• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2014년도 춘계 학술논문 발표대회
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• pp.232-233
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• 2014

Recently, water treatment facility is usually eastablished in underground, and waterproofing and anti-corrosion materials for concrete structures applied water treatment tank is developing in various ways. However, as the limit of research focused on durability improvement of top coating material, it is insufficient to study on the adhesion strength between the concrete surface and primer. Therefore, there is to confirm the adhesion of between concrete surface and the three primers used as anti-corrosion waterproofing materials, and to investigate the properties of adhesion strength according to the condition such as wet codition and water pressure condition of the concrete surface in this study.

• 한국표면공학회지
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• 제24권1호
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• pp.18-24
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• 1991

In the present work the adhesion failure of a hot-dip galvanized coating has been studied as a function gas composition temperature of strip and of atmospheric gas in furnace. The adhesion failure of the hot-dip galvani-zed coating is classified as three mechanisms : carbon deposition, oxide film formation and alloy layer formation. The adhesion failure due to oxide film formation decreased markedly by increasing the gases temperature of direct fired furnace(DFF) in order to improve the reducing ability of steel strip. Optimum conditions of operating and manufacturing facilities for improving the coating adherence are suggested by analyzing the interface between steel substrate and coating layer.

• 열처리공학회지
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• 제5권1호
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• pp.1-12
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• 1992

In order to improve adhesive force of TiN film, we sputtered titanium as interlayer before TiN deposition by Plasma Enhanced Chemical Vapour Deposition. We observed changes of hardness and adhesion at a various thickness of titanium interlayer and also examined analysis. At the critical thickness of the titanium interlayer(about $0.2{\mu}$), adhesive force of TiN films were promoted mostly. But over the critical thickness, a marked reduction of adhesive force was showed, because of the internal stress of titanium interlayer. From AES analysis, the adhesion improvement of TiN films was mainly caused by nitrogen diffusion into titanium interlayer during TiN deposition process which relieved stress concentration at TiN coating-substrate interface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.232-233
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• 2005

The Surface of semi-conductive silicone rubber was treated by oxygen plasma to improve adhesion and electric performance in joints between insulating and semi-conductive silicone materials. Surface characterizations were assessed using contact angle measurement and Fourier transform infrared spectroscope (FTIR). Adhesion level was understood from T-peel tests between plasma treated semi-conductive and insulating material. Electrical breakdown strength was measured to understand the charge of electrical performance. From the results, the oxygen plasma treatment produces a significant increase in function group of containing oxygen which can be mainly ascribed to the creation of carbonyl groups on the silicone surface from the strength were improved. Therefore it is concluded then plasma treatment leads to decrease voids originating form poor adhesive, and the improve the adhesion in silicone interface. So we could obtain higher electrical design level of silicone material used for electrical apparatus using oxygen plasma treatment.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부A
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• pp.163-167
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• 1998

In this paper an improved re-adhesion control scheme is proposed for IC4M(1-Controller 4-Motors) traction system. It is well known that the coefficient of adhesion between wheel and rail has a maximum value at a certain slip velocity. In the proposed scheme, maximum adhesive force is estimated by an observer and the driving torque of motor is controlled to set maximum adhesive force. The simulation results are presented.

• Journal of Welding and Joining
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• 제17권2호
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• 한국염색가공학회지
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• 제31권2호
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• pp.107-117
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• 2019

In case of pure rubber materials, the initial quality of the rubber materials would be excellent, however, the durability against external impact might be poor. In order to overcome the relatively low durability, textile cord could be employed with silicone rubber. We have studied the improvement of heat-resistant adhesion properties of silicone adhesives between silicone rubber and PET fibers by applying various conditions including dip solution recipe. The silicone rubber used was a platinum catalyst curing type and platinum catalyst type silicone adhesive was used as an adhesive to obtain an optimum adhesive force. Furthermore, the bonding mechanism between silicone and PET fiber was established.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 추계학술발표대회 논문집
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• pp.32-35
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• 1999

Poly(arylene ether phosphin oxide) (PEPO), Udel$^{\circledR}$ P-1700, Ultem$^{\circledR}$ 1000. poly(hydroxy ether) (PHE), carboxy modified poly(hydroxy ether)(C-PHE) and poly(hydroxy ether ethanol amine) (PHEA) were utilized for a coating of carbon fibers. Interfacial shear strength(IFSS) of polymers to carbon fibers was also evaluated in order to understand the adhesion mechanism. IFSS was measured via micro-droplet tests, and failure surfaces were analyzed by SEM. Diffusion between polymer and vinyl ester resin was investigated as a function of styrene content; 33. 40 or 50wt.% and the solubility parameters of polymers were calculated. The results were correlated to the interfacial shear strength. The highly enhanced interfacial shear strength (IFSS) was obtained with PEPO coating, and marginally improved IFSS with PHE, Udel$^{\circledR}$ and C-PHE coatings, but no improvement with PHEA and Ultem$^{\circledR}$ coatings.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.11-17
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• 2004

This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of $O_2$/Ar when performed to plasma pretreatment. The results are that Ni was superior to Cr at peel test according to a species of the buffer layer, peel strength and Cu THK were showed proportional relation to deposition structure of the same buffer layer and sample of the Cr depositied time(30 sec) and Cu depositied time(20 min) was showed good adhesion to peel test according to Cr's depositied time and Cu's depositied time. When perform PI's plasma pretreatment peel strength and $O_2$/Ar ratio were showed proportional relation. But $O_2$/Ar(2/5) was best condition since then decreased.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.51-56
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• 2022

Recently, the demand for semiconductors is expanded to various industries, and the use of high-quality and high-performance chips is increasing. With the trend, the diameter magnification and high integration of the semiconductor wafers are mandatory. As a result, there is a growing demand for the productivity improvement and the surface precision. There have been many studies on the stabilization of the wafer manufacturing processes in order to satisfy those specifications. Many complaints have been appealed by the wafer buyers that there are many unacceptable wafers with surface defects and foreign material adhesion which are caused by the vibrations during transportation. This study intends to derive the material improvement of the packing box of the wafers to suppress the vibrations of the box, and eventually to reduce the surface defects and the foreign material adhesion. The result shows that optimal material can substantially decrease the vibration of the packing box.