• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Polymer(Korea)
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• v.33 no.4
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• pp.319-325
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• 2009

The solution polymerization was conducted to synthesize pressure sensitive adhesive for polarizer film using acrylic monomers. 2-Ethylhexylacrylate, butylacrylate, acrylic acid were used as acrylic monomers. The ratio was 2-ethylliexylacrylate:butylacrylate:acrylic acid=25:50:3.6 by reflecting $-40^{\circ}C$ of glass transition temperature in the pressure sensitive adhesive. When 1 wt% of coupling agent was added to the polymerized pressure sensitive adhesive, the light transmissivity was significantly increased. This result is due to the enhancement of adhesive power against liquid crystal cell by Si-O bond of coupling agents. Cross-linking agent was added by 0.5, 1.0, and 1.5 wt% with respect to the synthesized polymer. Initial tackiness decreased, while cohesion increased with increasing crosslinking agent. In the analysis of contact angle, the increase of crosslinking agents yielded the enhancement of surface energy, resulting in the decrease of contact angle. From the measurement of heat resistance, the acrylic pressure sensitive adhesive showed excellent heat resistance regardless of change in temperature and contents in crosslinking agent. In the observation of a cutting plane, the increased crosslinking agent represented a smoother and cleaner section. Comprehensively, the optimum additive amount of crosslinking agent was determined to be 1.0 wt% to monomer.

• Proceedings of the Korea Concrete Institute Conference
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• 2000.10b
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• pp.1121-1126
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• 2000

The purpose of this study is to clarify chemical resistance of polymer-cement slurry coated reinforcing bars. Polymer cement slurry coated reinforcing bars were showed the good state to the bending resistance, impact resistance, adhesive strength, but exact data of the chemical resistance do not exist. Through the experimental, it is to certify chemical resistance of polymer cement slurry coated reinforcing bars. In this study, polymer cement slurry coated reinforcing bars are prepared with two types of polymer, polymer-cement ratios of 50%, 100%, 150%, coating thickness, curing periods of 3, 7, 28days, and tested for chemical resistance as KS(Korea Standard). From the test results, chemical resistance of polymer cement slurry coated reinforcing bars used by acrylic and St/BA emulsion were showed excellent without concerned polymer-cement ratios, curing period except for 1% aqueous solution $H_2SO_4$. But polymer cement coated reinforcing bar used by acrylic emulsion is inferior to aqueous solution NaOH.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.50-56
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• 2003

Metal matrix composites(MMC) consist of metal matrix into which is distributed a second solid phase. The normal intension is to develop a material with superior mechanical properties (for example increased toughness, stiffness and wear resistance) compared to those inherent in the matrix component. In this study, WC-12%Co/low carbon steel MMC overlays have been prepared by Gas Metal Arc Welding(GMAW) according to feeding rate of WC-12%Co grit. The macro and microstructures were examined using optical microscopy (OM) and scanning electron microscopy(SEM) each other. The characteristics of hardness and wear resistance have been investigated. WC-12%Co/low carbon steel MMC overlays which have been taken good beads without porosity and cracks were manufactured by method of GMAW. Matrix of overlayed surface was seen as fish bone and faceted dendrite structures. It was known that structures were iron tungsten carbides, Fe$_{6}$W$_{6}$C which have been occurred by melting of WC-12%Co grits. After MMC had been tested by block-roll wear test it was known that WC-12%Co/low carbon steel MMC has a excellent wear resistance by exiting Fe6w6c and WC-12%Co grit. The consequence was that region of overlay with Fe$_{6}$W$_{6}$C phase has been showed a model of adhesive wear, but region of overlay with WC-12%Co grit was restrained as a result of mechanism that wear of WC-12%Co grit is not adhesive but fracture.racture.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Elastomers and Composites
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• v.36 no.4
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• pp.225-236
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• 2001

In order to improve the properties of the copolymer and the terpolymer that was used as removal-type pressure sensitive adhesive(PSA), we synthesized quaterpolymer with the variation of the types of monomer, initiator, and solvent, and concentration, the monomer/solvent ratio, reaction temperature and time. and determined the properties of this adhesive: the viscosity, molecular weight, conversion, solid content and structure of polymer. The prepared polymer was crosslinked by changing the type of crosslinking agent and concentration, and then we investigated the characteristics or adhesive such as peel adhesion, shear adhesion, heat resistance, weathering resistance and peel adhesion to aging. The optimum performance of RA/2- EHA/MMA/2-HEMA as a PSA were obtained when benzoyl peroxide was used as an initiator with the reactant mixture consisted of 80% BA and 2-EHA, 15%, MMA, and 5% 2-HFMA. The optimum reaction temperature and time were $80^{\circ}C$ and 8 hours, respectively. For BA/2-EHA/MMA/AA, the optimum performance was obtained when the polymerization was performed at the monomer composition of 80% BA/2-EHA, 15% MMA, and 5% AA. BPO was used as initiator and the optimum reaction temperature and time were identical to those of BA/2-EHA/MMA/ 2-HEMA. Isocyanate and melamine were used to crosslink BA/2-EHA/MMA/2-HEMA and BA/2-EHA/MMA/AA, respectively. No effect on the type of cross-linking agent on the peel adhesion was observed with aging. The quarterpolymers crosslinked with melamine left residues on the counter surface after weathering resistance test, while the polymers crosslinked with isocyanate did not.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.49-54
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• 2020

