• Title/Summary/Keyword: Adhesives Development

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Selection and Technical Development for Seed Pelleting Material of Codonopsis lanceolata Trautv (더덕 종자의 펠렛팅을 위한 소재 탐색 및 기술개발)

  • Choi, Kyeong-Gu;Lee, Youn-Su;Cha, Kwang-Ho
    • Korean Journal of Medicinal Crop Science
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    • v.14 no.3
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    • pp.130-133
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    • 2006
  • This study was conducted to select Codonopsis lanceolata seed's new pelleting particulate materials and adhesives. Different adhesives (Polyvinyl alcohol (PVA), Carboxymethyl cellulose (CMC), Polyvinyl pyrrolidone (PVP), Xanthan gum (XG), Arabic gum (AG)) and particulate materials (Illite, Diatomite, Pyrophyllite + Illite + Diatomite (PID), Pyrophyllite + Illite + Talc (PIT), Bentonite + Talc (BT)) were tested for seed pelleting. PID for Codonopsis lanceolata seed pelleting appeared to be the best particulate material. Among the pelleting adhesives, PVP was the best adhesive for seed pelleting, and the optimum concentration for germination of pelleting seed was 1 %. Germination rate of the pelleted seeds treated with PID particulate material and PVP adhesive was higher (86.8%) than those of raw seeds (85.5%). $T_{50}$ and MDG of pelleted Codonopsis lanceolata seed required five and eight days at soil moisture content of 50%, respectively.

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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Evaluation of Cryogenic Performance of Adhesives Using Composite-Aluminum Double Lap Joints (복합재-알루미늄 양면겹치기 조인트를 이용한 접착제의 극저온 물성 평가)

  • Kang, Sang-Guk;Kim, Myung-Gon;Kong, Cheol-Won;Kim, Chun-Gon
    • Composites Research
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    • v.19 no.4
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    • pp.23-30
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    • 2006
  • In the development of a cryogenic propellant tank, the proper selection of adhesives to bond composite and metal liner is important for the safety of operation. In this study, 3 types of adhesives were tested for the ability to bond CFRP composites developed for cryogenic use and aluminum alloy (Al 6061-T6) for lining the tank using double-lap joint specimens. The double-lap joint specimens were tested inside an environmental chamber at room temperature and cryogenic temperature ($-150^{\circ}C$) respectively to compare the bond strength of each adhesive and fracture characteristics. The material properties with temperature of component materials of double-lap joints were measured. In addition, ABAQUS was used for the purpose of analyzing the experimental results.

Development and Application of Okara-based Adhesives for Plywood Panels (두부비지를 이용한 합판용 접착제의 개발 및 적용)

  • Oh, Sei-Chang;Ahn, Sye-Hee;Choi, In-Gyu;Jeong, Han-Seob;Yoon, Young-Ho;Yang, In
    • Journal of the Korean Wood Science and Technology
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    • v.36 no.3
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    • pp.30-38
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    • 2008
  • Petroleum-based resin adhesives have extensively been used for the production of wood panels. However, with the increase of manufacturing cost and the environmental issue, such as the emission of volatile organic compounds, of the adhesive resins, it is necessary to be developed new adhesive systems. In this study, the potential of okara, which is a residue wasted from the production of tofu, for the development of bio-based adhesives was investigated. At first, the physical and chemical properties of okara were examined. After okara was hydrolyzed in acidic and/or alkaline solutions, okara-based adhesive resins were formulated with the mixtures of the okara hydrolyzates and phenol formaldehyde (PF) prepolymer. The adhesive resins were used for the fabrication of plywood panels, and then the adhesive strength and formaldehyde emission of the plywood panels were measured to examine the applicability of the resin adhesives for the production of plywood panels. The solids content and pH of the okara used in this study were around 20% and weak acidic state, respectively. In the analysis of its chemical composition, the content of carbohydrate was the highest, and followed by protein. The shear strengths of plywood fabricated with okara-based resin adhesives exceeded a minimum requirement of KS standard for ordinary plywood, but its wood failure did not reach the minimum requirement. In addition, the formaldehyde emissions of all plywood panels were higher than that of E1 specified in the KS standard. Based on these results, okara has the potential to be used as a raw material of environmentally friendly adhesive resin systems for the production of wood panels, but further researches - biological hydrolysis of okara and various formulations of PF prepolymer - are required to improve the adhesive strength and formaldehyde emission of okara-based resin adhesives.

