• Transactions on Electrical and Electronic Materials
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• v.15 no.3
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• pp.164-169
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• 2014

We investigated the etching characteristics of $HfAlO_3$ thin films in $O_2/Cl_2/Ar$ and $O_2/BCl_3/Ar$ gas, using a high-density plasma (HDP) system. The etch rates of the $HfAlO_3$ thin film obtained were 30.1 nm/min and 36 nm/min in the $O_2/Cl_2/Ar$ (3:4:16 sccm) and $O_2/BCl_3/Ar$ (3:4:16 sccm) gas mixtures, respectively. At the same time, the etch rate was measured as a function of the etching parameter, namely as the process pressure. The chemical states on the surface of the etched $HfAlO_3$ thin films were investigated by X-ray photoelectron spectroscopy. Auger electron spectroscopy was used for elemental analysis on the surface of the etched $HfAlO_3$ thin films. These surface analyses confirm that the surface of the etched $HfAlO_3$ thin film is formed with nonvolatile by-product. Also, Cl-O can protect the sidewall due to additional $O_2$.

• Transactions of Materials Processing
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• v.14 no.7 s.79
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• pp.624-627
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by I-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50nm in diameter, 150nm in pitch, and 50nm in depth.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.192-196
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.60-63
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.1
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• pp.106-121
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• 2007

The purpose of this study was to examine the effects of suggested etching method on the performance of pits and fissures sealant. In the first part, seventy extracted sound human permanent third molars and premolars were used. The teeth were randomly divided and performed in three different groups as follows : conventional etching, enameloplasty, and testing group. Non-pumicing, dye-guidance vigorous brushing-start etching technique was applied on the occlusal of testing group. Then the pit and fissure sealant was applied on all of the specimens. After the thermocycling and immersing in 1% methylene blue, the resin embedded sections were made. The microleakage data on the section were then recorded under the stereoscope and statistic analysis was done. Additional experiments were also performed : direct fissure surface etched pattern experiment, replica study, and micro-shear bond strength testing observation. The second part included two groups. A paired study was designed to evaluate the influence the environment has on the performance of the sealant. After etching, half of each occlusal surface received one of the two following treatments in succession: sealing in laboratory and intraoral condition (group 1), sealing in intraoral condition with and without a single-bonding agent (group 2). The results of present study can be summarized as follows: - The microleakage of testing group was significant different with conventional method (P<.05) and was not different with the enameloplasty group (P>.05). - The quality and quantity of etched enamel were improved. - Microshear bond strength of testing group was higher than control group (p<.05). - The environmental condition was influenced on the performance of the sealant. The testing etching method modified the capacity of the etching agent to penetrate into the pits and fissures, and simultaneous enhance their efficiency in vitro condition.

• Restorative Dentistry and Endodontics
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• v.35 no.5
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• pp.321-334
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• 2010

Objectives: The purpose of this study is to evaluate bonding efficacy by means of measuring the effect of remained solvent on Degree of conversion(DC) and ${\mu}TBS$ and FE-SEM examination. Materials and Methods: Two 2-step total etching adhesives and two single-step self etching adhesives were used in this study. First, volume weight loss of 4 dentin adhesives were measured using weighting machine in process of time in normal conditions and calculate degree of evaporation (DE). Reaction/reference intensity ratio were measured using micro-Raman spectroscopy and calculate DC according to DE. Then 2 experimental groups were prepared according to air-drying methods (under, over) and control group was prepared to manufacturer's instruction. Total 12 groups were evaluated by means of micro tensile bond strength and FE-SEM examination. Results: Degree of evaporation (DE) was increased as time elapsed but different features were observed according to the kind of solvents. Acetone based adhesive showed higher DE than ethanol and butanol based adhesive. Degree of conversion (DC) was increased according to DE except for $S^3$ bond. In ${\mu}TBS$ evaluation, bond strength was increased by additional air-drying. Large gaps and droplets were observed in acetone based adhesives by FE-SEM pictures. Conclusions: Additional air-drying is recommended for single-step self etching adhesive but careful consideration is required for 2-step total etching adhesive because of oxygen inhibition layer. Evaporation method is carefully chose and applied according to the solvent type.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.224-232
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• 2000

