• 품질경영학회지
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• 제28권4호
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• pp.16-28
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• 2000

Recently days, High Accelerated Life Test of electrical and electronic parts is increasing its importance. This study set the hypothesis to develop the method that was analysis and application of HALT for the automotive electrical and electronic parts, it used Arrhenius's Model and Eyring's Model, and ESS theory. Validity of application is proved by other test data. Especially, this study emphasis on utility of acceleration to temperature, humidity, voltage, mechanical stress and other stress. In this study set the pattem of practical application. Therefore, this study emphasis on the application of the HALT and the use of other parameter by acceleration reliability test data. The result of this study is as follows. 1) There is relationship between molar weight and material constant. 2) Characteristic of material is operating acceleration factor as well as parts failure factors. Of course, according to the characteristic of material, activation energy is often more important than molar weight. But it will be defined by more testing and improvements in practical application.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.119-122
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• 2000

Recently polymer insulators are being used for outdoor high voltage applications. Polymer insulators for transmission line have significant advantages over porcelain and glass insulators, especially for ultra-high voltage transmission lines. Their advantages are light weight, vandalism resistance and hydrophobicity. Polymer insulators are a relatively new technology, but their expected life is still unknown. Therefore these estimating technique are very important. Their life time is related to weathering and operating condition. Multi-aging test is requested because aging factor is occurred by multi-aging than unique aging. The aging test about polymer insulators have mainly carried out by IEC 61109. This paper presents multi-stress chamber experiments and tracking wheel test to examine the tracking and erosion performance of polymer insulator for transmission. Multi-stress testing is able to demonstrate deficiencies of polymer insulator materials and designs, including the nature of interfaces in insulation design. We have investigated IEC 61109 Annex C (5000h aging test) and CEA tracking wheel test as test methods of artificial accelerated aging. The aging degree of polymer insulator is estimated by leakage current, measurement of hydrophobicity degree, damage conditions of insulator surface, withstand voltage test etc.

• 드라이브 ㆍ 컨트롤
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• 제15권4호
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• pp.48-54
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• 2018

The hydraulic servo actuator has always operated very precisely with high frequency and small displacement, and is used continuously for a long time. The hydraulic servo actuator of the test equipment used in the accelerated life test in order to guarantee the service life of the automotive parts failed earlier than the products before finishing the test. This study performed an analysis on the cause of the failure of the hydraulic servo actuator used in the test equipment, changed the design of the actuator to solve the root cause of the main failure mode, and developed the improved servo actuator. Based on above process, this study established a better performances and longer lifetime of the servo actuator after testing.

• 대한기계학회논문집 C: 기술과 교육
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• 제1권1호
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• pp.115-121
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• 2013

최근 플랜트산업분야에서는 발전설비와 해양 플랜트 및 선박, 교량 건설등 핵심 구조물들에 대한 내구성 향상 및 평가를 위한 기술이 크게 확장 적용될 것으로 본다. 이에 본 연구에서는 초음파 탄성진동에너지를 이용한 초음파 나노표면개질(Ultrasonic Nanocrystalline Surface Modification) 기술과 초음파 피로시험(Ultrasonic Fatigue Test)기술을 통해서 현재까지 국내산업분야에서 활발하게 진행중인 적용사례를 분석하고자 하였으며. 플랜트분야 특히 발전설비와 해양선박 플랜트 및 교량 건설구조물들의 핵심 용접부에 대한 내구성 향상을 위해 크게 확장 적용될 수 있는 새로운 응용기술 연구방향에 대한 방법들을 제시하고자 한다.