Development of Transdermal Delivery Systems Containing Clenbuterol (클렌부테롤 경피흡수제제의 개발)

  • Choi, Han-Gon;Quan, Qi-Zhe;Jung, Si-Young;Rhee, Jong-Dal;Yong, Chul-Soon
    • Journal of Pharmaceutical Investigation
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    • v.30 no.4
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    • pp.247-252
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    • 2000
  • The advantages of transdermal administration are avoiding hepatic first pass effect, minimizing inter- and intra-patient variation, maintaining steady-state plasma level to provide long-term therapy from a single dose, and allowing a rapid termination of drug input. Clenbuterol, a selective ${\beta}_2-adrenergic$ receptor stimulant, has been introduced as a potent bronchodilator for patients with bronchial asthma, chronic obstructive bronchial disease. For the development of transdermal systems containing clenbuterol, two limiting factors - long lag time and low flux - must be overcome. In this study, we attempted to select optimal formulation for preparation of clenbuterol patch using hairless mouse skin and flow-through diffusion cell. The flux of clenbuterol increased as the percent of clenbuterol dose dependently in the concentration range of 5-15%. Based on this result, we fixed the concentration of clenbuterol as 15%. The effect of various penetration enhancers on percutaneous absorption of clenbuterol through hairless mouse skin was investigated. Labrafil was the most effective enhancer, which increased the permeability of clenbuterol approximately 4-fold compared with the control without penetration enhancer. Optimal enhancer concentration was 3%. The effect of various adhesives on penetration of clenbuterol was also investigated. Among the adhesives studied, MA-31 was the most effective adhesive. Furthermore, the clenbuterol patch composed of 15% clenbuterol, 3% Labrafil and 82% MA-31, which gave most excellent penetration of drug in in vitro penetration study, maintained therapeutic plasma levels in in vivo study using S.D. rats. These studies demonstrated a good feasibility of clenbuterol administration through the intact skin using a transdermal patch, and show a possibility of the development of clenbuterol patches.

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Effect of Polymerization Conditions on the Characteristics of Polyvinyl Acetate Emulsions

  • Youn, Hye-Jung;Lee, Hak-Lae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.30 no.4
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    • pp.28-34
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    • 1998
  • Polyvinyl acetate emulsion has been widely used as adhesives for wood and paper, paint additives and binders for fiber, leather, and other materials because it is an excellent adhesive with many advantages including low in toxicity risks and manufacturing cost. It is expected the consumption of polyvinyl acetate emulsion as adhesives will increase in cigarette industry as well as in paperboard coating industry. Recently the operation speed of the cigarette tip wrapper increased so substantially that improvement of the emulsion properties is required including good wet tack development, narrow and controlled particle size distribution, low viscosity, etc. In this study the effects of such polymerization conditions as the type and amount of emulsifier, internal or external plasticizing, and emulsification methods on the viscosity and particle size of polyvinyl acetate emulsions were examined. Results showed that polyvinyl alcohol with a high degree of hydrolysis and low molecular weight and nonionic surfactants are superior to anionic surfactant in improving adhesion and emulsion stability. They also tend to produce emulsions with smaller particle size. External plasticization with dipropylene glycol dibenzoate was more effective in improving flexibility than internal plasticization with butyl acrylate. Monomer emulsification under high shear was more effective in decreasing the particle size.

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Development of Transdermal Drug Delivery System for the Combination of Physostigmine and Procyclidine

