• Title/Summary/Keyword: Acid Cleaning

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Evaluation of membrane fouling characteristics due to manganese and chemical cleaning efficiency in microfiltration membrane process (막여과 정수처리공정에서 망간에 의한 막오염 특성 및 화학세정효율 평가)

  • Kang, Joon-Seok;Park, Seogyeong;Song, Jiyoung;Jeong, Ahyoung;Lee, Jeong-Jun;Kim, Han-Seung
    • Journal of Korean Society of Water and Wastewater
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    • v.31 no.6
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    • pp.539-549
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    • 2017
  • In water treatment process using microfiltration membranes, manganese is a substance that causes inorganic membrane fouling. As a result of analysis on the operation data taken from I WTP(Water Treatment Plant), it was confirmed that the increase of TMP was very severe during the period of manganese inflow. The membrane fouling fastened the increase of TMP and shortened the service time of filtration or the cleaning cycle. The TMP of the membrane increased to the maximum of $2.13kgf/cm^2$, but it was recovered to the initial level ($0.17kgf/cm^2$) by the 1st acid cleaning step. It was obvious that the main membrane fouling contaminants are due to inorganic substances. As a result of the analysis on the chemical waste, the concentrations of aluminum(146-164 mg/L) and manganese(110-126 mg/L) were very high. It is considered that aluminum was due to the residual unreacted during coagulation step as a pretreatment process. And manganese is thought to be due to the adsorption on the membrane surface as an adsorbate in feed water component during filtration step. For the efficient maintenance of the membrane filtration facilities, optimization of chemical concentration and CIP conditions is very important when finding the abnormal level of influent including foulants such as manganese.

Simultaneous Removal Characteristics of Particulate and Elemental Mercury in Convergence Particulate Collector (융합형여과집진장치에서의 먼지입자와 원소수은의 제거 성능 특성)

  • Park, Young Ok;Jeong, Ju Yeong
    • Particle and aerosol research
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    • v.6 no.4
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    • pp.173-183
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    • 2010
  • The high temperature pleated filter bags which were used during this study were made of pleated nonwoven fabric of heat and acid resistant polysulfonate fibers which can withstand the heat up to $300^{\circ}C$ and have a filtration area which is 3 to 5 times larger than the conventional round filter bags. Cartridge module packed with 3 kind of the sulfur impregnated activated-carbon based sorbents were inserted in the inner of the pleated filter bag. This type of pleated filter bag was designed to remove not only the particulate matter but also the gaseous elemental mercury. The electrostatic precipitator part can enhance the particulate removal efficiency and reduce the pressure drop of the pleated filter bag by agglomerated particles to form a more porous dust layer on the surface of the pleated bag which is increased the filter bag cleaning efficiency. In addition, the most of particles are separated from the flue gas stream through the cyclone and the electrostatic precipitator part which were installed at the lower part and main body part of the convergence particulate collector, respectively. Thus reduce particulate loading of the high temperature pleated filter bags were applied in this study to analyze the removal characteristics of particulate matter and gaseous elemental mercury.

Effect of O2 Plasma Treatment on the Surface Morphology and Characteristics of Poly (imide) to Develop Self-cleaning Industrial Materials (자기세정산업용 소재 개발을 위한 O2 플라즈마 처리가 Poly(imide) 필름의 표면 형태 및 특성에 미치는 영향)

  • Kang, In-Sook
    • Journal of the Korean Society of Clothing and Textiles
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    • v.36 no.10
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    • pp.1117-1124
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    • 2012
  • This study was a preliminary study to investigate the influence of surface morphology and characteristics on the self-cleaning of substrates. PI film was treated by $O_2$ plasma to modify the surface; in addition, AFM and Fe-SEM were employed to examine the morphological changes induced on a PI film treated by $O_2$ plasma and surface energies calculated from measured contact angles between several solutions and PI film based on the geometric mean and a Lewis acid base method. The surface roughness of PI film treated by $O_2$ plasma increased with the duration of the $O_2$ plasma on PI film due to the increased surface etching. The contact angle of film treated by $O_2$ plasma decreased with the increased treatment time in water and surfactant solution; in addition, the surface energy increased with the increased treatment times largely attributed to the increased portion on the polar surface energy of PI film. The coefficient of the correlation between surface roughness and surface polarity such as contact angle and surface energy was below 0.35; however, it was over 0.99 for the contact angle and surface energy.

