• 한국세라믹학회지
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• 제40권11호
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• pp.1067-1072
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• 2003

Zn-Pr-Co-Cr-Dy 산화물계로 구성된 바리스터 세라믹스의 전기적 안정성을 몇 가지 DC 가속열화 스트레스 조건하에서 0.0∼2.0 mol% Dy$_2$O$_3$ 첨가량의 변화에 따라 조사하였다. 바리스터 세라믹스의 밀도는 Dy$_2$O$_3$ 첨가량이 0.5 mol%까지 증가하였으며, 보다 많이 첨가하면 감소하는 것으로 나타났다. 밀도는 전도경로와 밀접한 관계로 인해서 안정성에 큰 영향을 미치는 것으로 나타났다. Dy$_2$O$_3$ 첨가는 바리스터 세라믹스의 비직선 지수를 45 이상, 누설전류를 대략 1.0 $\mu$A 이하로 비직선성을 크게 개선시켰다. DC 스트레스 조건 0.95 V$_{1mA}$/15$0^{\circ}C$/24 h에서 안정성을 조사한 결과, 0.5 mol% 첨가시 상대적으로 가장 높은 안정성을 나타내었다. 전압-전류특성에 있어서 바리스터 전압, 비직선 지수, 누설전류의 변화율은 각각 -0.9%, -14.4%, +483.3%이었으며, 유전특성에 있어서 비유전율 및 손실계수의 변화는 각각 +7.1%, +315.4%이었다. 그 외의 바리스터 세라믹스는 낮은 밀도 때문에 열폭주 현상을 나타내는 매우 불안정한 특성을 나타내었다.다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Elastomers and Composites
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• 제47권3호
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• pp.254-258
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• 2012

자동차 엔진 개스킷용 아크릴 고무(ACM)의 재료 특성과 수명 예측에 관하여 연구하였다. 클로린 가교사이트를 포함하는 ACM (Chlorine Cure-Site ACM)과 카르복실기 가교사이트를 포함하는 ACM (Carboxyl Cure-Site ACM)을 이용하여 최적상태의 배합물을 제작하여 특성을 살펴보았다. 엔진용 개스킷의 주요한 특성인 열과, 엔진오일에서의 압축영구줄음율을 시험 평가한 결과 Carboxyl Cure-Site ACM 배합물이 상대적으로 더 우수한 것으로 나타났다. Carboxyl Cure-Site ACM 고무 재료에 대한 수명을 예측하기 위해 가속열노화시험을 수행하여 시간-온도 환산식인 아레니우스(Arrhenius) 관계식을 구하였다.

• Tribology and Lubricants
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• 제35권4호
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• pp.222-228
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• 2019

As rubber products such as O-rings, which are also known as packings or toric joints, come in regular, long term contact with liquid fuel, they can eventually swell, become mechanically weakened, and occasionally crack; this diminishes both their usefulness and intrinsic lifetime and could cause leaks during the steady-state flow condition of the fuel. In this study, we evaluate the lifetime of such products through compression set tests of FKM, a family of fluorocarbon elastomer materials defined by the ASTM international standard D141; these materials have great compression, sunlight, and ozone resistance as well as a low gas absorption rate. In this process, O-rings are immersed in the liquid fuel of airtight containers that can be expressed as a compression set, and the liquid fuel leakage in a flow rig tester at variable temperatures over 12 months is investigated. Using the Power Law model, our study determined a theoretical O-ring lifetime of 2,647 years, i.e. a semi-permanent lifespan, by confirming the absence of liquid fuel leakage around the O-ring assembled fittings. These results indicate that the FKM O-rings are significantly compatible for fuel tests to evaluate long-term sealing conditions.