Aluminum metal process in surface micromachining enables to fabricate Al electrodes or Al structures, which improve electrical characteristics by reducing contact- and line-resistance or makes the whole process to be simple by using oxide as sacrificial layer. However, it is not possible to use conventional sacrificial layer etching process, because HF solution attacks aluminum as well as sacrificial oxide. The mixed solution of BHF and glycerine as an alternative shows the adequate properties to meet with this end. The exact etching properties, however, are sensitively depends on the geometry of the released structure, because the most etching process of sacrificial layer proceeds to the lateral direction in narrow space. Also, the surface roughness of aluminum affects to the etching characteristics. This paper reports experimental results on the effect of microstructure and surface roughness of aluminum to the etching properties. Considering these effects, we propose the optimized etching condition, which can be used practically for the fabrication of aluminum electrodes and microstructures by using standard surface micromachining process without modification or additional process.

• Journal of Dental Rehabilitation and Applied Science
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• v.35 no.2
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• pp.72-80
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• 2019

Purpose: The purpose of this study is to compare and analyze the shear bond strength and fracture pattern in different enamel tooth surface treatments for resin splinting materials. Materials and Methods: G-FIX and LightFix were used as tooth splinting materials. Twenty bovine mandibular incisors were used for the preparation of the specimens. The exposed enamel surface was separated into four parts. Each tooth was treated with 37% phosphoric acid, 37% phosphoric acid + adhesive resin, 37% phosphoric acid + G-premio bond, and G-premio bond for each fraction. Shear bond strength was measured using a universal testing machine. After measuring the shear bond strength, the fractured surface of the specimen was magnified with a microscope to observe the fracture pattern. Two-way ANOVA was used to verify the interaction between the material and the surface treatment method. One-way ANOVA was used for comparison between the surface treatment methods of each material and post-hoc test was conducted with Scheffe's test. An independent t-test was conducted to compare shear bond strengths between materials in each surface treatment method. All statistics were conducted at 95% significance level. Results: G-FIX, a tooth splinting resin, showed similar shear bonding strength when additional adhesive resins were used when material was applied after only acid etching, and LightFix showed the highest shear bonding strength when additional adhesive resins were used after the acid etching. In addition, both G-FIX and LightFix showed the lowest shear bond strength when only self-etching adhesive was applied without additional acid etching. Verification of interactions observed interconnection between resins and surface treatment methods. Most of the mixed failure was observed in all counties. Conclusion: When using G-FIX and LightFix, which are tooth-splinting materials, it is considered that sufficient adhesion will be achieved even after applying only acid etching as instructed by the manufacturer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.58-62
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• 2003

Silicon carbide (SiC) was etched in a $NF_3/CH_4$ inductively coupled plasma. The etch process was modeled by using a neural network called generalized regression neural network (GRNN). For modeling, the process was characterized by a $2^4$ full factorial experiment with one center point. To test model appropriateness, additional test data of 16 experiments were conducted. Particularly, the GRNN predictive capability was drastically improved by a genetic algorithm (GA). This was demonstrated by an improvement of more than 80% compared to a conventionally obtained model. Predicted model behaviors were highly consistent with actual measurements. From the optimized model, several plots were generated to examine etch rate variation under various plasma conditions. Unlike the typical behavior, the etch rate variation was quite different depending on the bias power Under lower bias powers, the source power effect was strongly dependent on induced dc bias. The etch rate was strongly correated to the do bias induced by the gas ratio. Particularly, the etch rate variation with the bias power at different gas ratio seemed to be limited by the etchant supply.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.6
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• pp.533-538
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• 2014

We fabricated grooved mushroom structures with anisotropic wettability on silicon substrates using basic MEMS processes. The geometry of these grooved mushroom structures could be changed by controlling the additional IPA solution during Si etching by TMAH solution. To understand anisotropic wettability, contact angles (CAs) of hexadecane droplets were measured in the orthogonal and parallel directions to grooved lines. The CA measurement results displayed anisotropic wetting on the grooved mushroom structures. However, specimens with $80{\mu}m$ distance between top layers displayed isotropic and superoleophobic wetting. This study demonstrates that the thickness of the top layer is more critical than the width or height of the ridge when determining the wettability of organic solvent. Despite the wide distance between top layers ($80{\mu}m$), the specimen with a thin top layer (100 nm) showed highly anisotropic wetting and low CA due to the pinning of droplets at the edge of the top layer.