To attach a stretchable/flexible electrode to something or something to on electrode, conductive adhesives must be stretchable/flexible to suit the properties of the electrode. In particular, conductive adhesive require durability and heat resistance, and unlike conventional adhesives, they should also have conductivity. To this end, Epoxy, which has good strength and adhesion, was selected as an adhesive, and a plasticizer and a reinforcement were mixed instead of a two-liquid material consisting of a conventional theme and a hardener, and a four-liquid material was used to give stretchability/flexibility to high molecules. The conductive filler was selected as silver, a material with low resistance, and for high conductivity, three shapes of Ag particles were used to increase packing density. Conductivity was compared with these developed conductive adhesives and two epoxy-based conductive adhesives being sold in practice, and about 10 times better conductivity results were obtained than products being actually sold. In addition, conductivity, mechanical properties, adhesion and strength were evaluated according to the presence of plasticizers and reinforcement agent. There was also no problem with 60% tensile after 5 minutes of curing at 120℃, and pencil hardness was excellently measured at 6H. As a result of checking the adhesion of electrodes through 3M tape test, all of them showed excellent results regardless of the mixing ratio of binders. After attaching the Cu sheet on top of the electrode through conductive adhesive, the contact resistance was checked and showed excellent performance with 0.3 Ω.

• Elastomers and Composites
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• v.43 no.1
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• pp.39-48
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• 2008

Peel strength of epoxy adhesives can be increased by adding some amounts of XNBR. In this case, thermal resistance of the adhesive will be decreased by decrease of glass transition temperature of the adhesive. Epoxy resin modified with siloxane-imide was synthesized to improve thermal resistance and peel strength of the adhesive, after that the properties of modified epoxy resin were compared with the commercial epoxy resin. When 5% XNBR was added to 30% modified epoxy resin, this adhesive showed 0.42 N/mm of peel strength and $155^{\circ}C$ of glass transition temperature. These properties are enough compared to the required properties by the industry, i.e., 0.3 N/mm and $150^{\circ}C$, respectively. Weight loss of the modified epoxy resin by the treatment of nitric acid and 0.1N NaOH was reduced, but weight gain by the humid condition was increased by the presence of benzene ring and imide ring. 30% modified epoxy resin blended with 5% XNBR showed 220% improvement in tensile strength and elongation compared to the case of common epoxy resin. This is due to the flexibility of the siloxane in the modified epoxy resin.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2005.05a
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• pp.1-4
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• 2005

This study is to examine adhesion the characteristics of self adhesive asphalt to minimize of the construction periods and the environmental problems through the performance estimation of materials to reduce waterproof problem and the long durability maintenance of building structures. This study tested the estimation items of self rubberized adhesive asphalt to examine the sheet discovered the most important problem in the construction site and the connection stability in the sheet joint. Besides, this study examined the material characteristics such as tension property, tear property, temperature dependence, heat resistance, adhesion stability and so on. Test results of the separative items satisfied in the reference figure of connection stability and adhesion stability which could confirm adhesion performances and other items also satisfied in the reference.

• Journal of the Korean institute of surface engineering
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• v.31 no.1
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• pp.34-44
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• 1998

Stainless steel is being used widely lor various purposes due to its good corrosion resistance. There has becn much research to produce colored stainless sterl by several methods. In this experiment, we coated TixN film on the SUS304 substrate with thc DC magnetron sputtering system and studied the internal structurc and adhesive strength of the films as a function of the coating conditions. Before lhe specimen was coated, a sputter etching was very effective in removing the$\delta$ Fe(BCC) phase as well as the contaminant and oxide layer as well as increasing rotghness. Five-stage failure mode appeared with increased scratch load with the TIN films coated on the SUS304 in this manner ; tensile failure-,conformal failure-,buckling failure->chipping failurc and spalling Failure. When the failure was terminated at the initial stage, the film will have good adhesion. But, if syalling failure has occurred at the initial scratch, then the adhesion will be poor. The interlayer between thc coated film and thc substratc was homogeneously adhcsive when the $\gamma'-Fe_4N$ phase wasn't detected in the XRD analysis and the adhesive strength only was reduced by surPace defects. But, when the ,$\gamma'-Fe_4N$N phasc was detected in the XRD analysis, the adhesive strength was very poor.