• Title/Summary/Keyword: Adhesive-bonding

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플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향 (Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding)

  • 최원정;유세훈;이효수;김목순;김준기
    • 한국재료학회지
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    • 제22권9호
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    • pp.454-458
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    • 2012
  • Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

Ply-lam CLT의 합판 접합방식에 따른 휨 성능 평가 (Evaluation of Flexural Performance According to the Plywood Bonding Method of Ply-Lam CLT)

  • CHOI, Gyu Woong;YANG, Seung Min;LEE, Hyun Jae;KIM, Jun Ho;CHOI, Kwang Hyeon;KANG, Seog Goo
    • Journal of the Korean Wood Science and Technology
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    • 제49권2호
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    • pp.107-121
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    • 2021
  • 본 연구에서는 층재 수종과 길이방향의 합판 접합방식과 접합부의 접착제 도포 여부에 따른 휨 성능 및 파괴 양상 분석을 통하여 합판을 코어로 사용한 CLT에 적합한 합판의 접합 방식을 최적화 하고자 하였다. 더글라스 퍼 층재의 경우 길이방향 접합에 의해 휨탄성계수 약 11.5% 감소, 휨강도는 접착제 도포 및 접합방식에 따라 증가 또는 감소하였다. 접착제 미도포 butt joint, 접착제 도포 half lap joint, butt joint 조건이 최적조건으로 도출 되었다. 낙엽송 층재의 경우 길이방향 접합에 의해 휨강도는 약 15%, 휨탄성계수는 약 40% 감소하였으며 접합방식에 따른 차이를 나타내지 않았다. half lab joint와 tongue & groove joint 사용 시 합판 층의 접합부에서 휨에 파괴를 1차적으로 방지해줌으로써 중층의 층재로 전달되는 하중을 감소시켜 주는 것으로 판단된다. 본 연구 결과를 통해 Ply-lam CLT 제조과정에서 낙엽송 층재를 사용하는 경우 접합방법에 따른 차이를 나타내지 않았으며 더글라스퍼 층재를 사용할 경우 butt joint와 half lap 접합 방식이 적합할 것으로 판단된다.

상아질과 접착제 간의 계면양상 (INTERFACIAL MORPHOLOGY BETWEEN DENTIN AND ADHESIVES)

  • 강지영;허복
    • Restorative Dentistry and Endodontics
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    • 제20권1호
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    • pp.183-192
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    • 1995
  • The purpose of this study was to evaluate the effect of smear layer management on the interfacial morphology between dentin bonding system and dentin. Clearfil New Bond, Scotchbond Multipurpose, Prisma Universal Bond 3 and X-R Bond were used on the cervical dentinal surfaces of bovine incisor teeth. All of the dentin bonding systems were labeled with fluorescene in primer and rhodamine B in adhesive. Specimens of 2~3mm thichness were prepared by longitudinal and labiolingual sectioning. The interface between dentin bonding system and dentin was observed by flouresence imaging with a confocal laser scanning microscope. Following results were obtained. 1. In the specimen of Clearfil New Bond, dentinal tubules were widened by destruction of peritubular dentin in the course of treatment with phosphoric acid of high concentration. 2. Hybrid layer was observed in the specimen of Scotchbond Multipurpose and X-R Bond. 3. In the specimen of Prisma Universal Bond 3, the penetraton of adhesive was not observed clearly.

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RFID tag의 제작 공정에서 비등방 전도성 접착제를 사용한 flip chip bonding 조건의 영향 (Influence of Flip Chip Bonding Conditions Using Anisotropic Conductive Adhesive(ACA) in the Fabrication of RFID Tag)

  • 이준식;김정한;김목순;이종현
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.223-226
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    • 2007
  • 본 연구에서는 Ag anisotropic conductive adhesive(ACA)의 종류, 경화 조건 및 안테나 패턴의 재질에 따른 flip chip bonding된 RFID die의 접합부 신뢰성이 조사되었다. 접합강도 측정에 의하여 접합강도가 최적화되는 공정 시간을 결정할 수 있었으며, 그러한 최적의 공정조건에서는 paste-type Ag ink로 인쇄된 안테나 상에서의 RFID die의 접합강도가 Cu 재질 안테나에 비해 상대적으로 높게 측정됨을 알 수 있었다. RFID tag의 인식거리 측정 시험을 통하여 적절한 경화 조건이 적용된다면 안테나의 재질이 인식거리 변화에 가장 주요한 영향을 미치는 인자임을 알 수 있었다. 아울러 Cu 안테나 패턴은 RFID die의 접합 과정에서 곡률을 가지며 휘어지면서 인식거리와 관련된 long-tem reliability를 악화시킬 수 있음을 관찰할 수 있었다.