• 한국농공학회논문집
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• 제59권5호
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• pp.73-81
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• 2017

The improved movable weir supplements the advantages and disadvantages of the rubber weir and the conduction gate. It consists of a stainless steel gate, air bags, and a steel clamping plate. The stainless steel gate is the main body of the weir, and the inflatable rubber sheet serves to support the steel gate. The steel clamping plate is typically in direct continuous contact with water, but this leads to corrosion issues that can reduce the life of the entire movable weir. In this study, a panel-type glass-fiber-reinforced polymer (GFRP) clamping plate was designed and fabricated. The test results showed that the flexural load of the panel-type GFRP composite clamping plate was over twice that of the wings type GFRP clamping plate. The lowest moisture absorption value was obtained upon exposure to tap water, and exposure to other solutions showed similar values. Additionally, flexural load testing after exposure to an accelerated environment found the lowest residual loads of 80.51 % and 78.50 % at 50 and 100 days, respectively, for exposure to a $CaCl_2$ solution, while exposure to other environments showed residual failure loads of over 80 % at both 50 and 100 days.

• Corrosion Science and Technology
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• 제8권3호
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• pp.116-118
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• 2009

Korea Institute of Construction Materials founded Seosan Outdoor Exposure Test Site 2005 at Korea, which is a part of Worldwide Exposure Network (WEN). To evaluate the test site along with other exposure test sites, three different types of paints have been under real time weathering conditions at three major weathering test facilities around the world. Using these test specimens several spectroscopic experiments along with physical tests have been performed. Also acceleration tests have been performed using the same paints. The correlation of weathered paints among three different test facilities and accelerated test results has been compared. From the results the reliability of Seosan Weathering Test Facility and reasonable life time prediction tests are discussed.

• Corrosion Science and Technology
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• 제22권3호
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• pp.153-163
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• 2023

Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 비파괴검사학회지
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• 제21권6호
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• pp.618-629
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• 2001

본 논문은 고압 커패시터의 고장분석과 신뢰성 예측 결과를 다루고 있다. 부품의 수명과 고장률을 예측하기 위해서 두 가지 방법으로 고장 모드와 고장 메커니즘을 연구하였다 에폭시 수지로 성형된 고압 커패시터가 절연내압 시험 하에서 저항이 제로로 되는 고장에 대하여, 근본원인 고장분석 체계를 효과적으로 수립함으로써 고장 메커니즘의 원인을 분석하였다. 특히 세라믹-에폭시 계면에서의 절연파괴 고장 현상이 강조되었으며, 본 연구에서 얻어진 결과의 타당성은 마그네트론에 장착된 고압 커패시터의 열사이클 시험 수행에 의한 가속시험 결과로부터 입증되었다. 시험 결과들은 결함이 있는 로트를 신속히 규명하고 $B_{10}$ 수명을 결정하는데 유용하게 사용할 수 있다. 또한, 유전체의 절연파괴에 대해서 부하-강도 간섭모델을 이용하여 고장률을 예측하였다.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.424-429
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• 2018

본 연구에서는 플랜트 설비 부품류 중 충격에 취약한 신축관 이음을 대상으로 수충격 발생 시 신축관 이음의 신축량을 유압식 액추에이터의 작동데이터로 적용하여 진동내구 시험을 수행하였다. 진동내구 시험 시 내구수명의 가속 요소로 신축관 내부의 온도상태를 가정하고 온도상태를 $30^{\circ}C$부터 $50^{\circ}C$ 및 $65^{\circ}C$로 가속화한 진동내구 시험을 진행하였다. 각 조건별 온도상태별 수명데이터들은 아레니우스 모델식을 따른다고 가정하고 각 수명데이터를 선형화하여 선형식의 상수값과 활성화 에너지 계수를 유도하였다. 또한 유도된 모델식으로부터 $85^{\circ}C$ 경우의 예측 수명과 $85^{\circ}C$ 온도상태에서의 시험 수명결과와 비교를 통해 작은 편차 범위내에서 유도된 모델식의 유효성을 검증하였다. 한편, 시험 중과 시험 후 발견된 신축관의 고장모드에서는 누수 및 벨로우즈 부 내부 슬리부의 이탈과 내부변형 등을 확인할 수 있었다. 향후 본 연구는 진동내구 수명의 가속요인인 온도상태 외 압력상태 등 다양한 수명변수를 적용한 복합수명예측 모델식을 개발하고 검증할 예정이다.