• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• 대한치과보철학회지
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• 제41권3호
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• pp.319-324
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• 2003

Statement of problem. Adhesives in dentistry playa major role in the success of restorative treatments. In the treatment of all ceramic restoration it is needed to find the adequate bond strength between enamel and dentin. Purpose. The purpose of this study was to evaluate shear bond strength of resin cement bonded to extracted human uncut enamel, cut enamel, and dentin in vitro. Material and methods. Ten freshly extracted anterior teeth without any previous restorative treatments were chosen. The extracted teeth were embedded in PMMA cold acrylic in the shape of a cylinder, 25 mm in diameter by 25 mm in height. The bonding system used was as follow: Uni-Etch (32% phosphoric acid), One-Step adhesive, Duolink resin cement. The specimens were acid etched and rinsed with water. Two layers of One-Step adhesive were coated with a disposable brush on the uncut enamel. VIP curing light at $500mV/cm^2$ was used to cure the adhesive. For cut enamel shear bond test, the specimen used for uncut enamel was further reduced approximately $0.3{\sim}0.5mm$ using a laminate preparation diamond bur (0.3 mm in depth). The specimens were subsequently treated with 320-grit SiC paper followed by 600-grit SiC paper and cleaned with distilled water. The bonding procedure on the cut enamel was same as uncut enamel bonding procedure. For dentin bonding test, the specimen used for cut enamel was further reduced approximately $0.5mm{\sim}1.0mm$ using a laminate preparation diamond bur (0.5 mm in depth of diamond cutting). The amount of reduction was evaluated with the silicone mold. The specimens were subsequently treated with 320-grit SiC paper followed by 600-grit silicon carbon paper and cleaned in distilled water. The bonding procedure on the dentin was same as uncut enamel bonding procedure. All samples were mounted and secured on the Ultradent shear bond test sample holder, and Ultradent restricted shear bond testing device was used with Universal Instron machine until fracture. Analysis of variance (ANOVA) test was performed comparing the result at P<0.05. Multiple comparison (Tukey) was used to compare each groups. Result. The result showed that the mean value in shear bond strength of resin cement bonded to uncut enamel, cut enamel and dentin were 27.04 Mpa, 30.25 Mpa and 26.39 Mpa with respect. Conclusion. Within the limitation of this study, the mean value of the shear bond strength of cut enamel was higher than those of uncut enamel or dentin. However there existed no statistical differences between three different human dentition substrates due to increased adhesive characteristics.

• Restorative Dentistry and Endodontics
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• 제34권5호
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• pp.397-405
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• 2009

이 연구의 목적은 자가 중합복합 레진과 두 단계 산 부식 접착제의 친화성에 대한 중간 접착제와흐름성 레진의 효과를 미세 인장 결합 강도를 통해 비교하는 것이었다. 20개의 발거된 대구치를 사용해 접착제와 부가적인 적용(활성제, 중간 접착제, 흐름성 레진)에 따라 XP bond 그룹 (XA, XB, XF 그룹), Prime & Bond NT 그룹 (NA, NB, NF 그룹), Optibond solo plus 그룹 (OA, OB OX 그룹)으로 나누었다. 접착제 적용 후 활성제, 중간 접착제, 흐름성 레진을 각각 적용하고 상부에 자가 중합 레진을 축성하였다. 24시간 동안 실온의 증류수에 보관 후 각 그룹당 10개의 시편을 준비하였다. 모든 시편의 미세인장 결합 강도를 측정하여 다음과 같은 결과를 얻었다. 1. 모든 그룹에서 중간 접착제와 흐름성 레진의 적용은 활성제 적용보다 더 높은 결합 강도를 보였다. 2. 선택된 방법에 관계없이, Optibond solo plus 그룹은 가장 낮은 미세인장 결합강도를 보였다. 3. 파절 양상은 대부분 접착성 파절을 보였고 일부 레진 내에서 응집성 파절을 보였다. 이번 연구의 결과로부터, 중간 접착제와 흐름성 레진의 적용이 낮은 pH를 가지는 두 단계 산 부식 접착제와 자가 중합복합 레진의 상아질 접착에 더 효과적이라 예상된다.

• 대한기계학회논문집A
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• 제27권5호
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• pp.840-847
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• 2003

The bonding of adhesive joints of adhesive joints is influenced by the surface roughness of the joining Parts. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, it is shown that surface treatment affects adhesive strength and durability of alumina/polycarbonate single-lap .joints, and leading speed affects tensile-shea strength of adhesive Joints. To evaluate effect of surface treatments on the adhesive strength, several surface treatment methods are used, that is, cleaning, grinding, SiC polishing and sand blasting. It is shown that an optimum value of the surface roughness exists with respect to the tensile-shea strength of adhesive joints. The adhesive strength shows linear relationship with the surface roughness and loading speed. And the mechanical removal of disturbing films of lubricants, impurities and oxides make adhesive strength increase significantly.