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Bond between FRP formworks and concrete-effect of surface treatments and adhesives

  • Goyal, Reema;Mukherjee, Abhijit;Goyal, Shweta
    • Steel and Composite Structures
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    • 제20권3호
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    • pp.671-692
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    • 2016
  • FRP stay-in-place (SIP) formworks are designed as a support for casting concrete and as a tension reinforcement when concrete is cured. Bond development between SIP formwork and concrete is critical for FRP tension element to be effective. This paper reports the bond strength between FRP formwork and concrete for different interfacial treatments. A novel experimental setup is prepared for observing the bond behaviour. Three different adhesives with varying workability have been investigated. Along with the load-deformation characteristics, bond slip and strains in the formwork have been measured. A finite element numerical simulation was conducted for the experiments to understand the underlying mechanism. The results show that the adhesive bonding has the best bond strength.

교정용 브라켓의 간접 접착법

  • 차봉근
    • 대한치과의사협회지
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    • 제37권7호통권362호
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    • pp.530-535
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    • 1999
  • Detailed finishing of the occlusion is a clinical skill that has become difficult with the development of fixed appliances. Accuracy of bracket placement definitely improves with indirect technique, Several methods for the placement of orthodontic brackets on dental casts are currently used in the indirect bonding technique. These include attachment by means of bonding resins, adhesive tapes or sticky wax. This article presents the indirect procedures of our clinic, which use paste-paste chemically cured composites. Detailed laboratory and clinical procedure for dual tray method and other application of indirect bonding will be presented.

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고분자 접착제와 금속 피착재의 접착강도에 미치는 피착재 두께의 영향 (Effects of Adherend Thickness on Adhesive Strength between Organic Adhesive and Metal Adherend)

  • 하윤근;심준형;백주환;김민균;조영래
    • 마이크로전자및패키징학회지
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    • 제27권4호
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    • pp.127-133
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    • 2020
  • 고분자 재료인 접착제와 금속 피착재 사이의 정량적인 접착강도 측정은 중요하다. 고분자 재료인 접착제와 금속 피착재 사이의 접착강도 측정 시, 피착재의 종류와 두께 변화가 접착강도에 미치는 영향에 대해 연구하였다. 금속 피착재의 종류로는 알루미늄과 스텐리스강 2종류가 선택되었으며, 접착강도의 측정에는 돌리테스트와 전단시험이 사용되었다. 인장응력 방식의 돌리테스트로 고분자 접착제와 금속 피착재 사이의 접착강도 측정 시, 금속 피착재의 두께 변화는 접착강도의 크기에 거의 영향을 미치지 않았으나, 피착재의 종류에 따라 접착강도는 다르게 나타났다. 반면, 전단시험으로 고분자 접착제와 금속 피착재 사이의 접착강도 측정 시, 금속 피착재의 상대적 두께 변화는 접착강도의 크기에 영향을 주었다. 이유는 전단시험 시 접착부의 모서리 부분에서 발생하는 피착재의 휘어짐 현상은 접착부에 추가적인 인장응력을 발생시켜 접착강도를 낮추는데 기여하기 때문이다. 이 연구의 결과, 돌리테스트는 피착재의 두께가 변해도 접착강도의 변화가 거의 없기 때문에 고분자 접착제와 금속 피착재의 정량적인 접착강도 측정 시 널리 사용될 것으로 예상된다.

Research on Flame Retardant Formaldehyde-Free Plywood Glued by Aqueous Polymer Isocyanate Adhesive

  • WEN, Ming-Yu;ZHU, Jia-Zhi;ZHU, Meng;SUN, Yao-Xing;PARK, Hee-Jun;SHI, Junyou
    • Journal of the Korean Wood Science and Technology
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    • 제48권5호
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    • pp.755-764
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    • 2020
  • Due to pronounced mechanical performance and being environmental friendly, aqueous polymer isocyanate adhesive (API) has been widely applied in the production of formaldehyde-free wood products. In this study, flame retardant formaldehyde-free plywood was prepared by incorporation of flame retardants into the API adhesive. Partially phosphorylated poly (vinyl alcohol) (PPVA) which was prepared by reacting poly (vinyl alcohol) with phosphoric acid was used to replace PVA in API formula. In addition, Mg-Al layered double hydroxides (LDH) was chosen as additive flame retardant, replacing traditional filler CaCO3 in API adhesive formula. And then, the flame retardant API adhesive with main agent (PPVA replacing PVA70wt.%, SBR emulsion 30wt.%), curing agent 10wt.% (accounts for of the main agent), and 20wt.% LDHs (accounts of the main agent) was used to prepare flame retardant plywood. The effect of application of PPVA and Mg-Al LDH on bonding strength of plywood was investigated. The flammability characteristics of the plywood were determined by cone calorimeter test (CCT). The results revealed that compared with the plywood prepared with API adhesive, the use of PPVA and LDH enhanced the flame retardancy of plywood without negatively affecting bonding strength. The CCT tests indicated that the heat release and smoke production flame retardant API plywood were lower than those of the ordinary API glued plywood. Promising developments for flame retardant API adhesive were expected in future applications of flame retardant formaldehyde-free plywood.