• 한국표면공학회지
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• 제31권1호
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• pp.34-44
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• 1998

Stainless steel is being used widely lor various purposes due to its good corrosion resistance. There has becn much research to produce colored stainless sterl by several methods. In this experiment, we coated TixN film on the SUS304 substrate with thc DC magnetron sputtering system and studied the internal structurc and adhesive strength of the films as a function of the coating conditions. Before lhe specimen was coated, a sputter etching was very effective in removing the$\delta$ Fe(BCC) phase as well as the contaminant and oxide layer as well as increasing rotghness. Five-stage failure mode appeared with increased scratch load with the TIN films coated on the SUS304 in this manner ; tensile failure-,conformal failure-,buckling failure->chipping failurc and spalling Failure. When the failure was terminated at the initial stage, the film will have good adhesion. But, if syalling failure has occurred at the initial scratch, then the adhesion will be poor. The interlayer between thc coated film and thc substratc was homogeneously adhcsive when the $\gamma'-Fe_4N$ phase wasn't detected in the XRD analysis and the adhesive strength only was reduced by surPace defects. But, when the ,$\gamma'-Fe_4N$N phasc was detected in the XRD analysis, the adhesive strength was very poor.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.725-726
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• 2010

• 월간포장계
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• 통권341호
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• pp.89-92
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• 2021

• 대한치과보철학회지
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• 제32권2호
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• pp.212-224
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• 1994

The purpose of this study was to evaluate and compare film thickness of five kinds of resin luting cements [Comspan, Panavia Ex, Maryland bridge adhesive, All-bond C & B cementation kit, and Super-bond C & B]. Zinc-phosphate cement and glass-ionomer cement were used as the control group. In order to measure the film thickness the methods used were in broad compliance with ADA Specification No. 8, a tapered-die system that simulates clinical conditions more closely, and the connected tapered-die system that simulates bridge conditions. The inorganic filler size of resin cements was also examined with scanning electron micrographs. The results were obtained as follows ; 1. The film thickness of resin cements was increased in the order of Comspan, Panavia Ex, Super-bond C & B, Maryland bridge adhesive, and All-bond C & B cementation kit. Maryland bridge adhesive and All-bond C & B cementation kit showed significantly higher film thickness than the control group(p<0.01). 2. For all resin cements, there was a significant difference of film thickness between the ADA method and the tapered-die system. Generally, the tapered-die system demonstrated lower film thickness than the ADA method(p<0.01). 3. There was no significant difference in film thickness between the tapered-die system and the tapered-die bridge system in all resin cements(p<0.01). 4. The scanning electron microscope showed that the cement with larger filler had a tendency to be higher in film thickness.

• Journal of Electrochemical Science and Technology
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• 제12권3호
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• pp.330-338
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• 2021

An integral electrode-bipolar plate assembly, which is composed of electrode, conductive adhesive film (CAF) and bipolar plate, has been developed and evaluated for application with a vanadium redox flow battery (VRB) to decrease contact resistance between electrode and bipolar plate. The CAF, made of EVA (ethylene-vinyl-acetate) material with carbon black or CNT (Carbon Nano Tube), is applied between the electrode and the bipolar plate to enable an integral assembly by adhesion. In order to evaluate the integral assembly of VRB by adhesive film, the resistivity of integral assembly and the performance of single cell were investigated. Thus, it was verified that the integral assembly is applicable to redox flow battery. Through resistance and contact resistance of bare EVA and CAF films on bipolar plate were changed. Among the adhesive films, CAF film coated with carbon black showed the lowest value in through resistance, and CAF film coated with CNT showed the lowest value in contact resistance, respectively. The efficiency of VRB single cell was improved by applying CAF films coated with carbon black and CNT, resulting in the reduced overvoltage in charging process. Therefore, the energy efficiency of both CAF films, about 84%, were improved than that of blank cell, about 79.5 % under current density at 40 mA cm^-2. The energy efficiency of the two cells were similar, but carbon black coated CAF improved the coulomb efficiency and CNT coated CAF improved the voltage efficiency, respectively.

• 접착 및 계면
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• 제22권3호
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• pp.98-105
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• 2021

본 연구에서는 실란기가 도입된 UV 경화형 우레탄 아크릴레이트를 사용하여 투명성 및 접착성/이형성을 갖춘 silver nanoparticle 전사용 접착 조성물을 제조하였다. Silver nanoparticle이 PET 위에 패터닝되어 있는 Ag/PET 필름과 전사 대상인 PC필름 사이에 제조한 접착 조성물을 도포하고 UV로 광경화한 후, PET를 제거하여 Ag/PC 필름을 제조하였다. 실란기가 도입된 UV 경화형 우레탄 아크릴레이트는 polycaprolactone diol (PCL)과 isophrone diisocyanate (IPDI), 2-hydroxyethyl methacrylate (HEMA), (3-aminopropyl)triethoxysilane (APTES)를 사용하여 합성하였다. APTES의 실란기는 특수 처리된 Ag표면과 반응하여 계면접착력이 개선될 수 있으며, 실란기가 도입된 우레탄 아크릴레이트와 희석제로 투입하는 기능성 아크릴 희석제에 의하여 PC필름과의 접착력을 향상시켰다. 우레탄 아크릴레이트 합성은 FT-IR을 이용하여 분석하였으며, APTES의 몰비와 아크릴 희석제 조성에 따라, 접착 특성과 광학 특성, 전사 특성 등을 비교하였다. 결과적으로, PUA2S1_0.5의 조건으로 제조된 접착 조성물에서 가장 우수한 전사 특성을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2019년도 추계 학술논문 발표대회
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• pp.229-230
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• 2019

Integrated water-soluble film is dissolved in the rubber asphalt waterproof sheet to secure adhesive strength on freshly cast concrete on the adhesion side of waterproofing layer on the floor slab. In addition, in order to determine whether the water in the concrete slurry can dissolve the water-soluble film sufficiently, the adhesive strength of the waterproofing sheet was compared between difference wetness condition at the upper part of the concrete specimen before the concrete casting.

• Elastomers and Composites
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• 제44권2호
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• pp.175-181
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• 2009

편광필름용 점착제를 합성하기 위해 아크릴 모노머를 사용하여 용액중합을 수행하였다. 아크릴 모노머는 2-ethylhexyl acrylate, butyl acrylate, acrylic acid를 사용하였으며, 개시제는 benzoyl peroxide, 용매는 ethyl acetate가 사용되었다. 모노머의 비율은 점착제의 유리전이온도 $-40^{\circ}C$에 맞추어 2-ethylhexyl acrylate: butyl acrylate: acrylic acid = 25:50:3.6 이였다. 개시제의 첨가량은 점착제의 젖음성과 초기점착력을 고려하여 모노머 대비 0.09%로 결정하였다. 모노머와 용매의 비율은 젖음성과 투과율을 고려하여 1:1.7로 하였다. 점착제 필름의 투과율은 점도가 낮을수록, 분자량이 작을수록, 분자들 간의 얽힘이 적어져서 굴절율이 낮아지고 투과율이 증가함을 알 수 있었다. 사용가능 기간의 측정에서 모노머와 용매의 비율이 1:1.7일 경우 점도가 200분이 지나도 커다란 변화가 없어 저장안정성이 좋음을 확인할 수 있었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.