• Title/Summary/Keyword: Adhesive layer

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All-Organic Nanowire Field-Effect Transistors and Complementary Inverters Fabricated by Direct Printing

  • Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.632-632
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    • 2013
  • We generated single-crystal organic nanowire arrays using a direct printing method (liquidbridge- mediated nanotransfer molding) that enables the simultaneous synthesis, alignment and patterning of nanowires from molecular ink solutions. Using this method, single-crystal organic nanowires can easily be synthesized by self-assembly and crystallization of organic molecules within the nanoscale channels of molds, and these nanowires can then be directly transferred to specific positions on substrates to generate nanowire arrays by a direct printing process. The position of the nanowires on complex structures is easy to adjust, because the mold is movable on the substrates before the polar liquid layer, which acts as an adhesive lubricant, is dried. Repeated application of the direct printing process can be used to produce organic nanowire-integrated electronics with twoor three-dimensional complex structures on large-area flexible substrates. This efficient manufacturing method is used to fabricate all-organic nanowire field-effect transistors that are integrated into device arrays and inverters on flexible plastic substrates.

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Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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Ultrasonic Scatter and Compensation of Interfacial Crack due to Thickness Variation of Dissimilar Bonded Components (이종 접합부재의 두께 변화에 따른 계면균열의 초음파 산란 보정)

  • Park, Sung-Il;Chung, Nam-Yong;Jin, Yoon-Ho
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.25-30
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    • 2004
  • In this paper, the compensation of interfacial scatter due to adhesive layer and adherend thickness ratio variation was applied to improve measuring precision by calculating ultrasonic attenuation coefficient in the Al/Epoxy dissimilar bonded components. The optimum condition of theoretical value and experimental measuring accuracy by the ultrasonic method in the Al/Epoxy dissimilar bonded components have been investigated. From the experimental results, we proposed a measurement method of the interfacial crack lengths by the ultrasonic attenuation coefficient and discussed it.

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A Study on Evaluation of Bending Strength in FGM (경사기능재료의 굽힘강도 평가에 관한 연구)

  • Song, Jun-Hee;Kim, Hong-Gun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.6
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    • pp.658-663
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    • 2009
  • Metal/ceramic composites structures have many attractive properties with great potential for applications that demand high stiffness as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. Thus, determination of adhesive properties for coating part is one of the most important problems for the extension of the use of coated materials. In this work, bending strength of Functionally Graded Materials(FGM) are evaluated by means of bending strength tester. The graded layer according to the load condition showed the change of the bend strength.

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Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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The Effect of Corona Treated on Laminating Film and Its Analytical Study by SEM (라미네이팅 필름의 코로나 처리 효과와 주사 전자현미경을 이용한 해석)

  • Kim, Jong-Gyu;Kim, Yang-Pioung
    • Journal of the Korean Graphic Arts Communication Society
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    • v.26 no.2
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    • pp.15-30
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    • 2008
  • Studies were carried out the phenomenal observation on the effect of corona treated hotmelt laminating film in process of manufacture by 2 kinds of experiments. These are as follow: 1) In order to verify the treatment reducing value of dynes and dynes durability with the lapse of time, it was checked dynes of a pair of 4 bar discharge electrode with 9 one for 144 hr., and it show results that 9 bar discharge electrode has higher initial dynes as well as keep up 48 dynes durability long than 4 one. 2) Drawn an inference from 3 actions -Chemical-Physical-Mechanical, on laminating film in terms of SEM's observation that are the adhesive status in boundary of corona treated base film, extrusion coating hotmelt layer, and configuration of hotmelt surface after corona treated. In tandem system, EVA layers adhesion keep its stability without corona discharge treatment.

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Interfacial ultrastructure of the AQ Bond Plus

  • Haruyama, Chikahiro;Amgai, Tetsuya;Sugiyama, Toshiko;Muto, Yoshitake;Takase, Yasuaki;Hirai, Yoshito
    • Proceedings of the KACD Conference
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    • 2003.11a
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    • pp.601-601
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    • 2003
  • AQ Bond Plus has the function of self-etching priming adhesive, which can be applied by single coating without second coating, being different from conventional AQ bonds. Moreover, because the absorption range of light became wider, the bond can comply with any visible light curing units. Thus, the bond can produce an unified form between the dentine layer with impregnated resin of good quality and the thin and hard film characteristically. In this study, we investigated the junctional conditions of AQ Bond Plus, using a scanning electron microscope (SEM).(omitted)

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Plasma Surface Treatment of Aluminum Extrusion Die (알루미늄 압출용 금형의 플라즈마 표면처리)

  • Choi, In Kyu;Lee, Su Young;Kim, Sang Ho
    • Journal of the Korean institute of surface engineering
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    • v.47 no.6
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    • pp.282-286
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    • 2014
  • Wear characteristic of the nitrided SKD61 which is a typical mold material using for the extrusion of Al6061 alloy was investigated. The surface of SKD61 was nitrided by salt bath and plasma processes. The thickness of surface nitride layer was about $8.9{\mu}m{\sim}21.3{\mu}m$. Reciprocating friction wear test conducted using pin on disk type indicated the plasma treatment followed salt bath has a lower friction coefficient and a smaller adhesive wear with Al6061 alloy. That was identified by the $Fe_4N$ which has a better wear resistance than FeN mainly formed by plasma nitriding.

Detection of edge delamination in surface adhered active fiber composites

  • Wang, Dwo-Wen;Yin, Ching-Chung
    • Smart Structures and Systems
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    • v.5 no.6
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    • pp.633-644
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    • 2009
  • A simple method has been developed to detect the bonding condition of active fiber composites (AFC) adhered to the surface of a host structure. Large deformation actuating capability is one of important features of AFC. Edge delamination in adhesive layer due to large interfacial shear stress at the free edge is typically resulted from axial strain mismatch between bonded materials. AFC patch possesses very good flexibility and toughness. When an AFC patch is partially delaminated from host structure, there remains sensing capability in the debonded part. The debonding size can be determined through axial resonance measured by the interdigitated electrodes symmetrically aligned on opposite surfaces of the patch. The electrical impedance and modal response of the AFC patch in part adhered to an aluminum plate were investigated in a broad frequency range. Debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of in-situ detecting the progressive delamination between AFC patch and host plate is demonstrated.

Numerical analysis of the behaviour of repaired surface cracks with bonded composite patch

  • Merzoug, Mohamed;Boulenouar, Abdelkader;Benguediab, Mohamed
    • Steel and Composite Structures
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    • v.25 no.2
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    • pp.209-216
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    • 2017
  • In this paper, the analysis of the behavior of surface cracks in finite-thickness plates repaired with a Boron/Epoxy composite patch is investigated using three-dimensional finite element methods. The stress intensity factor at the crack-front was used as the fracture criteria. Using the Ansys Parametric Design Language (APDL), the stress intensities at the internal and external positions of repaired surface crack were compared. The effects of the mechanical and geometrical properties of the adhesive layer and the composite patch on the variation of the stress intensity factor at the crack-front were examined.