• Restorative Dentistry and Endodontics
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• v.34 no.1
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• pp.38-41
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• 2009

When we use the total-etch dentin adhesive system for composite resin restorations, gel or liquid acid etchant such as 37% phosphoric acid is commonly used. Thirty seven percentage phosphoric acid is very powerful erosive agent, and can cause severe harmful effects when it contacts with an oral mucosa and facial skin. This case describes iatrogenic chemical burn on facial skin caused by phosphoric acid which was happened during composite resin restorative procedure. Chemical burn by acid etchant can be evoked by careless handling of remnant and syringe. In order to prevent these iatrogenic injuries, we should check the complete removal of the etching agent both in intra and extra-oral environments after etching and rinsing procedure and it is necessary to use of the rubber dam or isolation instruments. If accidental burn were occurred. immediate wash with copious water. And bring the patient to the dermatologist as soon as possible.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.241-241
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• 2008

Macrofore formation in silicon and other semiconductors using electrochemical etching processes has been, in the last years, a subject of great attention of both theory and practice. Its first reason of concern is new areas of macropore silicone applications arising from microelectromechanical systems processing (MEMS), membrane techniques, solar cells, sensors, photonic crystals, and new technologies like a silicon-on-nothing (SON) technology. Its formation mechanism with a rich variety of controllable microstructures and their many potential applications have been studied extensively recently. Porous silicon is formed by anodic etching of crystalline silicon in hydrofluoric acid. During the etching process holes are required to enable the dissolution of the silicon anode. For p-type silicon, holes are the majority charge carriers, therefore porous silicon can be formed under the action of a positive bias on the silicon anode. For n-type silicon, holes to dissolve silicon is supplied by illuminating n-type silicon with above-band-gap light which allows sufficient generation of holes. To make a desired three-dimensional nano- or micro-structures, pre-structuring the masked surface in KOH solution to form a periodic array of etch pits before electrochemical etching. Due to enhanced electric field, the holes are efficiently collected at the pore tips for etching. The depletion of holes in the space charge region prevents silicon dissolution at the sidewalls, enabling anisotropic etching for the trenches. This is correct theoretical explanation for n-type Si etching. However, there are a few experimental repors in p-type silicon, while a number of theoretical models have been worked out to explain experimental dependence observed. To perform ordered macrofore formaion for p-type silicon, various kinds of mask patterns to make initial KOH etch pits were used. In order to understand the roles played by the kinds of etching solution in the formation of pillar arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, N-dimethylformamide (DMF), iso-propanol, and mixtures of HF with water on the macrofore structure formation on monocrystalline p-type silicon with a resistivity varying between 10 ~ 0.01 $\Omega$ cm. The etching solution including the iso-propanol produced a best three dimensional pillar structures. The experimental results are discussed on the base of Lehmann's comprehensive model based on SCR width.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.7
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• pp.448-451
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• 2014

Anodic aluminum oxides (AAO) fabricated by the two-step anodizing process have attracted much attention for the fabrication of nano template because of pore structure with high aspect ratio, low cost process and ease of fabrication. AAOs are characterized by a homogeneous morphology of parallel pores that grow perpendicular to the template surface with a narrow distribution of diameter, length and inter-pores spacing, all of which can be easily controlled by suitably choosing of the anodizing parameters such as pH of the electrolyte, anodizing voltage and duration of anodizing. In this study, AAO templates were characterized by X-ray diffraction and field-emission scanning electron microscope (FE-SEM). The dependence of the pore size change according to the amount of addition of phosphoric acid, which was used to remove the initial alumina oxide layer, was not observed.

• Journal of Oral Medicine and Pain
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• v.30 no.2
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• pp.269-276
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• 2005

This in vitro study evaluated the influence of a flowable composite resin on the tensile bond strength of resin to enamel and dentin treated with Er:YAG laser and diamond bur. 96 Buccal enamel and mid-coronal dentin were laser-irradiated using an Er:YAG laser and treated with diamond bur. Each groups(48) were divided two small groups depends on acid-etching procedure. Light-cure flowable resin(Metafil Flo) and self-cure resin(Clearfil FII New Bond) were used in this study. After surface etching with 37% phosphoric acid and the application of an adhesive system, specimens were prepared with a hybrid composite resin. After 24hours storage in distilled water at 37$^{\circ}C$, all samples were submitted to the tensile bond strength evaluation, using a universal testing machine(Z020, Zwick, Germany). The obtained results were as follows: 1. TBS of acid-etching group were higher than those of non-etching group in both enamel and dentin treated with Er:YAG laser and diamond bur. Laser 'conditioning' was clearly less effective than acid-etching. Moreover, acid etching lased enamel and dentin significantly improved the microTBS of M-Flo. 2. In enamel, TBS of laser-irradiated group were lower than those of bur-prepared group. However, in flowable resin subgroup, there were not differed those between two groups in dentin. 3. In laser-treated group, TBS of flowable composite resin were higher than those of self-curing resin in dentin, however, there was no difference in enamel. From this study, we can conclude that the self- and light-cure composite resin bonded significantly less effective to lased than to bur-cut enamel and dentin, and that acid-etch procedure remains mandatory even after laser ablation. We suggest that Er:YAG laser was useful for preparing dentin cavity with flowable resin filling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.709-713
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• 2004

Characteristics of laser-assisted wet etching of titanium in phosphoric acid were investigated to examine the feasibility of this method for fabrication of high aspect ratio microchannels. Laser power, number of scans, etchant concentration, position of beam waist and scanning speed were taken into consideration as the major process parameters exerting the temperature distribution and the cross sectional profile of etched channels. Experimental results indicated that laser power influences on both etch width and depth while number of scans and scanning speed mainly affect on the etch depth. At a low etchant concentration, the cross sectional profile of an etched channel becomes a U-shape but it gradually turns into a V-shape as the concentration increases. On the other hand, surface of the laser beam focus with respect to the sample surface is found to be a key factor determining the bubble dynamics and thus the process stability. It is demonstrated that metallic microchannels with different cross sectional profiles can be fabricated by properly controlling the process parameters. Microchannels of aspect ratio up to 8 with the width and depth ranges of 8∼32 m and 50∼300 m, respectively, were fabricated.

