• Proceedings of the KSME Conference
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• 2007.05a
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• pp.421-425
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• 2007

In the fabrication of dry adhesive structure, increasing contact-points or contact-area is the primary goal because the adhesive force grows in proportion to the contact-area. The simplest way to extend the contact surface is the fabrication by using soft materials. However, the column-array structure could confront the matting phenomenon which columns are stuck together. Therefore, we need a novel design to reduce the effective stiffness with adequate stiff materials like a gecko's setae. In this study, we propose a novel design for the dry adhesive structure. Moreover, we analyzed whether the adhesive structure conforms the rough surface sufficiently through finite element method adopted the non-bonding interaction as the body force. Also, we fabricated the novel structures via UV lithography and some techniques. In addition, we examined the adhesive force of the novel structures.

• Restorative Dentistry and Endodontics
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• v.33 no.6
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• pp.526-536
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• 2008

The purpose of this study was to compare the effect of various dentin bonding systems on microtensile bond strength of immediate dentin sealing (IDS) and delayed dentin sealing (DDS). Eighteen extracted permanent molars were used in this study. The teeth for DDS group were restored with a provisional restorations, and immersed in saline solution for 1 week, and divided into 3 subgroups according to various dentin bonding adhesives; SB subgroup (3 step total-etch adhesive), SE subgroup (2 step self-etch adhesive), XE subgroup (1 step self-etch adhesive). In IDS group, the teeth were divided into 3 subgroups, and applied with bonding adhesives as in DDS group. The teeth were restored with provisional restorations, and immersed in saline solution for 1 week. Indirect composite disc was cemented with resin cement, and all specimens were subjected to microtensile bond strength. The data were statistically analyzed with oneway ANOVA and Student t-test. The results were as follows: 1. The IDS group showed significantly higher ${\mu}TBS$ than DDS group in 3 step total-etch and 2 step selfetch adhesive (p < 0.05). 2. In IDS and DDS group, 3 step total-etch adhesive showed the highest ${\mu}TBS$ value, followed by 2 step self-etch, and 1 step self-etch adhesive. In IDS group, the ${\mu}TBS$ value for 1 step self-etch adhesive was significantly different from those of the other subgroups (p < 0.05), and in DDS group, there were statistical differences in all subgroup (p < 0.05). 3. Failure modes of tested dentin bonding adhesives were mostly mixed failure and only 1 step self-etch adhesive showed adhesive failure.

• Journal of the Korean Wood Science and Technology
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• v.39 no.4
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• pp.344-350
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• 2011

In this study, LVLs of radiata pine were fabricated with non-preservative treated veneers, CuAz treated veneers, and ACQ treated veneers, using aqueous vinyl urethane adhesive and phenol modified resorcinol resin adhesive. Then density gradient, bonding strength, bending properties and decay resistance of LVLs were evaluated. As results, the cone-shaped and higher density gradient pattern was found in layer close to glueline. After cyclic water boiled test, the LVL bonded with aqueous vinyl urethane resin adhesive was delaminated in all layers or partly delaminated including check, chasm in glueline layer. In the case of LVL bonded with phenol modified resorcinol resin adhesive, despite slight cupping due to great glueline stress and vertical check between glueline layers, it was observed that the bonding strength to delamination was higher, owing to most absence of delamination through overall glueline. On the other hand, in the decay test, mass loss by brown rot fungi was greater than white rot fungi in LVL bonded with aqueous vinyl urethane resin adhesive. However, in LVL bonded with phenol modified resorcinol resin adhesive, the mass loss by brown rot fungi was slight and non-preservative treated LVL was low. The mass loss of preservative-treated LVL was 0 (zero), showing the high decay resistance effect.

• The korean journal of orthodontics
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• v.34 no.4 s.105
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• pp.333-342
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• 2004

The purpose of this study was to evaluate the clinical effectiveness of a plasma arc light and light emitting diode (LED), compared with shear bond strength and the failure pattern of brackets bonded with visible light in direct bonding. Brackets were bonded with Transbond XT to 60 human premolars embedded in the resin blocks according to different light-curing methods. Then, the shear bond strength of each group was measured using a universal testing machine (Instron) and the adhesive failure pattern after debonding was visually examined by light microscope. The results were as follows: 1. The shear bond strength showed no significant difference between the visible light and light emitting diode, but the plasma arc light exhibited a significantly lower shear bond strength compared with the visible light and light emitting diode. 2. In the visible light and light emitting diode, adhesive failure patterns were similar. Bond failure occurred more frequently at the enamel-adhesive interface. 3. The bonding failure of brackets bonded with plasma arc light occurred more frequently at the bracket-adhesive interface. The results of this study suggest that plasma arc light, light emitting diode and visible light are all clinically useful in the direct bonding of orthodontic brackets.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.903-904
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.747-748
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.749-750
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• 2011

• Journal of Welding and Joining
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• v.34 no.6
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• pp.28-34
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• 2016

Galvannealed(GA) steels are now generally used in car body manufacturing for corrosion resistance. In this study, the weldability and joint mechanical behavior of a newly developed 1.2GPa grade GA ultra high strength TRIP(transformation induced plasticity) steel was investigated for three joining processes, such as adhesive bonding, resistance spot welding and weldbonding. Under both shear and peel stress conditions, the failure mode of the adhesive joints were the mixture of the adhesive cohesive failure, adhesive interface failure and coating layer failure. It means that the adhesion strength of GA coating onto the base metal was similar to that of adhesive bonding onto the GA coating. Under the shear stress condition, the weldbonding exerted to expand the optimal spot welding condition of 1.2GPa GA TRIP steel because the strength of adhesive bond overwhelmed that of the resistance spot weld. Under the peel stress condition, the weldbonding also exerted to expand the optimal spot welding condition of 1.2GPa GA TRIP steel by inducing the tear fracture mode rather than the partial plug fracture mode.

• Restorative Dentistry and Endodontics
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• v.40 no.1
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• pp.23-29
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• 2015

Objectives: The aim of this study was to evaluate the effect of pre-etching on the bond strength of silorane-based composite specific adhesive system to dentin. Materials and Methods: Thirty human molars were randomly divided into 5 groups according to the different bonding strategies. For teeth restored with silorane-based composite (Filtek Silorane, 3M ESPE), the specific self-etching adhesive system (Adhesive System P90, 3M ESPE) was used with and without pre-etching (Pre-etching/Silorane and Silorane groups). Teeth restored with methacrylate based-composite (Filtek Z250, 3M ESPE) were hybridized with the two-step self-etching system (Clearfil SE Bond, Kuraray), with and without pre-etching (Pre-etching/Methacrylate and Methacrylate groups), or three-step adhesive system (Adper Scotchbond Multi-Purpose, 3M ESPE) (Three-step/Methacrylate group) (n = 6). The restored teeth were sectioned into stick-shaped test specimens ($1.0{\times}1.0mm$), and coupled to a universal test machine (0.5 mm/min) to perform microtensile testing. Results: Pre-etching/Methacrylate group presented the highest bond strength values, with significant difference from Silorane and Three-step/Methacrylate groups (p < 0.05). However, it was not significantly different from Pre-etching/Silorane and Methacrylate groups. Conclusions: Pre-etching increased bond strength of silorane-based composite specific adhesive system to dentin.