• Polymer(Korea)
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• v.38 no.3
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• pp.397-405
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• 2014

To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under $250{\mu}m$) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in $0.1{\mu}m$ thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Journal of Applied Reliability
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• v.9 no.4
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• pp.331-341
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• 2009

PSA (Pressure Sensitive Adhesive) is used for various purposes in electronic appliances such as double-sided tape for fitting parts, product's name plate, and surface protecting film, and so forth. In several kinds of PSAs, this paper dealt with the failure analysis of PET (Polyethylene Terephthalate) acrylic adhesive tapes. The causes of interface failure were investigated through the test of adhesive strength, thickness, and structure. And test standard methods to prevent recurrences were established.

• Polymer(Korea)
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• v.37 no.2
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• pp.184-195
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• 2013

Acrylic pressure sensitive adhesive (PSA) tapes were used for the automotive, the electrical and the electronic industries and the display module junction. In this study, the manufacture of high-strength structural tape used 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC), and UV irradiation for photo-polymerization, and the semi-structural properties of acrylic PSA tape with the AAC content and inorganic filler $SiO_2$ content were investigated. The initial adhesion strength was lowered by the rigidity of molecule chains due to the use of AAC, and the adhesion strength increased with increasing wetting time. The wetability, contact angle, and SEM images of PSA tapes with various contents of AAC were determined. Without filler, the peel strength and dynamic shear strength of PSA tape showed inverse correlation but the peel strength and dynamic shear strength increased with increasing filler content. From these correlations the PSA tapes could be optimized for the applications requiring high performance.

• Polymer(Korea)
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• v.39 no.3
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• pp.514-521
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• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Journal of Convergence for Information Technology
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• v.7 no.4
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• pp.75-81
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• 2017

The design trend of information technology is quickly changed with the times. The design trend of information display is a bezel-less display, recently. The bezel-less display or edge-less display is a new trend of mobile phone display. In this study, the shading tape was manufactured for assembling process of touch panel display with the high screen-to-body ratio so-called bezel-less display. The shading tape was fabricated on PET film with the UV curable acrylic pressure sensitive adhesive(PSA) by roll-to-roll process. The UV curable PSA was synthesized with the eco-friendly toluene-less manufacturing method. The adhesive power of manufactured shading tape was investigated by motorized tensile testing machine. The thixotropic, maintaining property of cutting shape, was characterized by field emission scanning electron microscope. As results, the shading tape exhibits high adhesive power and good thixotropic performance suitable for assembly process of touch panel display. The functional shading tape will be expected to improve productivity of assembly process of touch panel display.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.127-128
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• 2005

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased peel strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.81-87
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• 2011

In this study, UV curing and crosslinking process was introduced for synthesis of acrylic foam tape that can be applied to the the automotive assembly process. Polymerized adhesive are laminated to baseform and varying the thickness of specimens were prepared. To measure basic mechanical properties, stainless steel was used. And in the test peel, dynamic shear and t-block were used. The acrylform adhesive show better results compare with typical adhesive and the properties depand on external factors - thick, wetting time -. To analysis functions of acrylic foam adhesive used to automobile production, evaluate the adhesive properties on the various plastic substrate. In PP and PE are categorized low surface energy materials, their properties have not been expressed. But dynamic shear tests show that some properties could be expressed by the difference break mechanism.

• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.522-528
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• 2023

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.

• Journal of Adhesion and Interface
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• v.5 no.4
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• pp.1-8
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• 2004

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate, acrylic acid and methyl methacrylate by solution polymerization, and trimethylolpropane triacrylate. The PSAs were evaluated by adhesion strength with varying UV dose, and also glass transition temperature ($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased adhesion strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.