• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Journal of the Korean Society of Industry Convergence
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• v.27 no.3
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• pp.619-627
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• 2024

By analyzing the structure of the currently used Lead Tab tape structure, the outermost layer, low-temperature fusion functionalized olefin, was composed of pp base. To determine whether this could be used as the outermost layer of tab tape, the adhesive strength to metal foils such as copper and aluminum was measured and the adhesive strength was compared with commercially available functionalized olefin. When chlorine was grafted onto PP among the PP used in the composition, the average adhesive strength was similar to that of commercially available LT200T and superior to RE140R and LE320V. The maximum adhesive strength exceeded that of LE200T. When it comes to solvents, xylene has been shown to be better than any other. Physical methods such as substitution of other monomers, switching of additives or let-down hardly changed the adhesion of grafted PP, and the selection of PP is an important factor in preparing functional polymers.

• Polymer(Korea)
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• v.38 no.3
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• pp.397-405
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• 2014

To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under $250{\mu}m$) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in $0.1{\mu}m$ thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

• Journal of Gifted/Talented Education
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• v.12 no.4
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• pp.108-119
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• 2002

We have analyzed students' reports on a problem for 'adhesive tape' among ten assigned problems in the first Korean youth physics tournament (KYPT). There were five team' s reports on this problem. Students reported that the reasons for lightening coming out from the stripping down adhesive tape are caused by electrostatic friction, electron transfer, energy transformation, etc. However, only few teams suggest new creative ideas with divergent thinking during their inquiry process. Because the KYPT is a debate based on the problem solving by inquiries, the reports should include the creative investigations by their own ideas in every steps of inquiry up to their final conclusions.

• Journal of Applied Reliability
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• v.9 no.4
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• pp.331-341
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• 2009

PSA (Pressure Sensitive Adhesive) is used for various purposes in electronic appliances such as double-sided tape for fitting parts, product's name plate, and surface protecting film, and so forth. In several kinds of PSAs, this paper dealt with the failure analysis of PET (Polyethylene Terephthalate) acrylic adhesive tapes. The causes of interface failure were investigated through the test of adhesive strength, thickness, and structure. And test standard methods to prevent recurrences were established.

• Nuclear Engineering and Technology
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• v.40 no.1
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• pp.93-98
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• 2008

Several adhesive tapes have been studied in terms of their suitability for securing gold wires into positions for neutron flux measurements in the reactor core and irradiation facilities surrounding the core of the Open Pool Australian Light water (OPAL) reactor. Gamma ray spectrometry has been performed on each irradiated tape in order to identify and quantify activated components. Numerous metallic impurities have been identified in all tapes. Calculations relating to both the effective neutron shielding properties of the tapes and the error in measurement of the $^{198}Au$ activity caused by superfluous activity due to residual tape have been made. The most important identified effects were the prolonged cooling times required before safe enough levels of radioactivity to allow handling were reached, and extra activity caused by residual tape when measured with an ionisation chamber. Knowledge of the most suitable tape can allow a minimal contribution due to these effects, and the use of gamma spectrometry in preference to ionisation chamber measurements of the flux wires is shown to make all systematic errors due to the tape completely negligible.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.73-76
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• 2020

Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.9-16
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• 2012

In order to describe external effects on the behavior of the adhesive tape, the semi-rigid body cylinder chain model for adhesive tape has been proposed as follows. Firstly the behavior of the tape is in detail investigated while it's being pulled off from the plate, and subsequently a relevant phenomenological model is designed. Then all the contributors affecting the force to peel out the tape from plate (hereafter, the pull out force) are clearly defined and their sensitivity analyses are made to set up the experimental reference condition, under which the angular dependence of the pull out force is measured in every $10^{\circ}$. The experimental data turn out to be in good agreement with the theoretical ones by our model within the measurement error, and the effects due to other factors are proved to be well explained from the phenomenological viewpoint. From these results, the concept of this study might be expected to be very useful for the test and evaluation of PSA types of adhesive tape.

• Journal of Convergence for Information Technology
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• v.7 no.4
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• pp.75-81
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• 2017

The design trend of information technology is quickly changed with the times. The design trend of information display is a bezel-less display, recently. The bezel-less display or edge-less display is a new trend of mobile phone display. In this study, the shading tape was manufactured for assembling process of touch panel display with the high screen-to-body ratio so-called bezel-less display. The shading tape was fabricated on PET film with the UV curable acrylic pressure sensitive adhesive(PSA) by roll-to-roll process. The UV curable PSA was synthesized with the eco-friendly toluene-less manufacturing method. The adhesive power of manufactured shading tape was investigated by motorized tensile testing machine. The thixotropic, maintaining property of cutting shape, was characterized by field emission scanning electron microscope. As results, the shading tape exhibits high adhesive power and good thixotropic performance suitable for assembly process of touch panel display. The functional shading tape will be expected to improve productivity of assembly process of touch panel display.

• Composites Research
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• v.37 no.3
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• pp.232-237
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• 2024

Adhesive tapes can be conveniently used for various applications by combination of materials requiring diverse mechanical strength and specific adhesives. Duct tape is usually readily available and one of the most widely used adhesive tapes. Duct tapes are composite materials with good mechanical strength consisted of fiber material, which is different from other tapes. In addition, electrical insulation tapes are used for very long period of time for insulating cables, and are also used for reinforcement of mechanical strength and increasing damping of cable in practice. Recently, variety of foam tapes and double-sided tapes are widely used in diverse applications. However, there is no previous work readily available clearly illustrating noise isolation performance of tapes. In present work, noise isolation performance of tapes is presented by measurement of insertion loss of variety of tapes on a small hole. Double-side foam tapes presented the best noise isolation performance among adhesive tapes measured in present work.