉의 PCI 파손을 지배하는 파손인자들의 거동을 검토하는 것은 매우 중요하다. 본 연구에서는 피복관에서의 원주방향 응력, 원주방향 변형도, 원주방향 주름 높이, 크립 변형율 및 변형도 에너지등의 파손인자들에 대한 거동특성을 핵연료봉 성능해석용 전산코드인 FEMAXI-IV를 이용하여 출력급증량 및 출력증가율의 운전인자들의 함수로 검토하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1293-1296
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• 2009

The synthesis of nano-size ($Y_{0.955}Eu_{0.1}$)($P_{0.7}V_{0.45}$)$O_4$ red phosphors were conducted by using a Liquid Phase Precursor (LPP) method. In this method, cellulose pulp was used as a template showing the micro fibre structures to obtain the nano size YPV red phosphor. Aqueous solutions of raw materials were impregnated into cellulose pulp and subsequently impregnated pulp was dried and fired at $800-1200^{\circ}C$ for 1h. The effect of luminescence properties on compositions and temperatures was evaluated with photoluminescence spectrum, X-ray diffraction and FE-SEM, and TEM. High efficiency (~110%) of phosphor of size of ~500nm fired at $1150^{\circ}C$ was obtained compared with the micro size of commercial product. High efficiency behaviors of nano size phosphors were discussed in this paper.

• 한국자기학회지
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• 제5권5호
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• pp.614-617
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• 1995

Thin CoCrTa/Cr films were deposited on glass substrates at $280^{\circ}C$ with or without Al underlayer. The coercivity of CoCrTa increased considerably by introducing an Al underlayer. The grain size of Cr thin film deposited on Al underlayer became smaller than that of Cr thin film deposited on glass substrate. The grain size of CoCrTa thin film was determined by Cr grain size. The cause of the coercivity increase seems to be associated with the refinement and uniform distribution of CoCrTa grains.

• 한국재료학회지
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• 제26권5호
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• pp.266-270
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• 2016

Glass-ceramics were developed many years ago and have been applied in many fields such as electronics, chemistry, optics, etc. Much is already known about glass-ceramic technology, but many challenges in glass-ceramic research are still unresolved. Recently, large amounts of slag have steadily increased in the steel industry as by-products. To promote recycling of industrial waste, including steel industry slags, many studies have been performed on the fabrication of basalt-based high-strength glass-ceramics. In this study, we have fabricated such ceramics using various slags to replace high performance cast-basalt, which is currently imported. Glass-ceramic material was prepared in similar chemical compositions with commercial cast-basalt through a pyro process using slags and power plant by-product (Fe-Ni slag, converter slag, dephosphorization slag, Fly ash). The properties of the glass-ceramic material were characterized using DTA, XRD, and FE-SEM; measurements of compressive strength, Vicker's hardness, and abrasion were carefully performed. It is found that the prepared glass-ceramic material showed better performance than that of commercial cast-basalt.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권2호
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• pp.76-82
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• 2003

The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

• 한국분말재료학회지
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• 제12권3호
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• pp.179-185
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• 2005

As the electrodes of secondary battery are made with sulfur compounds, excellent electrode system of environmental non-toxicity, high specific energy density and low material cost can be obtained. In this study, the $FeS_2$ fine compound powders for active material in the battery were synthesized by mechanical alloying. Fine Fe-53.5 wt.%S powders of 450 nm of mean size were fabricated by mechanical alloying for 60 hours at the horizontal attritor. As the mechanical alloying time increases, particle size of Fe-53.5 wt.%S was decreased and steady state of Fe-53.5 wt.%S compound powders was obtained at 30 hours. Fe-53.5 wt.%S cathode shows the excellent discharge capacity (1011 mAh/g).

• 한국표면공학회지
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• 제45권5호
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• pp.188-192
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• 2012

The hetero junction on dielectrics and ferrite for LTCC was prepared by using NiCuZn ferrite. The shrinkage behaviour of ferrite tapes in combination with a dielectric tape was investigated. The characteristics of NiCuZn ferrite were investigated using XRD (X-ray diffractometer), Dilatometer, FE-SEM (Field emission scanning electron microscope), EDS (Energy dispersive spectrometer). NiCuZn ferrite calcined at $700^{\circ}C$ had a good apparent density and initial permeability of magnetic properties. The shrinkage rate of the NCZF700 ferrite and dielectric material was similar. The multilayer revealed dense, uniform morphologies with excellent interface quality. Diffusion of hetero junction such as dielectric and ferrite was not occuring at $900^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• Bulletin of the Korean Chemical Society
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• 제31권2호
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• pp.415-418
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• 2010

Highly ordered mesoporous silver material was successfully synthesized from a mesoporous silica template (KIT-6) with 3-D channel structure using the nano-replication method. The effects of $H_2$ or $O_2$ pretreatments on the catalytic performance of the mesoporous silver were investigated using a temperature programmed CO oxidation technique in a fixed bed reactor. The mesoporous silver material that was pretreated with $H_2$ exhibited an excellent catalytic activity compared to the as-prepared and $O_2$-pretreated catalysts. Moreover, this present mesoporous silver material showed good catalytic stability. For the CO oxidation, the apparent activation energy of the $H_2$-pretreated mesoporous silver catalyst was $61{\pm}0.5\;kJ\;mol^{-1}$, which was also much lower than the as-prepared ($132{\pm}1.5\;kJ\;mol^{-1}$) and $O_2$-pretreated ($124{\pm}1.4\;kJ\;mol^{-1}$) catalysts.