Novel Environmentally Benign and Low-Cost Pd-free Electroless Plating Method Using Ag Nanosol as an Activator

  • Kim, Jun Hong;Oh, Joo Young;Song, Shin Ae;Kim, Kiyoung;Lim, Sung Nam
    • Journal of Electrochemical Science and Technology
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    • v.8 no.3
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    • pp.215-221
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    • 2017
  • The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

Development of the DIW-$O_3$ Cleaning Technology Substituted for the Semiconductor Photoresist Strip Process using the SPM (SPM을 이용한 반도체 포토레지스트 제거 공정 대체를 위한 DIW-$O_3$ 방식 세정기술 개발)

  • Son, Yeong-Su;Ham, Sang-Yong
    • 연구논문집
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    • s.33
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    • pp.99-109
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    • 2003
  • Recently the utilization of the ozone dissolved de-ionized water(DIW-$O_3$) in semiconductor wet cleaning process and photoresist stripping process to replace the conventional sulfuric acid and hydro peroxide mixture(SPM) method has been studied. In this paper, we propose the water-electrode type ozone generator which has the characteristics of the high concentration and purity to produce the high concentration DIW-$O_3$ for the photoresist strip process in the semiconductor fabrication. The proposed ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. Through this study, we obtained the results of the 10.3 wt% of ozone gas concentration at the oxygen gas of 0.5 [liter/min.] and the DIW-$O_3$ concentration of 79.5 ppm.. Through the photoresist stripping test using the produced DIW-$O_3$, we confirmed that the photoresist coated on the silicon wafer was removed effectively in the 12 minutes.

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A Submerged Membrane Bioreactor with Anoxic-oxic Recycle for the Treatment of High-strength Nitrogen Wastewater

  • Shim, Jin-Kie;Yoo, Ik-Keun;Lee, Young-Moo
    • Korean Membrane Journal
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    • v.3 no.1
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    • pp.32-38
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    • 2001
  • Using the hollow fiber membrane module in a lab-scale membrane bioreactor, the anoxic- oxic (AO) process for nitrogen removal was operated for about one year. For the influent wastewater containing 1,200-1,400 mg $1^{-1}$ of CODcr and 200-310 mg $1^{-1}$ of nitrogen, this process achieved a high quality effluent of less than 30 mgCOD $liter^{-1}$ and 50 mgN $liter^{-1}$. The removal rate of organics was above 98% at a loading rate larger than 2.5 kgCOD $m^{-3}$$d^{-1}$. When the internal recycle from the oxic to the anoxic reactor changed room 2n to 600% rout the influent flow rate, the nitrogen removal rate increased from about 70 to 90% at a loading rate of 0.4 kgT-N m-s d-1. The initial increase of transmembrane pressure (TMP) was observed after a 4-month operation while maintaining the flux and MLSS concentration at 7-9 1 $m^2$ $h^{-1}$ and 6,000-14,000 mg $1^{-1}$, respectively. The TMP could be maintained below 15 cmHg for an 8-month operation. The chemical cleaning with an acid followed by an immersion in an alkali solution gave better cleaning result with the membrane operated for 10 month rather than that only by an alkali immersion.

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Effect of coagulation conditions on ultrafiltration for wastewater effluent

  • Maeng, Sung Kyu;Timmes, Thomas C.;Kim, Hyun-Chul
    • Membrane and Water Treatment
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    • v.8 no.2
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    • pp.185-199
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    • 2017
  • Low-pressure membrane filtration is increasingly used for tertiary treatment of wastewater effluent organic matter (EfOM), mainly comprising organic base/neutral compounds. In-line coagulation with underdosing, charge neutralization, and sweep floc conditions prior to ultrafiltration (UF) was studied to determine removals of the EfOM components and consequent reduction of fouling using polyethersulfone membranes. Coagulation and UF substantially reduced fouling for all coagulation conditions while removing from 7 to 38% of EfOM organic acids. From 7 to 16% of EfOM organic base/neutrals were removed at neutral pH but there was no significant removal for slightly acid coagulation conditions even though fouling was substantially reduced. Sweep floc produced the lowest resistance to filtration but may be inappropriate for in-line use due to the large added volume of solids. Charge-neutralization resulted in poor recovery of the initial flux with hydraulic cleaning. Under-dosing paralleled sweep floc in reducing hydraulic resistance to filtration (for sub-critical flux) and the initial flux was also easily recovered with hydraulic cleaning. Hydrophobic and hydrophilic base/neutrals were identified on the fouled membranes but as previously reported the extent of fouling was not correlated with accumulation of organic base/neutrals.

