• 한국재료학회지
• /
• 제9권1호
• /
• pp.65-72
• /
• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• 한국재료학회지
• /
• 제12권9호
• /
• pp.740-746
• /
• 2002

In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.

• Transactions on Electrical and Electronic Materials
• /
• 제1권3호
• /
• pp.23-28
• /
• 2000

A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G$\sub$IC//Results showed that the black-oxide layer was composed of two kinds of layers: pebble-like Cu$_2$O layer and acicular CuO layer, At the initial stage of oxidation the Cu$_2$O layer was preferentially formed and thickened up to around 200 nm whithin 1 minute of the oxidation time. Then the CuO layer started to from atop of the Cu$_2$O layer and thickened up to around 1300 nm until 20 minutes. As soon as the CuO layer formed, the thickness of Cu$_2$O layer began to reduce and finally reached to around 150 nm. The pre-cleaned and the Cu$_2$O coated leadframes showed almost no adhesion of EMC, however, as the CuO precipitates appeared and became continuous, G$\sub$IC/ increased up to around 80 J/㎡. Further oxidation raised G$\sub$IC/ up. to around 100 J/㎡.

• 한국전기전자재료학회논문지
• /
• 제31권4호
• /
• pp.244-248
• /
• 2018

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and $O_2gas$. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

• Journal of the Korean Wood Science and Technology
• /
• 제41권2호
• /
• pp.134-140
• /
• 2013

UV curing was introduced via a chemical treatment by adding small amounts of a hexafunctional acrylic monomer and a photoinitiator to improve the mechanical properties of PLA. This study also employed a semi-interpenetrated structured polymer network through the process of UV-curing. The UV curing behaviors were investigated using FTIR-ATR spectroscopy and gel fraction determination. Also, the tensile strength was investigated with different hexafunctional acrylic monomer contents and UV doses. The results showed that the crosslinking of UV-induced chemically treated PLA started at a low content of hexafunctional acrylic monomer, resulting in a significant improvement of the mechanical properties compared to those of neat PLA due to crosslinking.

• 한국재료학회지
• /
• 제15권7호
• /
• pp.458-464
• /
• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국재료학회지
• /
• 제15권1호
• /
• pp.42-46
• /
• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 방사선산업학회지
• /
• 제4권4호
• /
• pp.335-339
• /
• 2010

In this study, the surface of polyimide (PI) films was modified using ion implantation to enhance its adhesion to a deposited copper (Cu) layer. The surfaces of the PI films were implanted with 150 keV $Xe^+$ ions at fluences varying from $1{\times}10^{14}$ to $1{\time}10^{16}ions\;cm^{-2}$. The Cu layers were then deposited on the implanted PI. The surface properties of the implanted PI film were investigated based on the contact angle measurements, Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Furthermore, the adhesive strength between the deposited Cu layer and PI film was estimated through a scratch test using a nanoindenter. As a result, the surface environment of the PI film was changed by the ion implantation, which could have a significant effect on the adhesion between the deposited Cu layer and the PI.

• 접착 및 계면
• /
• 제8권4호
• /
• pp.23-31
• /
• 2007

고분자 소재에 평판형 플라즈마 전처리 방식을 적용시켜 표면의 접촉각 및 접착력을 향상시켰다. 분위기 기류를 질소로 하고 유량을 30~100 mL/min, 반응시간은 0~30초로 하여 PU 소재를 주 물질로 하여 EVA foam, Leather (Action), Rubber, Unwoven 소재에 대하여 각 조건별로 플라즈마 처리시켜 처리 전후의 각 소재별 접촉각과 접착박리강도 측정을 통한 소재의 물성변화와, SEM분석을 이용한 처리 전후의 표면 변화를 측정하여 플라즈마 처리의 영향과 효과를 산출하였다. 대기압 평판형 플라즈마 반응기를 이용하여 최적 조건인 기체유량 100 mL/min, 전처리시간 10초에서 EVA foam, Leather (Action) 및 Rubber 소재의 접촉각 감소와 접착력 향상을 확인하였다.

• Journal of the Korean Wood Science and Technology
• /
• 제46권2호
• /
• pp.189-201
• /
• 2018

Intumescent system is a highly effective flame retardant technology that takes advantage of the mechanism of foaming and carbonization. In order to materialize Intumescent system, it is necessary to use reinforcement material to improve the strength of the material. In this study, we used kenaf as a natural fiber to manufacture intumescent/EVA (ethylene vinyl acetate) composites to improve mechanical and flame retardant performance. Finally two materials with different particle shape are applied to one system. Therefore, the influence factors of the particles with different shapes on the composite material were analyzed based on the tensile test. For this purpose, we have used the tensile strength analysis model and confirmed that it can only act as a partial strength reinforcement due to weak binding force between the matrix and particles. In the combustion characteristics analysis using cone calorimeter and UL 94, the combustion characteristics were enhanced as the content of Intuemscent was increased. As the content of kenaf increased, combustion characteristics were strengthened and carbonization characteristics were weakened. Through the application of kenaf, it can be confirmed that elastic modulus improvement and combustion characteristics can be strengthened, which confirmed the possibility of development of environmentally friendly flame retardant materials.