• 비파괴검사학회지
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• 제30권3호
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• pp.236-243
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• 2010

Fiber Bragg grating(FBG) sensor arrays can be used to monitor the mechanical behavior of the large composite structures such as wind turbine rotor blades and aircrafts. However, brittle FBG sensors, especially multiplexed FBG sensors are easily damaged when they are installed in the flexible structures. As a protection of brittle FBG sensors, epoxy packaged FBG sensors have been presented in this paper. Finite element analysis and experiments were performed to evaluate the effects of adhesives, packaging materials and the bonding layer thickness on the strain transmission. Two types of epoxy were used for packaging FBG sensors and the sensor probes were attached with various bonding layer thickness. It was observed that thin bonding layer with high elastic modulus ratio of the adhesive to packaging provided good strain transmission. However, the strain transmission was significantly decreased when elastic modulus of the adhesive was much lower than the packaged FBG sensor probe's one.

• Structural Engineering and Mechanics
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• 제78권3호
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• pp.319-332
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• 2021

The wood-concrete composite is an interesting solution in the field of Civil Engineering to create high performance bending elements for bridges, as well as in the building construction for the design of wood concrete floor systems. The authors of this paper has been working for the past few years on the development of the bonding process as applied to wood-concrete composite structures. Contrary to conventional joining connectors, this assembling technique does ensure an almost perfect connection between wood and concrete. This paper presents a careful theoretical investigation into interfacial stresses at the level of the two interfaces in composite wooden beam- reinforced concrete slab strengthened by external bonding of prestressed composite plate under a uniformly distributed load. The model is based on equilibrium and deformations compatibility requirements in all parts of the strengthened composite beam, i.e., the wooden beam, RC slab, the CFRP plate and the adhesive layer. The theoretical predictions are compared with other existing solutions. This research is helpful for the understanding on mechanical behaviour of the interface and design of the CFRP- wooden-concrete hybrid structures.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.17-24
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• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• Journal of Welding and Joining
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• 제33권2호
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• pp.69-77
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• 2015

High strength steels have been continually being developed to improve in fuel economy in automotive and ensure safety of passengers. New bonding and welding methods have been required for improving weldability on high strength steels. In this study, resistance spot welding and Weld-bond with nugget diameters of 4.0mm, 5.0mm, 6.0mm and 7.0mm were produced and tested, respectively. In order to confirm the effect of nugget diameters on tensile shear characteristic of the Weld-bond, tensile shear characteristics of Weld-bond were compared with those of resistance spot welding and adhesive bonding. Peak load of Weld-bond were increased as the nugget diameter increases. After appearing maximum peak load continuous fracture followed with second peak owing to load being carried by resistance spot weldment. Fracture modes of the adhesive layer in Weld-bond fractures were represented by mixed fracture mode, which are cohesive failure on adhesive part and button failure at resistance spot welds. The results showed that the tensile shear properties can be improved by applying Weld-bond on TRIP steel, and more apparent with nugget diameter higher than 5${\surd}$t.

• Journal of Welding and Joining
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• 제34권1호
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• pp.59-67
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• 2016

The automotive manufactures increase their use of lightweight materials to improve fuel economy and energy usage has a significant influence on the choice of developing materials. To meet this requirements manufacturers are replacing individual body parts with lightweight metals, for these the process treating and painting surfaces is changing. The pre-coated steels are newly developed to avoid the conventional complex and non-environmental painting process in the body-in-white car manufacturing. The development of new joining techniques is critically needed for pre-coated steel sheets, which are electrically non-conductive materials. In the present study, dissimilar combination of pre-coated steel and galvanized steel sheets were joined by the self-piercing rivet, adhesive bonding and hybrid joining techniques. The tensile shear test and free falling high speed crash test were conducted to evaluate the mechanical properties of the joints. The highest tensile peak load with large deformation was observed for the hybrid joining process which has attained 48% higher than the self-piercing rivet. Moreover, the hybrid and adhesive joints were observed better strain energy compared to self-piercing rivet. The fractography analyses were revealed that the mixed mode of cohesive and interfacial fracture for both the hybrid and adhesive bonding joints.

• 한국정밀공학회지
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• 제30권2호
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• pp.154-163
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• 2013

Adhesive bonding and plastic welding have been widely used to join two plastic materials together. The goal of this paper is to determine a proper joining technology of a pair of flat panel (FP) photobioreactor (PBR) case. The material of the FP PBR case is polycarbonate (PC) plate. Two types of adhesion, including acryl adhesive and two-part epoxy adhesive, as well as two types of plastic welding technology, including ultrasonic welding and thermal welding, are employed for joining of PC plates. In order to influence of the adhesion and welding conditions on the joining characteristics of the PC plates in operational conditions of the FP PBR case, the morphology in the vicinity of the joined region as well as the water and pressure resistance characteristic are investigated. In addition, the variation of the bonding strength of the joined region and deformation behaviors in the vicinity of the joined region according to the adhesion and welding conditions is examined via the lap-shear test. From the results of basic experiments, proper joining technologies are chosen. Using the chosen joining technologies, the FP PBR case are fabricated to perform full-scale durability experiment. The results of the full-scale durability experiment have been shown that the chosen joining technologies can be applicable to fabricate the FP PBR case.