• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.310-313
• /
• 2005

In recent years, as the robot technology is developed, the researches on the artificial muscle actuator that enable robot to move dexterously like biological organ become active. The widely used materials for artificial muscle are the shape memory alloy and the electro-active polymer. These actuators have the higher energy density than the electro-mechanical actuator such as motor. However, there are some drawbacks for actuator. SMA has the hysterical dynamic characteristics. In this paper, the simulation of anthropomophic robotic hand is performed using ADAMS and the segmented binary control for reducing the hysteresis of SMA is proposed. SMA is controlled by thermo-electric module. The relations between the force and the hysteresis are developed to verify the validity of the suggested method.

• Journal of the Korean Society for Precision Engineering
• /
• v.12 no.9
• /
• pp.167-174
• /
• 1995

This paper experimentally demonstrates the feasibility of using shape memory alloy(SMA) actuators in controlling structural vibrations of a flexible cantilevered beam. The dynamic characteristics of the SMA actuator are identified and integrated with the beam dynamics. Three types of control schemes; constant amplitude controller(CAC), proportional amplitude controller (PAC) and sliding mode controller(SMC) are designed. The CAC and PAC are determined on the basis of physical phenomenon of the SMA actuator, while teh SMC is formulated in a mathematical manner. The proposed controllers are implemented and evaluated at various operating condirions by investigating the control level of suppression in transient vibration.

• The Journal of the Korea Contents Association
• /
• v.9 no.11
• /
• pp.90-99
• /
• 2009

This paper presents the implementation of RFID EPC global network educational system based on using 900MHz air interface between the reader and the active tag. The software of reader and the active tag is developed on embedded environment, and the software of PC controlling the reader is based on window OS operated as the server. The ATmega128 VLSI chip is used for the processor of the reader and the active tag. As the development environment, AVR compiler is used for the reader and the active tag of which the programming language is C. The visual C++language of the visual studio on the PC activated as the server is used for development language. Main functions of this system are to control tag containing EPC global Data by PC through the reader, to obtain information of tag through the internet and to read/write data on tag memory. Finally the data written from the active tag's memory is sent to the PC via the reader as "read" operation and compare the received data with one already sent to the tag. Software implementation of 900MHz EPC global RFID educational system is done on the basis of these functions.

• Journal of IKEEE
• /
• v.27 no.1
• /
• pp.25-29
• /
• 2023

Effect of the processes of polysilazane solid electrolyte layer and silver (Ag) active electrode on the electrical characteristics of memristor was investigated. The memristor with the solid electrolyte annealed at higher temperature exhibited the higher set voltage and better memory retention characteristics than that annealed at lower temperature. The increase in the set voltage and the improvement of the memory retention characteristic at high annealing temperature were attributed to a reduction in the void density and an increase in the void uniformity inside the solid electrolyte, respectively. In the case where the polysilazane solution's concentration is high, the memristor exhibited rapid degradation of low resistive state even annealed at high temperature. Lastly, it was shown that the memristor with the solution-processed Ag active electrode showed WORM property unlike that with the vacuum-processed Ag active electrode. The WORM property was possibly due to morphological defects present in the solution-processed Ag active electrode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.5
• /
• pp.285-290
• /
• 2015

The phase change memory material is an active element in phase change memory and exhibits reversible phase transition behavior by thermal energy input. The doping of the phase change memory material with Ga leads to the increase of its crystallization temperature and the improvement of its amorphous stability. In this study, we investigated the effect of GaGe sputtering power on the formation of the phase change memory material including Ga. The deposition rate linearly increased to a maximum of 127 nm and the surface roughness remained uniform as the GaGe sputtering power increased in the range from 0 to 75 W. The Ga concentration in the thin film material abruptly increased at the critical sputtering power of 60 W. This influence of GaGe sputtering power was confirmed to result from a combined sputtering-evaporation process of Ga occurring due to the low melting point of Ga ($29.77^{\circ}C$).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.32-35
• /
• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2005.05a
• /
• pp.441-445
• /
• 2005

In the resent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. But, no detailed researches between the thermo-dynamic property in Nitinol alloy have been done yet. In this study, the thermal property of high temperature Nitinol shape memory alloy were evaluated using differential scanning calorimeter(DSC). The structure property was investigated using X-ray diffraction(XRD). A dynamic mechanical analyzer(DMA) with three point bending mode was used to study storage and loss modulus of shape memory alloy according to the thirteen frequencies in the temperature range between 30 and $200^{\circ}C$. The effects of the temperature heating/cooling rate, the frequency on the damping capacity have been systematically investigated. Such a frequency and temperature changes also influenced significantly to the damping behavior of the shape memory alloy. It was also found that Nitinol exhibited high damping capacity during phase transformation.

• The magazine of the Korean Society for Advanced Composite Structures
• /
• v.4 no.3
• /
• pp.10-16
• /
• 2013

• Proceedings of the KIEE Conference
• /
• 1998.07g
• /
• pp.2512-2514
• /
• 1998

The bending actuator using zigzag type shape memory alloy springs has been fabricated and characterized. The small sized actuator with outer diameter of 3.0mm and inner diameter of 2.0mm could be implemented because zigzag type spring has advantages for thin wall type actuator over the coil type spring. The measured characteristics of the fabricated bending actuator show the possibility of practical application to micro active bending catheter.

• Journal of the Earthquake Engineering Society of Korea
• /
• v.16 no.6
• /
• pp.1-12
• /
• 2012

The researches related to active control systems utilizing superelastic shape memory alloys (SMA) have been recently conducted to reduce critical damage due to lateral deformation after severe earthquakes. Although Superelastic SMAs undergo considerable inelastic deformation, they can return to original conditions without heat treatment only after stress removal. We can expect the mitigation of residual deformation owing to inherent recentering characteristics when these smart materials are installed at the part where large deformation is likely to occur. Therefore, the primary purpose of this research is to develop concentrically braced frames (CBFs) with superelastic SMA bracing systems and to evaluate the seismic performance of such frame structures. In order to investigate the inter-story drift response of CBF structures, 3- and 6-story buildings were design according to current design specifications, and then nonlinear time-history analyses were performed on numerical 2D frame models. Based on the numerical analysis results, it can be comparatively verified that the CBFs with superelastic SMA bracing systems have more structural advantages in terms of energy dissipation and recentering behavior than those with conventional steel bracing systems.