• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1295-1296
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• 2006

수소화된 비정질 실리콘 박막 트랜지스터(a-Si:H TFT)의 이력 현상이 능동형 유기 발광 다이오드(Active-Matrix Organic Light Emitting Diode) 디스플레이 패널을 구동할 경우에, 발생할 수 있는 잔상(Residual Image) 문제를 단위 소자 및 회로에서 실험을 통하여 규명하였다. 게이트 시작 전압을 바꾸어 VGS-ID 특성을 측정할 경우, 게이트 시작 전압이 5V에서 시작한 VGS-ID 곡선이 10V에서 시작한 VGS-ID 곡선에 비해 왼쪽으로 0.15V 이동하였다. 이러한 결과는 게이트 시작 전압의 차이에 의해 발생한 트랩된 전하량(Trapped Charge) 변화로 설명할 수 있다. 또한, 인가하는 게이트 전압 간격을 0.5V에서 0.05V로 감소시켰을 때 전하 디트래핑 비율의 변화(Charge De-trapping Rate)로 인하여, 이력 현상(Hysteresis Phenomenon)으로 인한 단위 소자에서의 문턱전압의 변화가 0.78V에서 0.39V로 감소함을 관찰하였다. 제작된 2-TFT 1-Capacitor의 ANGLED 화소에서 (n-1)번째 프레임에서의 OLED 전류가 (n)번째 프레임에서의 OLED 전류에 35%의 전류오차를 발생시키는 것을 측정 및 분석하였다.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.1-5
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• 2023

In the past, display devices have undergone many changes, such as plasma TVs and LCDs, and have continued to develop. Recently, new display technologies, such as Organic Light Emitting Diode displays and Inorganic Light Emitting Diode displays, have been developed. Among them, Micro LED displays have the potential to improve performance more than LCDs and OLEDs, but a lot of effort and time are needed until the mass production technology (transfer and bonding) of Micro LED displays is developed. We have developed a new Micro LED display light source that can be produced using existing transfer and bonding process technologies to enable faster commercialization of Micro LED in the industry. This light source is TFT deposition on LED. TFT deposition on LED has the advantage of being able to produce displays using existing process technology, making early commercialization of display application products possible. In this study, we applied the Active Driving method to verify the performance of TFT deposition on LED as a display to determine its commercialization potential. Additionally, to facilitate faster application of Micro LED in the industry, we applied TFT deposition on LED to Optical Wireless Communication systems, which are widely used in application service areas such as safety/security and sensors, to verify its communication performance. The experimental results confirmed that TFT deposition on LED is not only capable of AM driving but can also be applied to OWC systems.

• Journal of Power Electronics
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• v.4 no.1
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• pp.46-55
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• 2004

This paper presents a high-frequency ZVS-PWM boost chopper-fed DC-DC converter with a single active auxiliary edge resonant snubber in the load-side which can be designed for power conditioners such as solar photovoltaic generation, fuel cell generation, battery and super capacitor energy storages. Its principle operation in steady-state is described in addition to a prototype setup. The experimental results of ZVS-PWM boost chopper-fed DC-DC converter proposed here, are evaluated and verified with a practical design model in terms of its switching voltage and current waveforms, the switching v-i trajectory, the temperature performance of IGBT module, the actual power conversion efficiency and the EMI of radiated and conducted emissions. And then discussed and compared with the hard switching scheme from an experimental point of view. Finally, this paper proposes a practical method to suppress parasitic oscillation due to the active auxiliary resonant switch at ZCS turn off mode transition with the aid of an additional lossless clamping diode loop, and reduced the EMI conducted emission in this paper.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.265-267
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• 2008

As generally recognized, the driving performance of a SRM at higher speed will be degraded due to the effects of back electromagnetic force (EMF). This phenomenon can be improved via voltage boosting. So in this paper an improved converter of enhancing the performance for four-phase switched reluctance motor (SRM) is proposed. By using one additional capacitor and switches, an extra controllable boosted voltage can be produced during the rise and fall periods of a motor phase current. Then this active boosted voltage can reduce the effect of EMF on the current, particularly at high speeds. The attractive features of the proposed converter are as follows: obtaining boosted voltage to improve performance of SRM with same numbers of switch and diode as asymmetric converter, having higher control flexibility and capability of boosting voltage compared with passive boosting converters, possessing lower cost and simple control in comparison with existing active boosting converters. The performances of the proposed circuit are verified by the simulation and experiment results.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.582-582
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• 2013

