• Restorative Dentistry and Endodontics
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• v.42 no.2
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• pp.95-104
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• 2017

Objectives: This study evaluated the influence of a multi-mode universal adhesive (MUA) containing silane (Single Bond Universal, 3M EPSE) on the bonding of resin cement to lithium disilicate. Materials and Methods: Thirty IPS e.max CAD specimens (Ivoclar Vivadent) were fabricated. The surfaces were treated as follows: Group A, adhesive that did not contain silane (ANS, Porcelain Bonding Resin, Bisco); Group B, silane (S) and ANS; Group C, hydrofluoric acid (HF), S, and ANS; Group D, MUA; Group E, HF and MUA. Dual-cure resin cement (NX3, Kerr) was applied and composite resin cylinders of 0.8 mm in diameter were placed on it before light polymerization. Bonded specimens were stored in water for 24 hours or underwent a 10,000 thermocycling process prior to microshear bond strength testing. The data were analyzed using multivariate analysis of variance (p < 0.05). Results: Bond strength varied significantly among the groups (p < 0.05), except for Groups A and D. Group C showed the highest initial bond strength ($27.1{\pm}6.9MPa$), followed by Group E, Group B, Group D, and Group A. Thermocycling significantly reduced bond strength in Groups B, C, and E (p < 0.05). Bond strength in Group C was the highest regardless of the storage conditions (p < 0.05). Conclusions: Surface treatment of lithium disilicate using HF and silane increased the bond strength of resin cement. However, after thermocycling, the silane in MUA did not help achieve durable bond strength between lithium disilicate and resin cement, even when HF was applied.

• The korean journal of orthodontics
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• v.49 no.6
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• pp.404-412
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• 2019

Objective: To assess shear bond strength and failure mode (Adhesive Remnant Index, ARI) of orthodontic brackets bonded to polymethylmethacrylate (PMMA) blocks for computer-aided design/manufacture (CAD/CAM) fabrication of temporary restorations, following substrate chemical or mechanical treatment. Methods: Two types of PMMA blocks were tested: $CAD-Temp^{(R)}$ (VITA) and $Telio^{(R)}$ CAD (Ivoclar-Vivadent). The substrate was roughened with 320-grit sandpaper, simulating a fine-grit diamond bur. Two universal adhesives, Scotchbond Universal Adhesive (SU) and Assure Plus (AP), and a conventional adhesive, Transbond XT Primer (XTP; control), were used in combination with Transbond XT Paste to bond the brackets. Six experimental groups were formed: (1) $CAD-Temp^{(R)}/SU$; (2) $CAD-Temp^{(R)}/AP$; (3) $CAD-Temp^{(R)}/XTP$; (4) $Telio^{(R)}$ CAD/SU; (5) $Telio^{(R)}$ CAD/AP; (6) $Telio^{(R)}$ CAD/XTP. Shear bond strength and ARI were assessed. On 1 extra block for each PMMA-based material surfaces were roughened with 180-grit sandpaper, simulating a normal/medium-grit ($100{\mu}m$) diamond bur, and brackets were bonded. Shear bond strengths and ARI scores were compared with those of groups 3, 6. Results: On $CAD-Temp^{(R)}$ significantly higher bracket bond strengths than on $Telio^{(R)}$ CAD were recorded. With XTP significantly lower levels of adhesion were reached than using SU or AP. Roughening with a coarser bur resulted in a significant increase in adhesion. Conclusions: Bracket bonding to CAD/CAM PMMA can be promoted by grinding the substrate with a normal/medium-grit bur or by coating the intact surface with universal adhesives. With appropriate pretreatments, bracket adhesion to CAD/CAM PMMA temporary restorations can be enhanced to clinically satisfactory levels.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.121-124
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• 2003

A new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance was devised to reduce the depth of drawing and the forming load. Taguchi method was employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method was used. The experiments showed that on the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions was reduced by more than 65 percent and the forming load by 50 percent.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.94-97
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• 2005

The strength of aluminum 7075 and carbon composite hybrid joints was studied for adhesive, bolt, and the adhesive-bolt combined joints. Several hybrid joint specimens were tested to get the failure load and modes for three types of the joints. Adhesive Cytec EA9394S was used for aluminum and carbon bonding. Failure load of the adhesive-bolt combined joint was 94 % of the sum of the failure load of the separately bonded and bolted joints. Hybrid joint also showed more stable failure behavior than the simple adhesive or bolted joint.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.860-864
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• 2004

This article discusses the use of pulse-echo ultrasonic testing for the stress analysis of adhesive bonds between metal sheets. The method is based on the measurement of the reflection wave at the metal/adhesive interface. After describing briefly the physical aspects of the phenomenon, an index is defined to detect defective zone of the joint(both for the lack of adhesive and for insufficient adhesion); the influence of the experimental variables(variables stress...) on the measurement is discussed. By means of a control experiment it is shown that Stress Variation in Adhesive Joints are separate to be distingguished. In this paper, Quantitative Nondestructive Evaluation in Adhesive Joints are together with Ultrasonic Testing and Finite Element Method.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.439-445
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• 2012

The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

• Journal of the Korea Institute of Building Construction
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• v.7 no.3
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• pp.107-113
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• 2007

This study is to investigate adhesive properties depending on the temperature, humidity, and freeze-thraw of the Steel plate adhesive strengthening method by the epoxy resin. The results are summarized as following. For the temperature variation, the debonding failure appear only after 1 cycle of temperature varoation because the coefficient of thermal expansion of the epoxy resin is comparatively large, and the bonding strength is decreased. The deformation properties and ultrasonic pulse velocity on each materials are similar until 4 cycles on the dry and moisture test. As the freeze-thraw test, the epoxy resin is degraded easily subjected to freeze-thaw cycle, comparatively easy, so the debonding failure may occur in short term because of the freeze-thaw repeatition.p

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.37-48
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• 2003