• Journal of the Korean Ceramic Society
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• v.41 no.7
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• pp.493-496
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• 2004

The chemical etching of sapphire substrates was peformed to produce smooth surfaces on an atomic scale. The sapphire sur-face etched by using a $H_2$S $O_4$ solution showed a pit-free morphology and was yen smooth as much as $\sigma$$_{rms}$=0.13 nm, that etched by using a mixture of $H_2$S $O_4$ and $H_3$P $O_4$ contained large pits with $\sigma$$_{rms}$=0.34 nm. The $\sigma$$_{rms}$’s and the number of the pits increased with increasing etching temperature. The sapphire etched by using $H_2$S $O_4$ at 32$0^{\circ}C$ had the best surface. These results provide important information on the effects of etching treatment on the structural properties of sapphire for the growth of high-quality epilayers.ayers.

• Korean Journal of Metals and Materials
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• v.46 no.12
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• pp.835-840
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• 2008

Texturing for crystalline silicon solar cells is one of the important techniques to increase conversion efficiency by effective photon trapping. Generally, incoming wafers or alkali etched wafers are used for texturing. From this conventional etching process, $7{\sim}10{\mu}m$-sized random pyramids are formed. In this study, acid etching for removal of saw damages was practiced before texturing. This improved the resulting surface morphology, which consisted of $2{\sim}4{\mu}m$-sized pyramids. Because these pyramids covered the surface much more extensively, we obtained reduction of optical losses on the surface. In order to compare with conventional texturing, FE-SEM is used for observing surface morphology and reflectance data is analyzed by UV-VIS spectrophotometer.

• Korean Journal of Materials Research
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• v.28 no.12
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• pp.709-713
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• 2018

To improve the etch rate of $Si_3N_4$ thin film, $H_2SiF_6$ is added to increase etching rate by more than two times. $SiO_3H_2$ is gradually added to obtain a selectivity of 170: 1 at 600 ppm. Moreover, when $SiO_3H_2$ is added, the etching rate of the $SiO_2$ thin film increases in proportion to the radius of the wafer. In $Si_3N_4$ thin film, there is no difference in the etching rate according to the position. However, in the $SiO_2$ thin film, the etching rate increases in proportion to the radius. At the center of the wafer, the re-growth phenomenon is confirmed at a specific concentration or above. The difference in etch rates of $SiO_2$ thin films and the reason for regrowth at these positions are interpreted as the result of the flow rate of the chemical solution replaced with fresh solution.

• Tribology and Lubricants
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• v.39 no.6
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• pp.244-249
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• 2023

This paper presents a comprehensive analysis of the impact of surface roughness on the friction and wear properties of SUS 321, an austenitic stainless steel variant produced using the laser powder bed fusion (LPBF) technique, which is a prevalent additive manufacturing method. After the LPBF fabrication, the specimens go a heat treatment process aimed at alleviating residual stress. Subsequently, they are polished extensively to achieve a refined and smooth surface. To deliberately introduce controlled variations in surface roughness, an etching process is employed. This multi-step method encompassed primary etching in a 3M hydrochloric acid solution, followed by secondary etching in a 35 wt% ferric chloride solution, with varying durations applied to different specimens. A comprehensive evaluation of the surface characteristics ensued, employing precise techniques such as surface roughness measurements and meticulous assessments of water droplet contact angles. Following the surface treatment procedures, a series of friction tests are performed to explore the tribological behavior of the etched specimens. This in-depth investigation reached its peak by revealing valuable insights. It clarified a strong correlation between intentionally altered surface roughness, achieved through etching processes, and the resulting tribological performance of LPBF-fabricated SUS 321 stainless steel. This significantly advances our grasp of material behavior in tribological applications.

• Journal of the korean academy of Pediatric Dentistry
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• v.35 no.4
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• pp.692-699
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• 2008

The purpose of this study was to evaluate the effect of surface treatment on the shear bond strength between new and old composite resin. The prepared resin specimens were separated 6 groups, and each group then received a different surface treatment. Then the repair material was added. Shear bond strengths for repair were measured after 7 days and the results were analyzed by using one way ANOVA. The results were as follows; 1. Group 3, 4(air abrasion) showed significantly higher shear bond strength than Group 1(phosphoric acid)(p<0.05). Group 5, 6(diamond bur) showed higher bond strength than Group 1(phosphoric acid) but not significantly different( p>0.05). 2. Group 2(self-etching adhesive) showed lower shear bond strength than Group 1(phosphoric acid) but not significantly different(p>0.05). 3. There was no statistically significant difference between Group 3(air abrasion) and Group 4(air abrasion+etching). 4. There was no statistically significant difference between Group 5(diamond bur) and Group 6(diamond bur+etching). In conclusion, the surface treatment with air abrasion resulted in higher repair bond strength than other methods. Repair bond strength was not significantly affected by acid etching.