Oxide TFT (thin film transistor) active channel layer에 대한 저온 열처리 공정은 투명하고 flexibility을 기반으로하는 display 산업과 AMOLED (active matrix organic light emitting diode) 분야 등 다양한 분야에서 필요로 하는 기술로서 많은 연구가 이루어지고 있다. 과거 active layer는 ALD (atomic layer deposition), CVD (chemical vapor deposition), pulse laser deposition, radio frequency-dc (RF-dc) magnetron sputtering 등과 같은 고가의 진공 장비를 이용하여 증착 되어져 왔으나 현재에는 진공 장비 없이 spin-coating 후 열처리 하는 저가의 공정이 주로 연구되어 지고 있다. Flexible 기판들은 일반적인 OTFT (oxide thin films Transistor)에 적용되는 열처리 온도로 공정 진행시 열에 의한 기판의 손상이 발생한다. Flexible substrate의 열에 의한 기판 손상을 막기 위해 저온 열처리 공정이 연구되고 있지만 기존 열처리와 비교하여 소자의 특성 저하가 동반 되었다. 본 연구에서는 Si 기판위에 SiO2 (100)를 절연층으로 증착하고 그 위에 IZO (indium zinc oxide) solution을 spin-coating 한뒤 $250^{\circ}C$ 이하의 온도에서 열처리하였다. 저온 공정으로 인하여 소자의 특성 저하가 동반 되었으므로 소자의 저하된 특성 복원하고자 post-treatment로 고가의 진공장비가 필요 없고 roll-to roll system 적용이 수월한 remote-type의 APP (atmospheric pressure plasma) 처리를 하였다. Post-treatment로 APP를 이용하여 $250^{\circ}C$ 이하에서 소자에 적용 가능한 on/off ratio를 얻을 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• The Transactions of the Korean Institute of Power Electronics
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• v.19 no.1
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• pp.23-30
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• 2014

This paper proposes a single power-conversion ac-dc converter with a dc-link capacitor-less and high power factor. The proposed converter is derived by integrating a full-bridge diode rectifier and a series-resonant active-clamp dc-dc converter. To obtain a high power factor without a power factor correction circuit, this paper proposes a suitable control algorithm for the proposed converter. The proposed converter provides single power-conversion by using the proposed control algorithm for both power factor correction and output control. Also, the active-clamp circuit clamps the surge voltage of switches and recycles the energy stored in the leakage inductance of the transformer. Moreover, it provides zero-voltage turn-on switching of the switches. Also, a series-resonant circuit of the output-voltage doubler removes the reverse-recovery problem of the output diodes. The proposed converter provides maximum power factor of 0.995 and maximum efficiency of 95.1% at the full-load. The operation principle of the converter is analyzed and verified. Experimental results for a 400W ac-dc converter at a constant switching frequency of 50kHz are obtained to show the performance of the proposed converter.

• Journal of Sensor Science and Technology
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• v.18 no.6
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• pp.475-484
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• 2009

In this paper, an analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure consists of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Proposed CMOS image sensors pixel has been fabricated using 0.5 standard CMOS process. Measured results show that the output signal range is from 0.8 V to 3.8 V. This output signal range increased 125 % compared to conventional 3TR pixel in the condition of 5 V power supply.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.79-86
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• 1994

Gain-guided broad-area single quantum well separate confinement heterostructure diode lasers have been fabricated from structures grown by metal organic vapor phase epitaxy. The active layer of the epi-structure is InGaAs emitting 962-965nm and the guiding layer GaAs. The channel width is fixed to 150${\mu}$m and the cavity length varys within the range of 300~800${\mu}$m. For uncoated LD's, the output power of 0.7W has been obtaained at a pulsed current level of 2A, which results about 60% external quantum efficiency. The threshold current density is 200A/cm$^{2}$ for the cavity lengths of 800.mu.m LD's. The stain effect upon the transparent current density has been observed. The internal quantum efficiency is expected to be 88% and the internal loss to be 18$cm^{-1}$. The beam divergence has been measured to be 7$^{\circ}$to lateral and 40$^{\circ}$to transverse direction. finally, 1.2W continuous-wave output power has been obtained at a current level of 2A for AR/HR coated LD's die-bonded on Cu heat-sink and cooled by TEC.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.729-736
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• 2011

In this paper, we propose a varactor-diodeless voltage-controlled oscillator operating at X-band, and verify the possibility of applying to a receiver for microwave radar signal detection applications. The proposed VCO is realized by only single RF BJT device as a varactor diode is substitued by a intrinsic collector-base PN-junction of the active device which is used to generate negative resistance. The fabricated VCO meets the specification of the receiver, which has a 11.20~11.75 GHz tuning bandwidth with respect to the tuning voltage, 1.0~7.0 V, output power of 9.0~12.0 dBm and linear frequency tuning performance.