Development of a Sunscreen Stick Formulation which is Water Resistant but Easily Washable

  • Choi, Minsung;Song, Seungjin;Kang, Nae-Gyu
    • Korea Journal of Cosmetic Science
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    • v.2 no.1
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    • pp.21-31
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    • 2020
  • The aim of this study is to develop a sunscreen stick formulation technology with excellent water resistance and washability. Consumers' needs for sunscreen products are diversifying. Water resistance and ease of washing are both important factors in sunscreen products. However, it is difficult to develop a sunscreen formulation that satisfies these two factors at the same time, because these two elements are in conflict. Fatty acid has a hydrophobic property against the water with low or neutral pH, but when it contacts with soapy water which has high pH, saponification occurs and the fatty acids become surfactants and can be dispersed in the water. Using the reaction characteristics of fatty acids, we can make sunscreen that is highly resistant to water or sweat, but is only selectively removed from soapy water. We found that the sunscreen stick containing fatty acids had better water resistance and washability than the sunscreen sticks without fatty acid. The sunscreen stick containing fatty acids showed a tendency to improve water resistance by scattering ultraviolet rays of long wavelength area by forming insoluble precipitation with divalent ions in tap water after immersion. In addition, an increase in the fatty acid content tended to also increase the ease of cleaning the sunscreen stick. Solid fatty acid was advantageous in improving water resistance than liquid fatty acid, but there was no difference between solid fatty acids and liquid fatty acid in washability. When it comes to stability, the sunscreen stick using liquid fatty acids maintained a high hardness and melting point, and showed no sweating. Based on this study, it is possible to develop an easy washable sunscreen stick formulation technology that has excellent water resistance but is selectively removed only in soapy water.

Effect of Cosurfactant on Microemulsion Formation and Cleaning Efficiency in Systems Containing Alkyl Ethoxylates Nonionic Surfactant, D-Limonene and Water (보조계면활성제 첨가가 Alkyl Ethoxylates계 비이온 계면활성제, D-limonene, 물로 이루어진 시스템에서의 마이크로에멀젼 형성 및 세정력에 미치는 효과)

  • Lee, Jong Gi;Bae, Sang Soo;Cho, In Sik;Park, So Jin;Park, Byeong Deog;Park, Sang Kwon;Lim, Jong Choo
    • Applied Chemistry for Engineering
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    • v.16 no.5
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    • pp.664-671
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    • 2005
  • In this study, the effect of sosurfactant on microemulsion phase behavior was investigated in ternary systems containing alkyl ethoxylates nonionic surfactant, water and d-limonene. The addition of a cosurfactant produced a microemulsion phase over a wide range of temperature and promoted formation of a microemulsion phase at lower temperatures. In particular, small amounts of n-propanol, as a cosurfactant, were found to be the most effective in extending a microemulsion phase region over a wide range of temperature. Temperature sensitivity of a nonionic surfactant system was effectively relieved by addition of the anionic surfactant sodium dodecyl sulfate. And the formation of one phase microemulsion was not affected by pH, hardness concentration and addition of an antioxidation agent. The cleaner candidates were determined from microemulsion phase behavior study, and their cleaning efficiency was tested using a dipping method. All the cleaner candidates selected during this study showed excellent removal efficiency for abietic acid over a temperature range from 30 to $40^{\circ}C$ presumably due to a decrease in interfacial tension.

Dyeing Properties on Polylactic Acid (PLA) Fabrics by Disperse Dyes (분산염료에 의한 PLA 직물의 염색성)

  • Lee, So Hee;Song, Wha Soon
    • Journal of the Korean Society of Clothing and Textiles
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    • v.37 no.7
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    • pp.952-961
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    • 2013
  • This study optimizes a suitable dyeing method for polylactic acid (PLA) fabrics using disperse dyes. For this, disperse red 60 (DR 60), disperse blue 56 (DB 56), and disperse yellow 54 (DY 54) were used and dyed on PLA fabrics dependent of dyeing temperature and time. The fastness of PLA fabrics dyed with three disperse dyes were evaluated; in addition, dye exhaustion, color strength (K/S value), and colorimetric properties of PLA fabrics were compared with PET fabrics. The experiments indicated optimum dyeability of PLA fabrics with disperse dyes. The dyeing temperature was $90^{\circ}C$ for every dye and the dyeing time were 20 min, 60 min, and 40 min for DR 60, DB 56, DY 54, respectively. PLA fabrics had good color fastness to washing, dry cleaning fastness, hot pressing fastness, rub fastness, and perspiration fastness by DR 60, DB 56, and DY 54. The dye exhaustion of PLA fabrics were lower than PET fabrics; however, K/S values were higher than PET fabrics.