• Restorative Dentistry and Endodontics
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• v.24 no.1
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• pp.156-165
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• 1999

The purpose of this study was to evaluate the effect of surface treatments on the shear bond strength between new and old composites. Circular cavities prepared on the center of acrylic resin mold and the prepared cavities were filled with composite resin. They randomly assigned into control group and 8 groups according to the difference in surface treatments of old composites; Control group: no surface treatment, Group 1: surface treated with #120 SiC paper & bonding agent, Group 2: surface treated with #400 SiC paper & bonding agent, Group 3: surface treated with #120 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 4: surface treated with #400 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 5: surface treated with #120 SiC paper, primer & bonding agent, Group 6: surface treated with #400 SiC paper, primer & bonding agent, Group 7: surface treated with #120 SiC paper, 32% $H_3PO_4$, primer & bonding agent, Group 8: surface treated with #400 SiC paper, 32% $H_3PO_4$, primer & bonding agent. New composites were applicated on the old composites of experimental groups. The shear bond strengths for the experimental specimen were measured and the results were analyzed by using one way ANOVA. The observations of surface morphology after SiC paper roughening and debonded surface morphology after shear bond strength test were done by SEM. The results were as follows; 1. Shear bond strengths for specimens roughened with #120 SiC paper matching with the particle size of coarse diamond bur were significantly higher than those for the specimens with #400 SiC paper(P<0.05). By SEM, the surface of the specimens roughened with #120 SiC paper was more irregular than the specimens with #400 SiC paper. 2. Shear bond strengths for specimens treated with 32% $H_3PO_4$ etchant, primer, bonding resin were significantly higher than those for specimens treated with 32% $H_3PO_4$ and bonding resin(P<0.05). 3. Shear bond strengths for the specimens treated with 32% $H_3PO_4$ etchant and bonding resin were significantly higher than those for specimens treated with only bonding resin(P<0.05). There was no remarkable change of surface morphology after 32% $H_3PO_4$ etching. 4. It was possible to observe mixed fracture patterns (the cohesive fracture of old composite and the adhesive fracture between old and new composite) in the specimens roughened with #120 SiC paper, but almost adhesive fracture in the specimens roughened with #400 SiC paper.

• Journal of the Korean Wood Science and Technology
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• v.44 no.6
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• pp.872-879
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• 2016

Demand of natural interior finishing material has been widely sprayed in nowadays because many weak people as children, pregnant women, and elder people are being struggled with sick house syndrome due to volatile organic compounds such as formaldehyde, toluene, benzene, etc. Our research group developed a no-added formaldehyde adhesive for wood-based panels from mainly rice powder and some additives in the previous study for abating sick house syndrome. Since the rice powder adhesive provides a good source of nutrients with microorganisms, it was suspected a susceptibility of the rice powder adhesive to fungal and sapstain attack. We evaluated anti-sapstain activity of the rice powder adhesives modified by adding wood preservatives. We modified the rice powder adhesive by adding three different types of anti-sapstain preservatives at three different concentrations to assess their anti-sapstin activity. The bonding strengths of the modified rice powder adhesives were still outstanding performance on all samples. Moreover, the plywood manufactured with the modified rice powder adhesive satisfied outdoor use requirement for ordinary plywood (KS F3101, Korean Standard). The results obtained showed that at least 3% of preservative should be added to the rice powder adhesive to obtain effective anti-sapstain activity.

• Advances in aircraft and spacecraft science
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• v.5 no.3
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• pp.385-400
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• 2018

In this paper dynamic behavior (modal analysis and dynamic transient response) of a novel sandwich T-joint is numerically and experimentally investigated. An epoxy adhesive is selected for bonding purpose and making the step wise graded behavior of adhesive region. The effect of the step graded behavior of the adhesive zone on dynamic behavior of a sandwich T-joint is numerically studied. Finite element analysis (FEA) of the T-joints with carbon fiber reinforced polymer (CFRP) face-sheets is performed by ABAQUS 6.12-1 FEM code software. Modal analysis and dynamic half-sine transient response of the sandwich T-joint are presented in this paper. Two verification processes employed to verify the dynamic modeling of the manufactured sandwich panels and T-joint modeling. It has been shown that the step wise graded adhesive zone cases have changed the second natural frequency by about 5%. Also, it has been shown that the different arranges in the step wise graded adhesive zone significantly affect the maximum stresses due to transient dynamic loading by 1112% decrease in maximum peel stress and 691.9% decrease in maximum shear stress on the adhesive region.

• Composites Research
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• v.19 no.3
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• pp.29-36
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• 2006

Since composite materials have anisotropic properties that depend on their stacking angle and sequence, the analysis of joints with isotropic adherends is limited in describing the behavior of the adhesive Joint with composite adherends. In this study, the nonlinear solution for adhesive joints with composite adherends was derived by incorporating the nonlinear behavior of the adhesive into the analysis. The behavior of the laminated composite tube was first analyzed, and the stress distributions of the composite tubular adhesive joint were calculated by including the nonlinear properties of the adhesive. The effect of the stacking sequence of composite adherends and bonding length on torque capacities of joints was examined, and results of the nonlinear analysis were also compared with those of the linear analysis.

• Journal of Welding and Joining
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• v.27 no.3
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• pp.23-31
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• 2009

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.69-69
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• 2004

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.260-263
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• 1999

• Composites Research
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• v.24 no.6
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• pp.56-63
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• 2011

The objective of this study is to investigate appropriate bonding methods of solar cells in order to apply solar cells, which have been receiving particular attention as a renewable energy due to fossil energy depletion and environment issues, to composite structures. Back-contact solar cells with approximately 24.2% energy conversion efficiency were used in this study. Since silicon-based solar cells are mechanically fragile, the secondary-bonding methods using adhesive were examined in this study. The experiment was conducted with three kinds of bonding materials such as EVA film, Resin film and elastic adhesive. The performance of solar cells for three types of adhesives under mechanical loading on test specimens is conducted. In addition, the measuring equipment was designed to evaluate the performance of the solar cells under mechanical loading in real time and the fracture characteristics depending on bonding materials were evaluated. The reason decreasing solar cells efficiency were analyzed and considered by Fractography. The results show that the solar cell performance is largely affected by bonding techniques. Moreover, the bonding method using elastic adhesive shows best solar cell efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.