  • Park, Soon-Cheol;Choi, Hoo-Kyun
    • Journal of Pharmaceutical Investigation
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    • v.31 no.3
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    • pp.181-184
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    • 2001
  • The purpose of this study was to develop transdermal drug delivery system (TDDS) for the combination of physostigmine and procyclidine. The effects of various pressure sensitive adhesives (PSA) on the percutaneous absorption of procyclidine across hairless mouse skin were evaluated to select an appropriate PSA. In addition, the influences of various vehicles on the percutaneous absorption of procyclidine from PSA matrix across hairless mouse skin were evaluated using flow-through diffusion cell system at $37^{\circ}C$. Physostigmine did not have any influence on the permeation rate of procyclidine. The flux of procyclidine was the highest in silicone and PIB and was relatively lower in SIS, Acryl, and SBS adhesive matrices, however, their use was limited by the crystallization of the drug in the matrix. Among acrylic adhesives, the permeability of procyclidine was the highest from poly (ethylene oxide) grafted acrylic adhesive. Some enhancers show different enhancing effect depending on the drug, however, many of the tested enhancers showed enhancing effect for the permeation of both procyclidine and physostigmine to some extent. $Crovol^{\circledR}$ EP 40 showed the highest enhancing effect on the permeation of both compounds. The size of TDDS to provide required permeation rate was estimated to be $35\;cm^2$ based on available information.

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Development of Environmentally Friendly Semi-Structure Poly(Ethylene/Butylene) Rubber-based Pressure Sensitive Adhesive (친환경적인 준구조용 Poly(Ethylene/Butylene) 고무수지계 점착제의 개발)

  • Hong, Soungtaek;Park, Young-Jun;Kim, Hyun-Joong;Dilger, K.
    • Journal of Adhesion and Interface
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    • v.7 no.2
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    • pp.12-18
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    • 2006
  • Recently, as industries and technologies are increased, superior adhesives having more and more developed functions and properties have been demanded. In this article, to use the merits and viscoelastic properties of poly(ethylene/butylene) rubber resin and to supplement the demerits, semi-structure pressure sensitive adhesives (PSAs) are developed. Aslo, it can be said environmentally friendly PSAs because of not use the organic solvent and not emit volatile organic compounds (VOCs).

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New Development of Eco-friendly cementitious Ceramic Tile Adhesive by Thick-Bed method for Polishing tile and Porcelain tile (폴리싱 및 포세린 타일 떠붙임용 시멘트계 친환경 타일접착제 개발)

  • Cho, Chang-Hwan;Lee, Duk-Yong;Lee, Jae-Min;Choi, Il-Joon;Eom, Joo-Il
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2019.11a
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    • pp.62-63
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    • 2019
  • Currently, polymer-based tile cement (Thin-bed method) and epoxy adhesive (Thick-bed method) are mainly used as tile adhesive for polishing and porcelain. In the case of epoxy adhesive, there is a low economic efficiency, there is a problem that the work efficiency is reduced by mixing the resin and the hardener. In particular, the epoxy contains a bisphenol A and amine component, there is a risk of workable disease when a worker is exposed to odor and harmful gases generated in the epoxy adhesive for a long time. Against this background, it is necessary to analyze the hazards of using epoxy adhesives indoors, and develop cementitious high performance tile adhesive products with significantly lower hazards than epoxy adhesives.

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Development of Epoxy Based Stretchable Conductive Adhesive (신축 가능한 에폭시 베이스 전도성 접착제 개발)

  • Nam, Hyun Jin;Lim, Ji Yeon;Lee, Chang Hoon;Park, Se-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.49-54
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    • 2020
  • To attach a stretchable/flexible electrode to something or something to on electrode, conductive adhesives must be stretchable/flexible to suit the properties of the electrode. In particular, conductive adhesive require durability and heat resistance, and unlike conventional adhesives, they should also have conductivity. To this end, Epoxy, which has good strength and adhesion, was selected as an adhesive, and a plasticizer and a reinforcement were mixed instead of a two-liquid material consisting of a conventional theme and a hardener, and a four-liquid material was used to give stretchability/flexibility to high molecules. The conductive filler was selected as silver, a material with low resistance, and for high conductivity, three shapes of Ag particles were used to increase packing density. Conductivity was compared with these developed conductive adhesives and two epoxy-based conductive adhesives being sold in practice, and about 10 times better conductivity results were obtained than products being actually sold. In addition, conductivity, mechanical properties, adhesion and strength were evaluated according to the presence of plasticizers and reinforcement agent. There was also no problem with 60% tensile after 5 minutes of curing at 120℃, and pencil hardness was excellently measured at 6H. As a result of checking the adhesion of electrodes through 3M tape test, all of them showed excellent results regardless of the mixing ratio of binders. After attaching the Cu sheet on top of the electrode through conductive adhesive, the contact resistance was checked and showed excellent performance with 0.3 Ω.